JPH01148686U - - Google Patents
Info
- Publication number
- JPH01148686U JPH01148686U JP4435588U JP4435588U JPH01148686U JP H01148686 U JPH01148686 U JP H01148686U JP 4435588 U JP4435588 U JP 4435588U JP 4435588 U JP4435588 U JP 4435588U JP H01148686 U JPH01148686 U JP H01148686U
- Authority
- JP
- Japan
- Prior art keywords
- lead terminals
- accommodating part
- socket
- intervals
- contact pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005192 partition Methods 0.000 claims 2
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Description
第1図は本考案によるICソケツトのソケツト
本体の斜視図、第2図はICパツケージを装着し
た状態を示す第1図の―線に沿う断面図、第
3図はICパツケージを装着した状態を示す第1
図の―線に沿う断面図、第4図は従来のIC
ソケツトの縦断面図、第5図は従来のICソケツ
トの全体の構成を示す分解斜視図、第6図はIC
パツケージを装着した従来ICソケツトの部分縦
断面図である。
1……ソケツト本体、2……スペーサ、3……
押えカバー、4……リベツト、6……コンタクト
ピン、7……収容部、8,9……ガイド壁。
Fig. 1 is a perspective view of the socket body of the IC socket according to the present invention, Fig. 2 is a sectional view taken along the line - - of Fig. 1 showing the state in which the IC package is attached, and Fig. 3 is the state in which the IC package is attached. 1st to show
A cross-sectional view taken along the line - in the figure, Figure 4 is a conventional IC.
5 is an exploded perspective view showing the overall structure of a conventional IC socket, and FIG. 6 is an IC socket.
FIG. 2 is a partial vertical sectional view of a conventional IC socket with a package attached thereto. 1...Socket body, 2...Spacer, 3...
Presser cover, 4... Rivet, 6... Contact pin, 7... Housing section, 8, 9... Guide wall.
Claims (1)
容部内に装着し、上記収容部の周辺に沿つて列設
された多数の仕切壁の各間に上記リード端子と接
触すべきコンタクトピンが配設されていて、これ
らリード端子とコンタクトピンの接続及び接続解
除を押えカバーの上下動により行うようにしたI
Cソケツトにおいて、収容部に対して相対向する
上記仕切壁の相互間を連結して成るガイド壁が間
隔を置いて上記収容部内に立設し、上記各ガイド
壁の稜線に沿つた両端部の夫々に上記リード端子
間へ分け入る嵌入部を形成したことを特徴とする
ICソケツト。 An IC package with curved lead terminals is mounted in a housing part, and contact pins to be in contact with the lead terminals are arranged between each of a number of partition walls arranged along the periphery of the housing part. The connection and disconnection between these lead terminals and contact pins is performed by vertical movement of the holding cover.
In the C-socket, guide walls formed by connecting the partition walls facing each other with respect to the accommodating part are erected in the accommodating part at intervals, and both ends of the guide walls along the ridge line are arranged vertically at intervals in the accommodating part. An IC socket characterized in that each of the sockets is formed with a fitting part that fits between the lead terminals.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988044355U JPH0619173Y2 (en) | 1988-04-01 | 1988-04-01 | IC socket |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988044355U JPH0619173Y2 (en) | 1988-04-01 | 1988-04-01 | IC socket |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01148686U true JPH01148686U (en) | 1989-10-16 |
JPH0619173Y2 JPH0619173Y2 (en) | 1994-05-18 |
Family
ID=31270716
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988044355U Expired - Lifetime JPH0619173Y2 (en) | 1988-04-01 | 1988-04-01 | IC socket |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0619173Y2 (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62100689U (en) * | 1985-12-13 | 1987-06-26 |
-
1988
- 1988-04-01 JP JP1988044355U patent/JPH0619173Y2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62100689U (en) * | 1985-12-13 | 1987-06-26 |
Also Published As
Publication number | Publication date |
---|---|
JPH0619173Y2 (en) | 1994-05-18 |