JPH01140876U - - Google Patents

Info

Publication number
JPH01140876U
JPH01140876U JP3632288U JP3632288U JPH01140876U JP H01140876 U JPH01140876 U JP H01140876U JP 3632288 U JP3632288 U JP 3632288U JP 3632288 U JP3632288 U JP 3632288U JP H01140876 U JPH01140876 U JP H01140876U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
semiconductor package
semiconductor
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3632288U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3632288U priority Critical patent/JPH01140876U/ja
Publication of JPH01140876U publication Critical patent/JPH01140876U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP3632288U 1988-03-22 1988-03-22 Pending JPH01140876U (US06521211-20030218-C00004.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3632288U JPH01140876U (US06521211-20030218-C00004.png) 1988-03-22 1988-03-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3632288U JPH01140876U (US06521211-20030218-C00004.png) 1988-03-22 1988-03-22

Publications (1)

Publication Number Publication Date
JPH01140876U true JPH01140876U (US06521211-20030218-C00004.png) 1989-09-27

Family

ID=31262933

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3632288U Pending JPH01140876U (US06521211-20030218-C00004.png) 1988-03-22 1988-03-22

Country Status (1)

Country Link
JP (1) JPH01140876U (US06521211-20030218-C00004.png)

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