JPH01215461A - Method for soldering electronic parts onto board - Google Patents
Method for soldering electronic parts onto boardInfo
- Publication number
- JPH01215461A JPH01215461A JP3755088A JP3755088A JPH01215461A JP H01215461 A JPH01215461 A JP H01215461A JP 3755088 A JP3755088 A JP 3755088A JP 3755088 A JP3755088 A JP 3755088A JP H01215461 A JPH01215461 A JP H01215461A
- Authority
- JP
- Japan
- Prior art keywords
- jack
- cover
- board
- soldering
- protective cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 17
- 230000001681 protective effect Effects 0.000 claims description 34
- 238000010521 absorption reaction Methods 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- 230000005855 radiation Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- -1 stainless steel Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、表面実装の基板への電子部品の半田付は方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a method for soldering electronic components to a surface-mounted substrate.
（従来の技術）
従来、基板への電子部品の半田付は方法として、安価な
赤外線照射によるものが最も多く採用されている。しか
し特に近赤外線を使用する方法では、当該電子部品の色
彩による熱吸収率の差が大きいことが知られており、電
子部品が過熱状態にならないように熱吸収率の低い白色
系の色彩を有する材料で当該電子部品を成形するか、又
は最近では耐熱温度の特に高いエンジニアリングプラス
チックスが出現しこのような耐熱性の高い材料で電子部
品を成形している。(Prior Art) Conventionally, the most commonly used method for soldering electronic components to a board is to use inexpensive infrared irradiation. However, especially in methods that use near-infrared rays, it is known that there is a large difference in heat absorption rate depending on the color of the electronic component, and in order to prevent the electronic component from overheating, a white color with a low heat absorption rate is used. The electronic parts are molded using materials, or recently, engineering plastics with particularly high heat resistance have appeared, and electronic parts are molded using such materials with high heat resistance.
（発明が解決しようとする課題）
上記従来の場合、熱吸収率の低い白色系の色彩を有する
材料で電子部品を成形する方法では、材料が白色系の色
彩に限定されるので、外観が比較的重要視される例えば
黒色系の色彩とする必要のある電子部品には採用できず
、そのようなときに耐熱性の高い材料を使用せざるをえ
ないという問題点があり、また、耐熱性の特に高い合成
樹脂等で電子部品を成形する方法では、耐熱性の高い材
料はど高価になりコスト高になるという問題点があった
。(Problems to be Solved by the Invention) In the conventional method described above, in which electronic components are molded using a white-colored material with a low heat absorption rate, the material is limited to a white color, so the appearance is not comparable. For example, it cannot be used for electronic parts that need to be colored black, which is considered important, and there is a problem that materials with high heat resistance must be used in such cases. In the method of molding electronic parts using synthetic resin, etc., which has a particularly high heat resistance, there is a problem in that the material with high heat resistance is expensive, resulting in high costs.
本発明は、かかる従来の問題点にかんがみ、電子部品の
使用材料の色彩を限定されることがなく。In view of such conventional problems, the present invention is not limited to the color of materials used for electronic components.
しかもコストの低い電子部品の半田付は方法を提供する
ことを目的とするものである。Moreover, it is an object of the present invention to provide a low-cost method for soldering electronic components.
（ａ題を解決するための手段）
上記目的を達成するために、本発明は、熱吸収率の低い
材料からなり外側から照射される赤外線を遮蔽する保護
カバーを使用し、電子部品の外面を覆って該保護カバー
を着脱可能に該電子部品に装着固定した状態で赤外線を
照射し、該電子部品を基板上の所定位置に半田付けした
後に、前記保護カバーを取り外すことを特徴とする基板
への電子部品の半田付は方法を要旨とするものである。(Means for Solving Problem a) In order to achieve the above object, the present invention uses a protective cover made of a material with low heat absorption rate and shields infrared rays irradiated from the outside, and protects the outer surface of the electronic component. irradiating the board with infrared rays while the protective cover is removably attached and fixed to the electronic component, and the electronic component is soldered to a predetermined position on the board, and then the protective cover is removed. The gist of this article is how to solder electronic components.
（作用）
本発明に係る電子部品の半田付は方法は、熱吸収率の低
い材料からなり、外側から照射される赤外線を遮蔽する
保護カバーを使用し、電子部品の外面を覆って該保護カ
バーを着脱可能に該電子部品に装着固定した状態で赤外
線を照射し、該電子部品を赤外線の照射による熱から保
護しつつ基板上の所定位置に半田付けした後に、前記保
護カバーを取り外し、当該電子部品の色彩の制限を受け
ず低コストで基板への電子部品の半田付けを行える。(Function) The method of soldering electronic components according to the present invention is to use a protective cover made of a material with low heat absorption rate and which blocks infrared rays irradiated from the outside, and to cover the outer surface of the electronic component with the protective cover. is removably attached and fixed to the electronic component and irradiated with infrared rays, and the electronic component is soldered to a predetermined position on the board while protecting it from the heat caused by the infrared irradiation, and then the protective cover is removed and the electronic component is Electronic components can be soldered to a board at low cost without being limited by the color of the components.
（実施例）
次に、本発明の実施例について、基板に電子部品として
のジャックを半田付けする場合を例として、図面を参照
しながら説明する。(Example) Next, an example of the present invention will be described with reference to the drawings, taking as an example a case where a jack as an electronic component is soldered to a board.
第１図は本発明の実施例に係るジャック及び保護カバー
の要部を示す斜視図である。FIG. 1 is a perspective view showing essential parts of a jack and a protective cover according to an embodiment of the present invention.
本発明に係る電子部品の半田付は方法は、熱吸収率の低
い材料からなり外側から照射される赤外線を遮蔽する保
護カバー５を使用し、ジャック１の外面を覆って当該保
護カバー５を着脱可能に当該ジャック１に装着固定した
状態で赤外線を照射して、当該ジャック１を赤外線の照
射による熱から保護しつつ基板８上の所定位置に半田付
けした後に、前記保護カバー５を取り外し、当該ジャッ
ク１の色彩の制限を受けることなく、しかも低コストで
基板８へのジャック１の半田付けを行うことができるよ
うになっている。The method for soldering electronic components according to the present invention uses a protective cover 5 that is made of a material with low heat absorption rate and blocks infrared rays irradiated from the outside, covers the outer surface of the jack 1, and attaches and detaches the protective cover 5. After soldering the jack 1 to a predetermined position on the board 8 while protecting the jack 1 from heat caused by the infrared irradiation, the protective cover 5 is removed and The jack 1 can be soldered to the board 8 at low cost without being limited by the color of the jack 1.
半田付けの対象となるジャック１は、ジャック本体２と
、当該ジャック本体２の端面から横向きに一体に突出し
た管状突部３と、下面から横向きに互いに所定間隔を置
いて突設した２本のリード部４とを備え、当該リード部
４が基板８上の所定位置に半田付けされて固定される。The jack 1 to be soldered includes a jack body 2, a tubular protrusion 3 that integrally protrudes laterally from the end face of the jack body 2, and two protrusions that protrude laterally from the bottom surface at a predetermined distance from each other. The lead portion 4 is soldered and fixed at a predetermined position on the substrate 8.
ジャック本体２は、黒色その他任意の各種色彩を選定で
きる安価な材料を使用して成形してあり、一方の側面に
交差線部２ｂを形成する下向きの段差部２ａを有し、他
方の側面にも図示してないが同様の段差部が対称的に形
成され、管状突部３の反対側の端面及び上面がいずれも
偏平になっている。The jack body 2 is molded using an inexpensive material that can be selected from black or any other color, and has a downward stepped portion 2a forming an intersecting line portion 2b on one side, and a stepped portion 2a on the other side. Although not shown, a similar stepped portion is formed symmetrically, and both the opposite end surface and the upper surface of the tubular protrusion 3 are flat.
保護カバー５は、ジャック本体２及び管状突部３にそれ
ぞれ対応し、赤外線による熱吸収率の低い白色系の安価
な材料で成形したカバー本体６及びカバー突部７を有し
、当該カバー本体６及びカバー突部７共に下向きの開口
６ｄ、７ｄを備え。The protective cover 5 has a cover body 6 and a cover protrusion 7, which correspond to the jack body 2 and the tubular protrusion 3, respectively, and are made of a white, inexpensive material with low heat absorption by infrared rays. and cover protrusion 7 both have downward openings 6d and 7d.
これらの開口６ｄ、つｄを通じてジャック１への装着及
びジャック１からの取り外しが行われる。Attachment to and removal from the jack 1 are performed through these openings 6d and 6d.
カバー本体６は、ジャック本体２の両側面、両端面、及
び上面をそれぞれ覆うための両側板６ａ。The cover main body 6 has both side plates 6a for covering both side surfaces, both end surfaces, and the top surface of the jack main body 2, respectively.
６ａ、両端板６ｂ、６ｂ及び上板６ｃを備え、両側板６
ａ、６ａの部分に、段差部２ａの交差線部２ｂに対応し
て連続した内側に凸の凸条６ｅ、６ｅを有し、側板６ａ
と端板６ｂとの交差部分に細い切れ目６ｆがあり、両側
板６ａ、６ａ自体の弾性変形により、ジャック本体２へ
の着脱を円滑にできるようになっており、ジャック本体
２への装着時に、凸条６ａ、６ｅが段差部２ａの交差線
部２ｂの下方近傍に位置して係止固定されている。6a, both end plates 6b, 6b and an upper plate 6c, both side plates 6
The parts a and 6a have convex ridges 6e and 6e that are continuous and convex inward corresponding to the intersecting line part 2b of the step part 2a, and the side plate 6a
There is a thin cut 6f at the intersection of the end plate 6b and the end plate 6b, and the elastic deformation of the side plates 6a and 6a themselves allows for smooth attachment and detachment to the jack body 2.When attached to the jack body 2, The protrusions 6a and 6e are located near the lower part of the intersecting line portion 2b of the stepped portion 2a and are locked and fixed thereto.
カバー突部７は、いずれも偏平な両側板７ａ。The cover protrusions 7 are both flat side plates 7a.
７ａと、端板７ｂと、上板６Ｃとからなっていて、カバ
ー本体６の一方の端板６ｂに一体に接続している。7a, an end plate 7b, and an upper plate 6C, and is integrally connected to one end plate 6b of the cover body 6.
次に、このような保護カバーを使用して、基板上へジャ
ックを半田付けする方法の実施例について説明する。Next, an example of a method of soldering a jack onto a board using such a protective cover will be described.
■開口を通じてジャック本体２をカバー本体６内に、開
口を通じて管状突部３をカバー突部７内に、それぞれ収
めてジャック１の外面全体を覆って当該ジャック１に保
護カバー５を装着する。このとき保護カバー５は、両側
板６ａ、６ａが弾性変形して円滑に装着することができ
、装着後には、当該両側板６ａ、６ａがそれ自体の弾性
で復元して凸条６ｅ、６ｅが段差部２ａ、２ａの交差線
部２ｂ、２ｂに掛かってジャック１に固定される。(2) Fit the jack body 2 into the cover body 6 through the opening, fit the tubular protrusion 3 into the cover protrusion 7 through the opening, cover the entire outer surface of the jack 1, and attach the protective cover 5 to the jack 1. At this time, the protective cover 5 can be installed smoothly as the side plates 6a, 6a are elastically deformed, and after installation, the side plates 6a, 6a are restored by their own elasticity, and the protrusions 6e, 6e are formed. It is fixed to the jack 1 by hooking onto the intersecting line portions 2b, 2b of the stepped portions 2a, 2a.
■図示しないコンベヤに載置ぎれた基板８は、接着剤デ
イスペンサで接着剤の供給を受けた後、半田付けの対称
となるジャック１を保護カバー５で覆った状態で図示し
ない部品装着機で所定位置に搭載装着される。■ After receiving adhesive from an adhesive dispenser, the board 8 placed on a conveyor (not shown) is placed in a predetermined position by a component mounting machine (not shown) with the jack 1 to be soldered covered with a protective cover 5. It is installed and installed in the position.
■接着剤の硬化後、反転させた基板８にクリーム半田を
印刷し、リフロー炉で赤外線を保護カバー５の外側から
照射して、ジャック１を基板８上の所定位置に半田付は
固定する。(2) After the adhesive has hardened, cream solder is printed on the inverted board 8, and infrared rays are irradiated from the outside of the protective cover 5 in a reflow oven to solder and fix the jack 1 in a predetermined position on the board 8.
■保護カバー５の上部を掴んで引き上げ、両側板６ａ、
６ａの弾性変形を伴いつつ突条を段差部２ａＬの交差線
部２ｂから外し、当該保護カバー５をジャック１から取
り外す。■Grasp the top of the protective cover 5 and pull it up,
The protrusion 6a is removed from the intersecting line portion 2b of the stepped portion 2aL while being elastically deformed, and the protective cover 5 is removed from the jack 1.
■取り外した保護カバー５は、必要に応じて回収し再利
用する。■Recover and reuse the removed protective cover 5 if necessary.
なお、本発明に係る半田付は方法は、上記実施例に限定
されるものではなく、ジャック以外の電子部品にも適用
することができ、保護カバーの材料として合成樹脂に限
らず、熱反射率の高い金属、例えばステンレス・スティ
ール等とすることも可能であり、この場合も使用後の保
護カバーを回収して再使用することにより、全体として
のコストを下げることができ、保護カバーは側板の凸条
に代えて内向きの爪にしてもよいし、スナップを用いて
保護カバーをジャックに着脱可能に固定することもでき
、その他種々の変形が可能である。Note that the soldering method according to the present invention is not limited to the above embodiments, and can be applied to electronic components other than jacks, and the material of the protective cover is not limited to synthetic resin, but also It is also possible to use high-quality metals such as stainless steel, and in this case as well, the overall cost can be reduced by collecting and reusing the protective cover after use, and the protective cover can be attached to the side plate. The protrusions may be replaced with inward claws, the protective cover may be removably fixed to the jack using snaps, and various other modifications are possible.
（発明の効果）
本発明は、上述の如く構成され、熱吸収率の低い材料か
らなり外側から照射される赤外線を遮蔽する保護カバー
を使用し、電子部品の外面を覆って該保護カバーを着脱
可能に該電子部品に装着固定した状態で赤外線を照射し
、該電子部品を基板上の所定位置に半田付けすることに
より、電子部品の使用材料の色彩を限定されることがな
く、電子部品自体に安価な成形材料を使用してコスト低
減を図ることができ、半田付は後に、前記保護カバーを
取り外すことにより、当該保護カバーを再使用して、さ
らにコストを下げることができる等の効果を有する。ま
た１本考案によれば、保護カバーで保護された電子部品
は、色彩を変える毎に半田付けの条件の検討と設定し直
しをしなくてよく、ジャック本体を薄肉にしても熱の影
響が少ないので、より小型化が可能となり、小型化する
と吸引ノズル等を使用して行う自動マウントシステムの
適用の困難性を伴い易いが、保護カバーが装着しである
電子部品は、自動マウントシステムの適用が容易である
。(Effects of the Invention) The present invention is configured as described above, uses a protective cover made of a material with low heat absorption rate and blocks infrared rays irradiated from the outside, and covers the outer surface of an electronic component to attach and detach the protective cover. By irradiating infrared rays while the electronic component is attached and fixed, and soldering the electronic component to a predetermined position on the board, the color of the material used for the electronic component is not limited, and the electronic component itself It is possible to reduce costs by using inexpensive molding materials, and by removing the protective cover after soldering, the protective cover can be reused, further reducing costs. have In addition, according to this invention, electronic components protected by a protective cover do not need to consider and reset the soldering conditions every time the color is changed, and even if the jack body is made thinner, the effects of heat can be reduced. Since the number of electronic components is small, it is possible to make them more compact.However, when miniaturized, it is difficult to apply an automatic mounting system using a suction nozzle, etc., but it is possible to apply an automatic mounting system to electronic components that have a protective cover attached. is easy.
第１図は本発明の実施例に係る半田付は方法における半
田付けの対象となるジャックとその保護カバーを示す斜
視図である。
１・・・ジャック、２・・・ジャック本体、２ａ・・・
段差部、２ｂ・・・交差線部、３・・・管状突部、４・
・・リード部、５・・・保護カバー、６・・・カバー本
体、６ａ−！・側板、６ｂ・・・端板、６ｃ・・・上板
、６ｄ・・・開口、６ｅ・・・凸条、７・・・カバー突
部、７ａ・・・側板、７ｂ・・・端板、７ｃ・・・上板
、７ｄ・・・開口、８・・・基板。FIG. 1 is a perspective view showing a jack to be soldered and its protective cover in a soldering method according to an embodiment of the present invention. 1...Jack, 2...Jack body, 2a...
Step portion, 2b... Intersection line portion, 3... Tubular protrusion, 4.
...Lead part, 5...Protective cover, 6...Cover body, 6a-!・Side plate, 6b... End plate, 6c... Upper plate, 6d... Opening, 6e... Convex strip, 7... Cover protrusion, 7a... Side plate, 7b... End plate , 7c...upper plate, 7d...opening, 8...substrate.
Claims (1)
を遮蔽する保護カバーを使用し、電子部品の外面を覆っ
て該保護カバーを着脱可能に該電子部品に装着固定した
状態で赤外線を照射し、該電子部品を基板上の所定位置
に半田付けした後に、前記保護カバーを取り外すことを
特徴とする基板への電子部品の半田付け方法。A protective cover made of a material with low heat absorption rate that blocks infrared rays emitted from the outside is used, and the infrared rays are irradiated while the protective cover is removably attached and fixed to the electronic component while covering the outer surface of the electronic component. . A method of soldering electronic components to a board, the method comprising: removing the protective cover after soldering the electronic component to a predetermined position on the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3755088A JPH01215461A (en) | 1988-02-22 | 1988-02-22 | Method for soldering electronic parts onto board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3755088A JPH01215461A (en) | 1988-02-22 | 1988-02-22 | Method for soldering electronic parts onto board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01215461A true JPH01215461A (en) | 1989-08-29 |
Family
ID=12500630
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3755088A Pending JPH01215461A (en) | 1988-02-22 | 1988-02-22 | Method for soldering electronic parts onto board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01215461A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56139277A (en) * | 1980-04-02 | 1981-10-30 | Makoto Nishimura | In-furnace brazing method |
| JPS584418A (en) * | 1981-06-30 | 1983-01-11 | Fujitsu Ltd | Resetting system of data processor |
-
1988
- 1988-02-22 JP JP3755088A patent/JPH01215461A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56139277A (en) * | 1980-04-02 | 1981-10-30 | Makoto Nishimura | In-furnace brazing method |
| JPS584418A (en) * | 1981-06-30 | 1983-01-11 | Fujitsu Ltd | Resetting system of data processor |
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