JPH01143144U - - Google Patents

Info

Publication number

JPH01143144U

JPH01143144U JP3931088U JP3931088U JPH01143144U JP H01143144 U JPH01143144 U JP H01143144U JP 3931088 U JP3931088 U JP 3931088U JP 3931088 U JP3931088 U JP 3931088U JP H01143144 U JPH01143144 U JP H01143144U

Authority

JP

Japan

Prior art keywords

lead frame

semiconductor element

heat radiation

circuit pattern

circuit

Prior art date

1988-03-24

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 8
• 230000005855 radiation Effects 0.000 claims description 4
• 239000011347 resin Substances 0.000 claims description 2
• 229920005989 resin Polymers 0.000 claims description 2
• 230000017525 heat dissipation Effects 0.000 claims 1
• 238000000465 moulding Methods 0.000 claims 1
• 230000008878 coupling Effects 0.000 description 1
• 238000010168 coupling process Methods 0.000 description 1
• 238000005859 coupling reaction Methods 0.000 description 1
• 230000003287 optical effect Effects 0.000 description 1