JPH01165637U - - Google Patents

Info

Publication number
JPH01165637U
JPH01165637U JP6180688U JP6180688U JPH01165637U JP H01165637 U JPH01165637 U JP H01165637U JP 6180688 U JP6180688 U JP 6180688U JP 6180688 U JP6180688 U JP 6180688U JP H01165637 U JPH01165637 U JP H01165637U
Authority
JP
Japan
Prior art keywords
integrated circuit
bare chip
circuit board
bonding pad
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6180688U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6180688U priority Critical patent/JPH01165637U/ja
Publication of JPH01165637U publication Critical patent/JPH01165637U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Wire Bonding (AREA)
JP6180688U 1988-05-10 1988-05-10 Pending JPH01165637U (US06521211-20030218-C00004.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6180688U JPH01165637U (US06521211-20030218-C00004.png) 1988-05-10 1988-05-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6180688U JPH01165637U (US06521211-20030218-C00004.png) 1988-05-10 1988-05-10

Publications (1)

Publication Number Publication Date
JPH01165637U true JPH01165637U (US06521211-20030218-C00004.png) 1989-11-20

Family

ID=31287451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6180688U Pending JPH01165637U (US06521211-20030218-C00004.png) 1988-05-10 1988-05-10

Country Status (1)

Country Link
JP (1) JPH01165637U (US06521211-20030218-C00004.png)

Similar Documents

Publication Publication Date Title
JPS6387064U (US06521211-20030218-C00004.png)
JPH01165637U (US06521211-20030218-C00004.png)
JPS63147831U (US06521211-20030218-C00004.png)
JPH0247039U (US06521211-20030218-C00004.png)
JPS63182533U (US06521211-20030218-C00004.png)
JPH0397939U (US06521211-20030218-C00004.png)
JPH0472651U (US06521211-20030218-C00004.png)
JPH0180937U (US06521211-20030218-C00004.png)
JPS6373968U (US06521211-20030218-C00004.png)
JPH01129877U (US06521211-20030218-C00004.png)
JPH0184460U (US06521211-20030218-C00004.png)
JPS62134254U (US06521211-20030218-C00004.png)
JPH029441U (US06521211-20030218-C00004.png)
JPS6432164U (US06521211-20030218-C00004.png)
JPH01113336U (US06521211-20030218-C00004.png)
JPS6355449U (US06521211-20030218-C00004.png)
JPH0227758U (US06521211-20030218-C00004.png)
JPS6278784U (US06521211-20030218-C00004.png)
JPH0247085U (US06521211-20030218-C00004.png)
JPH0265339U (US06521211-20030218-C00004.png)
JPH03120052U (US06521211-20030218-C00004.png)
JPS62184782U (US06521211-20030218-C00004.png)
JPH0468376U (US06521211-20030218-C00004.png)
JPH0451152U (US06521211-20030218-C00004.png)
JPS6379653U (US06521211-20030218-C00004.png)