JPH01162253U - - Google Patents

Info

Publication number
JPH01162253U
JPH01162253U JP5538688U JP5538688U JPH01162253U JP H01162253 U JPH01162253 U JP H01162253U JP 5538688 U JP5538688 U JP 5538688U JP 5538688 U JP5538688 U JP 5538688U JP H01162253 U JPH01162253 U JP H01162253U
Authority
JP
Japan
Prior art keywords
semiconductor element
mounting part
lead frame
joining
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5538688U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5538688U priority Critical patent/JPH01162253U/ja
Publication of JPH01162253U publication Critical patent/JPH01162253U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP5538688U 1988-04-25 1988-04-25 Pending JPH01162253U (US08197722-20120612-C00042.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5538688U JPH01162253U (US08197722-20120612-C00042.png) 1988-04-25 1988-04-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5538688U JPH01162253U (US08197722-20120612-C00042.png) 1988-04-25 1988-04-25

Publications (1)

Publication Number Publication Date
JPH01162253U true JPH01162253U (US08197722-20120612-C00042.png) 1989-11-10

Family

ID=31281290

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5538688U Pending JPH01162253U (US08197722-20120612-C00042.png) 1988-04-25 1988-04-25

Country Status (1)

Country Link
JP (1) JPH01162253U (US08197722-20120612-C00042.png)

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