JPH01163333U - - Google Patents
Info
- Publication number
- JPH01163333U JPH01163333U JP5896788U JP5896788U JPH01163333U JP H01163333 U JPH01163333 U JP H01163333U JP 5896788 U JP5896788 U JP 5896788U JP 5896788 U JP5896788 U JP 5896788U JP H01163333 U JPH01163333 U JP H01163333U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- stirring device
- piston
- lead frame
- outer cylinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 239000008188 pellet Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5896788U JPH01163333U (US06330241-20011211-M00004.png) | 1988-04-30 | 1988-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5896788U JPH01163333U (US06330241-20011211-M00004.png) | 1988-04-30 | 1988-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01163333U true JPH01163333U (US06330241-20011211-M00004.png) | 1989-11-14 |
Family
ID=31284758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5896788U Pending JPH01163333U (US06330241-20011211-M00004.png) | 1988-04-30 | 1988-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01163333U (US06330241-20011211-M00004.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012074565A (ja) * | 2010-09-29 | 2012-04-12 | Diamond Electric Mfg Co Ltd | 超音波接合ツール及び超音波接合装置及び接合材パターン成形方法 |
-
1988
- 1988-04-30 JP JP5896788U patent/JPH01163333U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012074565A (ja) * | 2010-09-29 | 2012-04-12 | Diamond Electric Mfg Co Ltd | 超音波接合ツール及び超音波接合装置及び接合材パターン成形方法 |
