JPH01153266A - Polishing device of semiconductor wafer - Google Patents
Polishing device of semiconductor waferInfo
- Publication number
- JPH01153266A JPH01153266A JP62311194A JP31119487A JPH01153266A JP H01153266 A JPH01153266 A JP H01153266A JP 62311194 A JP62311194 A JP 62311194A JP 31119487 A JP31119487 A JP 31119487A JP H01153266 A JPH01153266 A JP H01153266A
- Authority
- JP
- Japan
- Prior art keywords
- surface plate
- wafer
- moving means
- plate
- wafer holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 13
- 239000004065 semiconductor Substances 0.000 title claims description 9
- 235000012431 wafers Nutrition 0.000 description 27
- 239000002002 slurry Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は半導体ウェーハを研磨する研磨装置に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a polishing apparatus for polishing semiconductor wafers.
（従来の技術とその問題点）
従来、シリコンウェーハなどの半導体ウェーハは、ラッ
ピング、化学エツチング、そしてその表面を研磨シート
と砥粒スラリーで研磨する鏡面加工が半導体製造の前処
理として施されている。その鏡面加工を行なう従来の装
置は、半導体ウェーハが密着するプレート、加圧ヘッド
等から成るウェーハ保持部が定盤に対して所定位置に固
定か、又は保持部に連結されたアームを揺動させ定盤上
を移動させるようになっているが、前者の場合は定位置
回転であり、後者の場合はアームの長さが一定のため定
盤上で任意の軌跡を描いて動かすことは出来ないもので
ある。従って、従来装置においては定盤上を動く軌跡が
一定であるためウェーハの研磨が片寄り易く、均一な研
磨加工が出来にくいと共に、均一研磨を行なうための任
意な運動軌跡を選定できないという不便さを有している
。(Conventional technology and its problems) Conventionally, semiconductor wafers such as silicon wafers are subjected to lapping, chemical etching, and mirror polishing by polishing the surface with a polishing sheet and abrasive slurry as pre-treatments for semiconductor manufacturing. . In conventional equipment that performs mirror finishing, a wafer holder consisting of a plate to which the semiconductor wafer is in close contact, a pressure head, etc. is fixed at a predetermined position relative to a surface plate, or an arm connected to the holder is swung. It is designed to move on a surface plate, but in the former case it rotates in a fixed position, and in the latter case the arm length is constant, so it cannot be moved by drawing an arbitrary trajectory on the surface plate. It is something. Therefore, in conventional equipment, the trajectory of movement on the surface plate is constant, so the wafer tends to be polished unevenly, making it difficult to perform uniform polishing, and it is inconvenient that it is not possible to select an arbitrary movement trajectory for uniform polishing. have.
（発明の目的）
本発明は上述の如き従来の事情に鑑み、定盤に対し半導
体ウェーハを圧接保持するウェーハ保持部を、定盤表面
上を任意の軌跡を描いて動かすことが出来る研磨装置を
提供することにある。(Object of the Invention) In view of the above-mentioned conventional circumstances, the present invention provides a polishing apparatus that can move a wafer holder that holds a semiconductor wafer in pressure contact with a surface plate while drawing an arbitrary trajectory on the surface of the surface plate. It is about providing.
（発明の構成）
上記目的を達成するために本発明が講じた技術的手段は
、定盤と、その定盤表面に圧接されるウェーハを保持す
る自転手段を備えたウェーハ保持部とから成り、そのウ
ェーハ保持部を、直交させて配設した移動手段によって
定盤表面上をＸ−Ｙ方向に移動自在とすることを特徴と
する。(Structure of the Invention) The technical means taken by the present invention to achieve the above object consists of a surface plate and a wafer holder equipped with an autorotation means for holding a wafer pressed against the surface of the surface plate, The wafer holder is characterized in that it is movable in the X-Y directions on the surface of the surface plate by means of moving means disposed orthogonally to each other.
（作 用）
上記構成によれば、ウェーハ保持部は直交させて配置さ
れたＸ方向の移動手段と、Ｙ方向の移動手段の移動値の
設定によって定盤上を任意の軌跡を描いて動くことにな
る。(Function) According to the above configuration, the wafer holder can move on the surface plate in an arbitrary trajectory by setting the movement values of the moving means in the X direction and the moving means in the Y direction, which are arranged orthogonally to each other. become.
（実施例）
以下、本発明の実施例を図面に基づいて説明すると、定
盤１は平面円形に形成され、基台２上に固着した平面円
形のスラリー受け３内に同心円的に配置固定されており
、定盤１に対して被研磨材の半導体ウェーハａを圧接保
持するウェーハ保持部４がＸ−Ｙ方向への移動手段５を
介して定盤１と水平に保持されている。ウェーへ堡持部
４は、半導体ウェーハａが密着保持されるプレートを有
した今日周知の構造をなし、そのプレートはエアーシリ
ンダ６によって上下方向に４降されると共に、ＡＣサー
ボモータ７によって自転するように構成されている。(Embodiment) Hereinafter, embodiments of the present invention will be described based on the drawings.A surface plate 1 is formed into a circular shape in plan, and is arranged and fixed concentrically within a slurry receiver 3 which is circular in plan and fixed on a base 2. A wafer holder 4 that holds a semiconductor wafer a to be polished in pressure contact with the surface plate 1 is held horizontally with the surface plate 1 via means 5 for moving in the X-Y direction. The wafer holding unit 4 has a structure well known today, having a plate on which the semiconductor wafer a is closely held, and the plate is lowered vertically by an air cylinder 6 and rotated by an AC servo motor 7. It is configured as follows.
上記ウェーハ保持部４を定盤１表面上をＸ−Ｙ方向に移
動させる移動手段５は、Ｘ方向移動手段５−１とＹ方向
移動手段５−２とで構成され、Ｘ方向移動手段は、基台
２上にスラリー受け３を挟む如く配置した左右のガイド
レール８．８’ 、そのガイドレール８．８′上に載架
されたスライド枠９゜９′及び一方のガイドレール８と
平行ならしめて基台上に取付けたＸ軸ボールネジ１０、
そのボールネジ１０と螺合したナツト部材１１とから成
り、そのナツト部材１１はスライド枠９に固着されてい
る。The moving means 5 for moving the wafer holder 4 in the X-Y direction on the surface of the surface plate 1 is composed of an X-direction moving means 5-1 and a Y-direction moving means 5-2, and the X-direction moving means is If parallel to the left and right guide rails 8.8' arranged on the base 2 so as to sandwich the slurry receiver 3, and the slide frame 9°9' mounted on the guide rails 8.8', and one of the guide rails 8, X-axis ball screw 10 tightened and installed on the base,
It consists of a ball screw 10 and a nut member 11 screwed together, and the nut member 11 is fixed to the slide frame 9.
又、Ｘ＠ボールネジ１０はＡＣサーボモータ１２にカッ
プリング１３及びサポートユニット１４を介して接続さ
れ、駆動回転されるようになっている。Further, the X@ball screw 10 is connected to an AC servo motor 12 via a coupling 13 and a support unit 14, and is driven and rotated.
上記Ｘ方向移動手段５−＋の左右のスライド枠９゜９′
にはＸ方向移動手段５イの前後のガイドレール１５．１
５’が横架固定され、その前後のガイドレール１５．１
５’上に渉ってウェーハ保持部４がスライド自在に載承
保持されると共に、左右のスライド枠９，９′間に渉っ
てＹ軸ボールネジ１６がガイドレール１５．１５’と平
行ならしめて架設され、そのＹ軸ボールネジ１６と螺合
するナツト部材１７がつ工−ハ保持部４に固着されてい
る。又、Ｙ軸ボールネジ１６はＸ軸ボールネジ１０と同
様ＡＣサーボモータ１８にカップリング１９及びサポー
トユニット２０を介して接続され、ＡＣサーボモータ１
８の作動により回転するようになっている。図中、２１
は操作制御盤、２２．２２’はＡＣサーボモータ１２．
１８に接続さ５れた電気コードの処理カバーで、Ｘ方向
移動手段５．、Ｙ方向移動手段５（の作動に伴なって伸
縮するようになっている。Left and right slide frames 9°9' of the X-direction moving means 5-+
There are guide rails 15.1 before and after the X-direction moving means 5a.
5' is fixed horizontally, and the guide rails 15.1 in front and behind it
The wafer holder 4 is slidably mounted and held over the slide frames 9 and 9', and the Y-axis ball screw 16 is parallel to the guide rails 15 and 15' between the left and right slide frames 9 and 9'. A nut member 17 which is installed and screwed into the Y-axis ball screw 16 is fixed to the tool holding part 4. Also, like the X-axis ball screw 10, the Y-axis ball screw 16 is connected to the AC servo motor 18 via a coupling 19 and a support unit 20.
It is designed to rotate by the operation of 8. In the figure, 21
is the operation control panel, 22.22' is the AC servo motor 12.
18, the electric cord handling cover 5 is connected to the X-direction moving means 5. , and the Y-direction moving means 5 ().
以上の如き構成により、予め操作制御盤によってＸ方向
及びＹ方向の動き量を入力することにより、ウェーハ保
持部４はＸ方向移動手段５−１とＸ方向移動手段５イの
作動によって定ａａＩ上を入力したデータに基づいて移
動し、ウェーハを均一に研磨することが出来る。即ち、
ウェーハ保持部４の移動軌跡としては例えば８字形等が
挙げられる。With the above configuration, by inputting the amount of movement in the X direction and the Y direction using the operation control panel in advance, the wafer holder 4 can maintain a constant aaI by operating the X direction moving means 5-1 and the X direction moving means 5a. The wafer can be polished uniformly by moving based on the input data. That is,
The movement locus of the wafer holder 4 may be, for example, a figure 8 shape.
（発明の効果）
本発明の研磨装置は以上詳述した如く、定盤と、その定
盤表面に圧接されるウェーハを保持する自転手段を備え
たウェーハ保持部を、定盤表面上をＸ−Ｙ方向に移動自
在としたものであるから、ウェーハ保持部を定盤上で任
意の軌跡を描いて動かすことができ、それにより均一に
研磨できて高い平坦度のウェーハを得ることが出来る。(Effects of the Invention) As described in detail above, the polishing apparatus of the present invention has a surface plate and a wafer holder equipped with a rotation means for holding a wafer pressed against the surface of the surface plate. Since it is movable in the Y direction, the wafer holder can be moved in any desired trajectory on the surface plate, thereby achieving uniform polishing and obtaining wafers with high flatness.
図面は本発明の実施例を示し、第１図は平面図、第２図
は一部切欠正面図、第３図はウェーハ保持部を移動させ
た状態の平面図である。
図中
１：定 盤 ４：ウエーハ保持部５：移動手段
５．：Ｘ方向移動手段５イ：Ｙ方向移動手段The drawings show an embodiment of the present invention; FIG. 1 is a plan view, FIG. 2 is a partially cutaway front view, and FIG. 3 is a plan view with the wafer holder moved. In the figure 1: Surface plate 4: Wafer holding section 5: Moving means 5. :X direction moving means 5a:Y direction moving means
Claims (1)
る自転手段を備えたウェーハ保持部とから成り、そのウ
ェーハ保持部を、定盤表面上をＸ・Ｙ方向に移動自在と
したことを特徴とする半導体ウェーハの研磨装置。It consists of a surface plate and a wafer holder equipped with an autorotation means for holding a wafer pressed against the surface of the surface plate, and the wafer holder is movable in the X and Y directions on the surface of the surface plate. Features of semiconductor wafer polishing equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62311194A JPH01153266A (en) | 1987-12-08 | 1987-12-08 | Polishing device of semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62311194A JPH01153266A (en) | 1987-12-08 | 1987-12-08 | Polishing device of semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01153266A true JPH01153266A (en) | 1989-06-15 |
Family
ID=18014227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62311194A Pending JPH01153266A (en) | 1987-12-08 | 1987-12-08 | Polishing device of semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01153266A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0687526A1 (en) * | 1994-04-18 | 1995-12-20 | Shin-Etsu Handotai Company Limited | Polishing method and apparatus for automatic reduction of wafer taper in single-wafer polishing |
| KR100412478B1 (en) * | 1995-10-27 | 2003-12-31 | 어플라이드 머티어리얼스, 인코포레이티드 | Processing system for chemical mechanical polishing |
| US7097544B1 (en) | 1995-10-27 | 2006-08-29 | Applied Materials Inc. | Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62193767A (en) * | 1986-02-18 | 1987-08-25 | Nec Corp | Disc polishing attachment |
-
1987
- 1987-12-08 JP JP62311194A patent/JPH01153266A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62193767A (en) * | 1986-02-18 | 1987-08-25 | Nec Corp | Disc polishing attachment |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0687526A1 (en) * | 1994-04-18 | 1995-12-20 | Shin-Etsu Handotai Company Limited | Polishing method and apparatus for automatic reduction of wafer taper in single-wafer polishing |
| US5620357A (en) * | 1994-04-18 | 1997-04-15 | Shin-Etsu Handotai Co., Ltd. | Polishing method and apparatus for automatic reduction of wafer taper in single-wafer polishing |
| KR100412478B1 (en) * | 1995-10-27 | 2003-12-31 | 어플라이드 머티어리얼스, 인코포레이티드 | Processing system for chemical mechanical polishing |
| US7097544B1 (en) | 1995-10-27 | 2006-08-29 | Applied Materials Inc. | Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion |
| US7238090B2 (en) | 1995-10-27 | 2007-07-03 | Applied Materials, Inc. | Polishing apparatus having a trough |
| US7255632B2 (en) | 1995-10-27 | 2007-08-14 | Applied Materials, Inc. | Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion |
| JP2008078673A (en) * | 1995-10-27 | 2008-04-03 | Applied Materials Inc | Device and method for polishing |
| US7614939B2 (en) | 1995-10-27 | 2009-11-10 | Applied Materials, Inc. | Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion |
| JP4641540B2 (en) * | 1995-10-27 | 2011-03-02 | アプライド マテリアルズ インコーポレイテッド | Polishing apparatus and polishing method |
| US8079894B2 (en) | 1995-10-27 | 2011-12-20 | Applied Materials, Inc. | Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3911082B2 (en) | Polishing apparatus and polishing method for object having flat surface using belt type polishing pad | |
| US6183343B1 (en) | Polishing apparatus with defined pattern | |
| US20020068450A1 (en) | Method for chemical mechanical polishing | |
| KR20020017943A (en) | Semiconductor wafer grinding method | |
| KR100432781B1 (en) | Apparatus and method for measuring polishing pad | |
| JPH01153266A (en) | Polishing device of semiconductor wafer | |
| JP2003257911A (en) | Dressing method and dressing device, polishing device, and semiconductor device and manufacturing method thereof | |
| JPH10315131A (en) | Polishing method of semiconductor wafer and device therefor | |
| JPH09174401A (en) | Chamfering and outer periphery machining device for work | |
| JP2002100597A (en) | Method and device for polishing | |
| JP3172778B2 (en) | Fully automatic polishing equipment for semiconductor wafers | |
| JP2003517936A (en) | Equipment for chemical mechanical planarization | |
| JP2009248234A (en) | Holding device and polishing device | |
| JP2002224938A (en) | Grinding device and grinding method for plate shape workpiece | |
| CN112692721A (en) | Wafer positioning device and scratch tracking method for CMP (chemical mechanical polishing) process | |
| JP2002172550A (en) | Polishing device, polishing method and workpiece obtained with use of the device or method | |
| JP2002046055A (en) | Polishing apparatus | |
| JP7203542B2 (en) | Machining system and method | |
| JP3007678B2 (en) | Polishing apparatus and polishing method | |
| JP3584058B2 (en) | Wafer notch mirror polishing method and apparatus | |
| JP2014042959A (en) | Grinding apparatus | |
| TW202212052A (en) | Grinding device to shorten the grinding time and make the in-plane thickness of the ground wafer uniform | |
| JP7291056B2 (en) | Wafer polishing method | |
| JPH07201788A (en) | Semiconductor grinder | |
| KR100494145B1 (en) | Method for polishing the semiconductor wafer by Chemical Mechanical Polishing device |