JPH01146545U - - Google Patents
Info
- Publication number
- JPH01146545U JPH01146545U JP1988043040U JP4304088U JPH01146545U JP H01146545 U JPH01146545 U JP H01146545U JP 1988043040 U JP1988043040 U JP 1988043040U JP 4304088 U JP4304088 U JP 4304088U JP H01146545 U JPH01146545 U JP H01146545U
- Authority
- JP
- Japan
- Prior art keywords
- light
- receiving element
- element chip
- conductive resin
- inner layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988043040U JPH01146545U (US06534493-20030318-C00166.png) | 1988-03-30 | 1988-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988043040U JPH01146545U (US06534493-20030318-C00166.png) | 1988-03-30 | 1988-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01146545U true JPH01146545U (US06534493-20030318-C00166.png) | 1989-10-09 |
Family
ID=31269441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988043040U Pending JPH01146545U (US06534493-20030318-C00166.png) | 1988-03-30 | 1988-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01146545U (US06534493-20030318-C00166.png) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6291811B1 (en) | 1997-04-09 | 2001-09-18 | Nec Corporation | Solid state image sensing element improved in sensitivity and production cost, process of fabrication thereof and solid state image sensing device using the same |
| JP2002246613A (ja) * | 2001-02-14 | 2002-08-30 | Seiko Instruments Inc | 光機能モジュールとその製造方法 |
| JP2004363238A (ja) * | 2003-06-03 | 2004-12-24 | Kingpak Technology Inc | 整合型のイメージセンサモジュール |
| JP2012009611A (ja) * | 2010-06-24 | 2012-01-12 | Murata Mfg Co Ltd | 回路モジュール |
-
1988
- 1988-03-30 JP JP1988043040U patent/JPH01146545U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6291811B1 (en) | 1997-04-09 | 2001-09-18 | Nec Corporation | Solid state image sensing element improved in sensitivity and production cost, process of fabrication thereof and solid state image sensing device using the same |
| JP2002246613A (ja) * | 2001-02-14 | 2002-08-30 | Seiko Instruments Inc | 光機能モジュールとその製造方法 |
| JP2004363238A (ja) * | 2003-06-03 | 2004-12-24 | Kingpak Technology Inc | 整合型のイメージセンサモジュール |
| JP2012009611A (ja) * | 2010-06-24 | 2012-01-12 | Murata Mfg Co Ltd | 回路モジュール |
