JPH01159366U - - Google Patents

Info

Publication number

JPH01159366U

JPH01159366U JP5538588U JP5538588U JPH01159366U JP H01159366 U JPH01159366 U JP H01159366U JP 5538588 U JP5538588 U JP 5538588U JP 5538588 U JP5538588 U JP 5538588U JP H01159366 U JPH01159366 U JP H01159366U

Authority

JP

Japan

Prior art keywords

circuit board

lead

attachment pattern

hybrid integrated

lead attachment

Prior art date

1988-04-25

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 230000017525 heat dissipation Effects 0.000 claims 2
• 238000009434 installation Methods 0.000 description 2
• 239000000758 substrate Substances 0.000 description 2
• 239000004593 Epoxy Substances 0.000 description 1
• PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
• 239000011521 glass Substances 0.000 description 1
• 230000005855 radiation Effects 0.000 description 1