JPH01140878U - - Google Patents

Info

Publication number

JPH01140878U

JPH01140878U JP3726988U JP3726988U JPH01140878U JP H01140878 U JPH01140878 U JP H01140878U JP 3726988 U JP3726988 U JP 3726988U JP 3726988 U JP3726988 U JP 3726988U JP H01140878 U JPH01140878 U JP H01140878U

Authority

JP

Japan

Prior art keywords

package

semiconductor element

wiring board

printed wiring

lead

Prior art date

1988-03-22

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 7
• 230000002093 peripheral effect Effects 0.000 claims description 3
• 238000010586 diagram Methods 0.000 description 2
• 230000037431 insertion Effects 0.000 description 1
• 238000003780 insertion Methods 0.000 description 1