JPH01143128U - - Google Patents

Info

Publication number
JPH01143128U
JPH01143128U JP3850188U JP3850188U JPH01143128U JP H01143128 U JPH01143128 U JP H01143128U JP 3850188 U JP3850188 U JP 3850188U JP 3850188 U JP3850188 U JP 3850188U JP H01143128 U JPH01143128 U JP H01143128U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
view
semiconductor integrated
inner lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3850188U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3850188U priority Critical patent/JPH01143128U/ja
Publication of JPH01143128U publication Critical patent/JPH01143128U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP3850188U 1988-03-24 1988-03-24 Pending JPH01143128U (US07923587-20110412-C00001.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3850188U JPH01143128U (US07923587-20110412-C00001.png) 1988-03-24 1988-03-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3850188U JPH01143128U (US07923587-20110412-C00001.png) 1988-03-24 1988-03-24

Publications (1)

Publication Number Publication Date
JPH01143128U true JPH01143128U (US07923587-20110412-C00001.png) 1989-10-02

Family

ID=31265045

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3850188U Pending JPH01143128U (US07923587-20110412-C00001.png) 1988-03-24 1988-03-24

Country Status (1)

Country Link
JP (1) JPH01143128U (US07923587-20110412-C00001.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04123536U (ja) * 1991-04-26 1992-11-09 サンケン電気株式会社 電子部品
JP2011216918A (ja) * 2011-08-01 2011-10-27 Dainippon Printing Co Ltd 樹脂封止型半導体装置および半導体装置用回路部材

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04123536U (ja) * 1991-04-26 1992-11-09 サンケン電気株式会社 電子部品
JP2011216918A (ja) * 2011-08-01 2011-10-27 Dainippon Printing Co Ltd 樹脂封止型半導体装置および半導体装置用回路部材

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