JPH01214149A - Bending die for lead part in semiconductor device and the like - Google Patents

Abstract

PURPOSE: To reduce the exfoliation of a plated foil and the protrusion of any unnecessary damage of an end of a lead part by reducing a distance where the end of the lead part is slidable by bending the end of the lead part at a sufficiently large angle before finally bending the end of the lead part.

CONSTITUTION: A predetermined length part of a lead part 8 from an end 10 toward a base 12, which lead part extends from the side 6 of a resin-sealed part 4 of a semiconductor device, is bent by first bending means 2a with the aid of a bending surface 16a of a bending bench 18a and of a bending surface 20a of a punch 24a. The resin-sealed part 4 bent as such is bent over its predetermined part from a bent part 23b at the end 10 toward the base part 12 side by second bending means 2b with the aid of a bending surface 16b of a bending bench 18b and bending surface 20b of a punch 24b. Hereby, the end part 10 is bent beyond 90°. As a result, when the end 10 is allowed to slide along a guide surface 28 of a final bending die 26 and further folded, a distance of sliding along the guide surface 28 is shortened, thereby reducing the exfoliation of a plated foil of the end part 10 and the production of a unnecessary damage of the same.

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