JPH01157199A - Frequency adjusting method for supersonic transmitter and receiver - Google Patents
Frequency adjusting method for supersonic transmitter and receiverInfo
- Publication number
- JPH01157199A JPH01157199A JP28003588A JP28003588A JPH01157199A JP H01157199 A JPH01157199 A JP H01157199A JP 28003588 A JP28003588 A JP 28003588A JP 28003588 A JP28003588 A JP 28003588A JP H01157199 A JPH01157199 A JP H01157199A
- Authority
- JP
- Japan
- Prior art keywords
- case
- frequency
- top panel
- diameter
- case top
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 15
- 230000035945 sensitivity Effects 0.000 abstract description 5
- 238000005452 bending Methods 0.000 abstract description 3
- 230000010355 oscillation Effects 0.000 abstract 2
- 238000005520 cutting process Methods 0.000 description 13
- 239000000919 ceramic Substances 0.000 description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K9/00—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers
- G10K9/12—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers electrically operated
- G10K9/122—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers electrically operated using piezoelectric driving means
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Multimedia (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
この発明は圧電振動子を用いた超音波送受波器の周波数
調整方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a frequency adjustment method for an ultrasonic transducer using a piezoelectric vibrator.
[従来の技術] 超音波送受波器の一例を第1図に示す。[Conventional technology] An example of an ultrasonic transducer is shown in FIG.
上記超音波送受波器は自動車のパックセンサとして使用
されているもので、円筒状のケースlを有する。このケ
ース1の天面部2の内側には圧電磁器振動子3を貼り合
わせて振動部を形成し、ケース1の他側は開口4を形成
してこの開口4をシール部材5.6を介し、端子7.8
を設けた端子板9によって閉塞している。10.IIは
それぞれ端子7.8に接続されたリード線で、リード線
IOの他端は圧電磁器振動子3に接続され、リード線j
lの他端は天面部2に接続される。上記振動部の一部を
形成する天面部2は、ケース1の周壁部12の支持によ
る影響を小さくするため、その厚みし、が周壁部12の
厚みし。より薄く構成される。The ultrasonic transducer is used as a car pack sensor, and has a cylindrical case l. A piezoelectric ceramic vibrator 3 is bonded to the inside of the top surface part 2 of the case 1 to form a vibrating part, and an opening 4 is formed on the other side of the case 1, and the opening 4 is closed with a sealing member 5.6 in between. Terminal 7.8
It is closed by a terminal plate 9 provided with. 10. II is a lead wire connected to the terminal 7.8, the other end of the lead wire IO is connected to the piezoelectric ceramic vibrator 3, and the lead wire j
The other end of l is connected to the top surface part 2. The top surface part 2 forming a part of the vibrating part has a thickness equal to that of the peripheral wall part 12 in order to reduce the influence of support from the peripheral wall part 12 of the case 1. Constructed thinner.
ところで、ケースlおよび圧電磁器振動子3には必ずと
いっていいほど製造時のバラツキ、誤差等が存在し、こ
のバラツキや誤差によってもしくはユーザ側の要請によ
って、超音波の感度・音圧に係る中心周波数を調整しな
ければならない場合がある。By the way, there are almost always variations and errors in the case l and the piezoelectric ceramic vibrator 3 during manufacturing, and due to these variations and errors or due to user requests, the center of sensitivity and sound pressure of ultrasonic waves may be affected. Frequency may need to be adjusted.
このような調整は、この種措造の超音波送受波器におい
ては周波数がケース天面部2の厚さ1.と圧電磁器振動
子3の厚さし、との和に比例するところから、従来一般
に、圧電磁器振動子3を天面部2に接骨した後でケース
天面部2の厚さ1.を変えることにより行っており、周
波数を低くする場合にはケース天面部2を外側から削り
とって厚さtlを薄くする手法が採られている(たとえ
ば、特開昭50−83012号公報参照)。Such adjustment is performed when the frequency of this type of ultrasonic transducer is adjusted to the thickness of the top surface 2 of the case. Since it is proportional to the sum of the thickness of the piezoelectric ceramic vibrator 3 and the thickness of the piezoelectric ceramic vibrator 3, conventionally, after the piezoelectric ceramic vibrator 3 is attached to the top plate part 2, the thickness of the case top part 2 is 1. In order to lower the frequency, a method is adopted in which the top surface part 2 of the case is shaved off from the outside to reduce the thickness tl (for example, see Japanese Patent Application Laid-Open No. 50-83012). .
しかし、ケース天面部2の外側を削るとき、削り取るこ
とによって送受波器自体の感度・音圧が低下しないよう
にケース天面部2の外側表面を充分に平坦に仕上げねば
ならず、この仕上げ加工には高い熟練技術が必要であっ
た。However, when cutting the outside of the case top 2, it is necessary to finish the outside surface of the case top 2 sufficiently flat so that the sensitivity and sound pressure of the transducer itself will not decrease due to scraping. required a high level of skill.
また、自動車のバックセンサのように、屋外での使用に
供せられる防滴型の送受波器の場合、ケースlの外面に
は防錆加工および絶縁処理が施されている(たとえば、
ケース1がアルミ製で外側表面にアルマイト処理が施さ
れている)ため、天面部2の外側を削り取ると、防錆、
絶縁効果が消失してしまう欠点がある。In addition, in the case of a drip-proof transducer used outdoors, such as a back sensor in an automobile, the outer surface of the case l is treated with anti-corrosion and insulation treatments (for example,
Case 1 is made of aluminum and the outer surface is anodized), so if you scrape off the outside of top panel 2, it will prevent rust.
The disadvantage is that the insulation effect is lost.
[発明の目的]
そこで、本発明は、この種圧電振動子を用いた超音波送
受波器において、ケース天面部の外側を削ることなく極
めて簡単な加工によって周波数のジ11整を行えるよう
にすることを目的とする。[Object of the Invention] Therefore, the present invention provides an ultrasonic transducer using this type of piezoelectric vibrator, in which the frequency can be adjusted by extremely simple machining without cutting the outside of the top surface of the case. The purpose is to
[発明の要旨]
本発明は、この種構造の送受波器か圧電振動子のベンデ
ィング振動を利用するものであり、感度・音圧に係る中
心周波数が厚さQ++tt)に比例する一方でケース天
面部の直径りの二乗に反比例することに着目したもので
、ケース天面部とケース周壁とを一体に連結する連結部
の少なくとも内面をテーパ面に形成し、このテーパ面の
一部を削除することによりケース天面部の直径りを実質
的に大きくすることで周波数の調整を行なうことを特徴
とするものである。[Summary of the Invention] The present invention utilizes bending vibration of a transducer or a piezoelectric vibrator having this type of structure, and the center frequency related to sensitivity and sound pressure is proportional to the thickness Q++tt), while the case top Focusing on the fact that the diameter of the surface is inversely proportional to the square of the diameter of the surface, at least the inner surface of the connecting portion that integrally connects the case top surface and the case peripheral wall is formed into a tapered surface, and a part of this tapered surface is deleted. This is characterized in that the frequency is adjusted by substantially increasing the diameter of the top surface of the case.
[実施例] 以下、添付の図面を参照して本発明の詳細な説明する。[Example] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
第2図、第3図により本発明の詳細な説明する。The present invention will be explained in detail with reference to FIGS. 2 and 3.
第2図、第3図中、第1図と対応する部分には対応する
符号を付して示し、重複した説明は省略する。In FIGS. 2 and 3, parts corresponding to those in FIG. 1 are designated by corresponding reference numerals, and redundant explanation will be omitted.
第2図において、ケー21は上部を円錐台状に下部が円
筒状に形成されている。即ち、厚さが一定で平坦なケー
ス天面部2と、このケース天面部2より大径の位置でケ
ース天面部2に対し直角方向に延びるケース周壁部12
とを一体に連結して、テーパ状の連結部13が形成され
ている。In FIG. 2, the case 21 has an upper part shaped like a truncated cone and a lower part shaped like a cylinder. That is, the case top surface part 2 has a constant thickness and is flat, and the case peripheral wall part 12 extends in a direction perpendicular to the case top surface part 2 at a position larger in diameter than the case top surface part 2.
A tapered connecting portion 13 is formed by integrally connecting these.
連結部13は、外側のテーパ面13bと、ケース天面部
2の内側面からケース周壁部12の内側面に至る内側テ
ーパ面13aを形成する。好ましくは、ケース天面部2
の厚さt、と連結部13の厚さL3とを等しく、例えば
0.6mmとする。これに対し、ケース周壁部12の厚
さt。は振動部の振動を減衰させないように、厚さ1.
.1.に比し5倍程度厚く、即ち3mm程度に選択する
。もっとも、加工上もしくは強度上の要請があれば連結
部13の厚さL3をケース天面部2の厚さ1.より大き
くしてもよい。The connecting portion 13 forms an outer tapered surface 13 b and an inner tapered surface 13 a extending from the inner surface of the case top surface section 2 to the inner surface of the case peripheral wall section 12 . Preferably, the case top portion 2
The thickness t of the connecting portion 13 and the thickness L3 of the connecting portion 13 are set to be equal, for example, 0.6 mm. On the other hand, the thickness t of the case peripheral wall portion 12. has a thickness of 1.5 mm to avoid damping the vibration of the vibrating part.
.. 1. The thickness is selected to be about 5 times thicker than that of , that is, about 3 mm. However, if there is a request for processing or strength, the thickness L3 of the connecting portion 13 may be changed to the thickness 1. It may be larger.
一方、第3図において、ケースlは円筒状をなし、ケー
ス天面部2と厚肉のケース周壁部12とを一体に連結す
る連結部13の内側のみをテーパ面13aに形成してい
る。また、端子7,8を設けた端子板は、ケースの開口
4に形成された環状の段部14に適合して接着剤15等
で固着される。On the other hand, in FIG. 3, the case l has a cylindrical shape, and only the inside of the connecting part 13 that integrally connects the case top surface part 2 and the thick case peripheral wall part 12 is formed into a tapered surface 13a. Further, the terminal board provided with the terminals 7 and 8 is fixed to an annular step 14 formed in the opening 4 of the case with an adhesive 15 or the like.
端子7.8は強度をもたせるために、ケース周壁部12
の下方に位置するように設けられる。端子7はリード線
10を介し圧電振動子3の一方側の電極に接続される。The terminals 7.8 are attached to the case peripheral wall 12 in order to provide strength.
It is located below. The terminal 7 is connected to an electrode on one side of the piezoelectric vibrator 3 via a lead wire 10.
また、上記端子7とは絶縁されている端子8はリード線
11を介してケース周壁部12の内面に接続され、ケー
ス1を通して圧電振動子3の他方側の電極に接続される
。Further, a terminal 8 which is insulated from the terminal 7 is connected to the inner surface of the case peripheral wall 12 via a lead wire 11, and is connected to the other electrode of the piezoelectric vibrator 3 through the case 1.
上記第2図、第3図の超音波送受波器において、超音波
の感度・音圧に係る中心周波数rを調整するときは、第
4図に示すように、ケース内側において切削工具により
テーパ面13aの任意箇所16を削除する。ケース1が
アルミ製であると、軟らかいので簡単に切削できる。切
削することによって、圧電振動子3のベンディング振動
のノード点が外側に移動する。切削前の振動に関係する
天面部2の直径り、に対し、切削後は、実質的にその直
径がり、より大きいり、となる。これによって周波数f
が低下する。In the ultrasonic transducer shown in Figs. 2 and 3 above, when adjusting the center frequency r related to the ultrasonic sensitivity and sound pressure, as shown in Fig. 4, the taper surface is cut using a cutting tool inside the case. Delete arbitrary part 16 of 13a. If the case 1 is made of aluminum, it is soft and can be easily cut. By cutting, the node point of the bending vibration of the piezoelectric vibrator 3 moves outward. While the diameter of the top surface portion 2 is related to vibration before cutting, the diameter becomes substantially larger after cutting. This allows the frequency f
decreases.
予め、所定の切削箇所における切削量と周波数変化Δr
の関係を求めておけば、画一的な加工工程によって所望
の周波数の超音波送受波器を得ることができる。これは
、ユーザの要請によるロット生産に好適である。なお、
上記実施例は、超音波送受波器としたが、送波器または
受波器の単独の機能のみの装置にも同様に本発明が適用
できる。The cutting amount and frequency change Δr at a predetermined cutting location are determined in advance.
By determining the relationship, it is possible to obtain an ultrasonic transducer with a desired frequency through uniform processing steps. This is suitable for lot production according to user requests. In addition,
In the above embodiment, an ultrasonic wave transducer is used, but the present invention can be similarly applied to a device having only a single function of a wave transmitter or a wave receiver.
なお、ケ−ス周壁部の内側のほぼ全域に圧電振動子を貼
り合わせ°る場合(たとえば第4図のような場合)には
第4図の切削箇所16で示すように、切削工具との関係
で圧電振動子を何ら傷つけることなくテーパ面の基部を
削ることができ、この意味でも実施例のように形成した
テーパ面を切削することは大きな利点を有するものであ
る。Note that if the piezoelectric vibrator is bonded to almost the entire inside of the case peripheral wall (for example, as shown in Fig. 4), as shown in the cutting point 16 in Fig. 4, In this regard, the base of the tapered surface can be cut without damaging the piezoelectric vibrator, and in this sense too, cutting the tapered surface formed as in the embodiment has a great advantage.
[効果]
以上、本発明によれば、ケース天面部とケース周壁部と
の連結部の内側のテーパ面の一部を削って周波数のが、
1整を行なうようにしたので、テーパ而を削るという極
めて簡単な加工によって周波数の調整を簡易に行なうこ
とができ、従来のごとき高い熟練を要するケース天前部
外側の切削加工が不要となるとともに、防錆、絶縁性に
対する配慮等ムー切不要ならしめる。[Effects] As described above, according to the present invention, by cutting a part of the inner tapered surface of the connecting portion between the case top surface portion and the case peripheral wall portion, the frequency can be reduced.
By making one adjustment, the frequency can be easily adjusted by the extremely simple process of cutting the taper, and the cutting process on the outside of the top of the case, which requires a high level of skill as in the past, is no longer necessary. This eliminates the need for consideration of rust prevention, insulation, etc.
第1図は従来の周波数シ、5j整方法が適用される超音
波送受波器の概略断面構成図、
第2図および第3図はそれぞれ本発明が適用される超音
波送受波器を示す概略断面構造図、第4図は周波数調整
に係る説明図である。
l・・・ケース、2・・・天面部、3圧電振動子、4・
・・開口、9・・・端子板、12・・・周壁部、13・
・・連結部、13a・・・テーパ面。
特許出願人 株式会社村田製作所
代理人 弁理士 前出 葆ばか2名
第1図
第2辺
第3図
第4図Fig. 1 is a schematic cross-sectional configuration diagram of an ultrasonic transducer to which the conventional frequency adjustment method is applied, and Figs. 2 and 3 are schematic diagrams showing ultrasonic transducers to which the present invention is applied. The cross-sectional structure diagram and FIG. 4 are explanatory diagrams related to frequency adjustment. l...Case, 2...Top section, 3 Piezoelectric vibrator, 4...
...Opening, 9...Terminal plate, 12...Peripheral wall part, 13.
... Connecting portion, 13a... Tapered surface. Patent applicant: Murata Manufacturing Co., Ltd. Agent: Patent attorney: Two idiots, Figure 1, Side 2, Figure 4, Figure 4
Claims (1)
側に周縁部が周壁部に連結される薄肉の天面部を有し、
この天面部と上記周壁部との結合部の内壁面がテーパ面
となったケースの上記天面部の内側に圧電振動子を貼着
してなる超音波送受波器の周波数調整方法であって、 上記連結部のテーパ面を一部削除して周波数を調整する
ことを特徴とする超音波送受波器の周波数調整方法。(1) has an opening closed by a terminal plate on one side, and has a thin top surface portion whose peripheral edge is connected to the peripheral wall portion on the other side;
A method for adjusting the frequency of an ultrasonic transducer in which a piezoelectric vibrator is attached to the inside of the top surface of a case in which the inner wall surface of the joint between the top surface and the peripheral wall is a tapered surface, the method comprising: A method for adjusting the frequency of an ultrasonic transducer, characterized in that the frequency is adjusted by partially removing the tapered surface of the connecting portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28003588A JPH01157199A (en) | 1988-11-02 | 1988-11-02 | Frequency adjusting method for supersonic transmitter and receiver |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28003588A JPH01157199A (en) | 1988-11-02 | 1988-11-02 | Frequency adjusting method for supersonic transmitter and receiver |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01157199A true JPH01157199A (en) | 1989-06-20 |
JPH0512920B2 JPH0512920B2 (en) | 1993-02-19 |
Family
ID=17619388
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP28003588A Granted JPH01157199A (en) | 1988-11-02 | 1988-11-02 | Frequency adjusting method for supersonic transmitter and receiver |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01157199A (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5083012A (en) * | 1973-11-22 | 1975-07-04 | ||
JPS5756099U (en) * | 1980-09-16 | 1982-04-01 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51132946A (en) * | 1975-05-14 | 1976-11-18 | Sharp Corp | Small electronic calculator |
-
1988
- 1988-11-02 JP JP28003588A patent/JPH01157199A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5083012A (en) * | 1973-11-22 | 1975-07-04 | ||
JPS5756099U (en) * | 1980-09-16 | 1982-04-01 |
Also Published As
Publication number | Publication date |
---|---|
JPH0512920B2 (en) | 1993-02-19 |
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