JPH01146346A - Integrated circuit package - Google Patents
Integrated circuit packageInfo
- Publication number
- JPH01146346A JPH01146346A JP30654587A JP30654587A JPH01146346A JP H01146346 A JPH01146346 A JP H01146346A JP 30654587 A JP30654587 A JP 30654587A JP 30654587 A JP30654587 A JP 30654587A JP H01146346 A JPH01146346 A JP H01146346A
- Authority
- JP
- Japan
- Prior art keywords
- main body
- lead pins
- package main
- lead
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000006073 displacement reaction Methods 0.000 abstract description 4
- 230000002159 abnormal effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、集積回路のパッケージ、特にフラット型のパ
ッケージに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to integrated circuit packages, particularly flat type packages.
従来、この種のパッケージは、第３図の側面図に示すよ
うに、リードピン４はパッケージ本体１の側面から直線
的に外部に引出されている。しかも、外部の基板に半田
等で固定されるため、その際リードピンやパッケージ本
体に無理な力が加わった状態にある。Conventionally, in this type of package, the lead pins 4 are linearly drawn out from the side surface of the package body 1, as shown in the side view of FIG. Moreover, since it is fixed to an external board with solder or the like, unreasonable force is applied to the lead pins and the package body.
上述した従来のパッケージでは、パッケージ本体から直
線的に引出されているリードピンが、そのまま基板へ半
田付で固定されているため、外力によって基板に変位や
振動が生じると、外部の変化が直接パッケージ本体に加
わり、その結果、リードピンやパッケージ本体が損傷し
たり、ビン抜けが生じるという欠点があった。In the conventional package described above, the lead pins that are drawn out linearly from the package body are directly fixed to the board by soldering. Therefore, when displacement or vibration occurs on the board due to external force, external changes will directly affect the package body. As a result, lead pins and the package body may be damaged, and the bottle may fall out.
上記問題点に対し本発明の集積回路パッケージでは、リ
ードピンの長さの中間部に凸状の折曲げ部を形成してお
くことによって、このパッケージを取付けた基板の振動
や変位に起因するパッケージ本体の変形を吸収する緩衝
部となし、外力によるパッケージ本体やリードピンの損
傷を防いでい′る。To address the above-mentioned problems, the integrated circuit package of the present invention has a convex bent portion formed in the middle of the length of the lead pin. This serves as a buffer that absorbs deformation of the package and prevents damage to the package body and lead pins due to external forces.
つぎに本発明を実施例により説明する。 Next, the present invention will be explained by examples.
第１図は本発明の一実施例の側面図である。第１図にお
いて、パッケージ本体１０両側面から外部に引き出され
ているリードピン２の長さの中間部において、上方に凸
起した形の曲げ部２ａを有する。FIG. 1 is a side view of one embodiment of the present invention. In FIG. 1, a lead pin 2 extending outward from both side surfaces of a package body 10 has an upwardly protruding bent portion 2a at an intermediate length thereof.
第２図は本発明の他の実施例の平面図である。FIG. 2 is a plan view of another embodiment of the invention.
第２図において、パッケージ本体１の四方へ引出されて
いる多数のリードピン３は、長さの中間部において、横
方向に凸起した形の曲げ部３ａを有する。本例は左右の
変位に対し曲げ部３ａの緩衝作用が第１図の場合より有
効に働らくという効果がある。In FIG. 2, a large number of lead pins 3 drawn out in all directions of the package body 1 have a bent portion 3a that is convex in the lateral direction at an intermediate portion of the length. This example has the effect that the buffering action of the bent portion 3a against left and right displacements works more effectively than in the case of FIG. 1.
以上説明したように本発明は、リードピンに凸状の曲げ
緩衝部を設けることにより、外力による基板の変位から
生じるリードピンやパッケージ本体の変形を吸収するこ
とができ、外力によってパッケージ本体に無理な力が加
わったときのパッケージ本体やリードピンの損傷やビン
抜けを防ぐ効果がある。As explained above, by providing a convex bending buffer on the lead pin, the present invention can absorb the deformation of the lead pin and the package body caused by the displacement of the board due to external force. This has the effect of preventing damage to the package body and lead pins, as well as preventing the bottle from falling out when exposed to water.
第１図は本発明の一実施例の側面図、第２図は本発明の
他の実施例の平面図、第３図は従来の集積回路パッケー
ジの側面図である。
■・・・・・・パッケージ本体、２，３．４・旧・・リ
ードピン、２ａ、３ａ・・印・リードピン中間部の曲げ
部。
代理人 弁理士 内 原 晋FIG. 1 is a side view of one embodiment of the present invention, FIG. 2 is a plan view of another embodiment of the present invention, and FIG. 3 is a side view of a conventional integrated circuit package. ■・・・Package body, 2, 3.4 Old lead pin, 2a, 3a Mark Bend part in the middle of the lead pin. Agent Patent Attorney Susumu Uchihara
Claims (1)
ている集積回路パッケージにおいて、前記リードピンは
長さの中間部で凸状に曲げられた曲げ部を有することを
特徴とする集積回路パッケージ。1. An integrated circuit package in which a number of lead pins are drawn out to the outside of a package body, wherein each of the lead pins has a convexly bent portion at an intermediate portion of its length.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30654587A JPH01146346A (en) | 1987-12-02 | 1987-12-02 | Integrated circuit package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30654587A JPH01146346A (en) | 1987-12-02 | 1987-12-02 | Integrated circuit package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01146346A true JPH01146346A (en) | 1989-06-08 |
Family
ID=17958327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30654587A Pending JPH01146346A (en) | 1987-12-02 | 1987-12-02 | Integrated circuit package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01146346A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5328870A (en) * | 1992-01-17 | 1994-07-12 | Amkor Electronics, Inc. | Method for forming plastic molded package with heat sink for integrated circuit devices |
| US5701034A (en) * | 1994-05-03 | 1997-12-23 | Amkor Electronics, Inc. | Packaged semiconductor die including heat sink with locking feature |
-
1987
- 1987-12-02 JP JP30654587A patent/JPH01146346A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5328870A (en) * | 1992-01-17 | 1994-07-12 | Amkor Electronics, Inc. | Method for forming plastic molded package with heat sink for integrated circuit devices |
| US5455462A (en) * | 1992-01-17 | 1995-10-03 | Amkor Electronics, Inc. | Plastic molded package with heat sink for integrated circuit devices |
| US5701034A (en) * | 1994-05-03 | 1997-12-23 | Amkor Electronics, Inc. | Packaged semiconductor die including heat sink with locking feature |
| US5722161A (en) * | 1994-05-03 | 1998-03-03 | Amkor Electronics, Inc. | Method of making a packaged semiconductor die including heat sink with locking feature |
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