JPH01140799A - Cooling structure for electronic device - Google Patents

Cooling structure for electronic device

Info

Publication number
JPH01140799A
JPH01140799A JP29959887A JP29959887A JPH01140799A JP H01140799 A JPH01140799 A JP H01140799A JP 29959887 A JP29959887 A JP 29959887A JP 29959887 A JP29959887 A JP 29959887A JP H01140799 A JPH01140799 A JP H01140799A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
pistons
ics
plate
bases
lsis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29959887A
Inventor
Masashi Umesato
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To cool high heat quantity due to high density mounting and to remarkably improve cooling capacity by providing thermal conduction bases inserted in contact between pistons and ICs for transferring heat dissipated from ICs to the pistons and cold plates.
CONSTITUTION: Thermal transfer bases 13 are mounted on the upper faces of a plurality of ICs placed on both side faces of a daughter board 2, and pistons 12 are provided corresponding to the positions of the LSIs 4. The pistons 12 are associated together with springs 10 with a cold plate 9 so that the pistons 12 and the plate 9 are brought into contact at the whole peripheries. That is, refrigerant flows in the plate 9, the LSIs 4 are cooled through the plates 9, the pistons 12 and the bases 13. Thus, its cooling capacity is improved, high heat quantity due to high density mounting can be cooled, and since a fan and the like are not employed, a noise is eliminated.
COPYRIGHT: (C)1989,JPO&Japio
JP29959887A 1987-11-27 1987-11-27 Cooling structure for electronic device Pending JPH01140799A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29959887A JPH01140799A (en) 1987-11-27 1987-11-27 Cooling structure for electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29959887A JPH01140799A (en) 1987-11-27 1987-11-27 Cooling structure for electronic device

Publications (1)

Publication Number Publication Date
JPH01140799A true true JPH01140799A (en) 1989-06-01

Family

ID=17874708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29959887A Pending JPH01140799A (en) 1987-11-27 1987-11-27 Cooling structure for electronic device

Country Status (1)

Country Link
JP (1) JPH01140799A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004501718A (en) * 2000-07-05 2004-01-22 ベイビーズ ブレス リミテッド Aerosol inhalation interface
US6771509B2 (en) 1992-05-20 2004-08-03 Seiko Epson Corporation Cartridge for electronic devices

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6771509B2 (en) 1992-05-20 2004-08-03 Seiko Epson Corporation Cartridge for electronic devices
US6845014B2 (en) 1992-05-20 2005-01-18 Seiko Epson Corporation Cartridge for electronic devices
US7035108B2 (en) 1992-05-20 2006-04-25 Seiko Epson Corporation Information processing device
JP2004501718A (en) * 2000-07-05 2004-01-22 ベイビーズ ブレス リミテッド Aerosol inhalation interface

Similar Documents

Publication Publication Date Title
US4631636A (en) High density packaging technique for electronic systems
US6591898B1 (en) Integrated heat sink system for a closed electronics container
US5926367A (en) Method and apparatus for the thermal management of electronic devices
US6164076A (en) Thermoelectric cooling assembly with thermal space transformer interposed between cascaded thermoelectric stages for improved thermal performance
US7400505B2 (en) Hybrid cooling system and method for a multi-component electronics system
US4145708A (en) Power module with isolated substrates cooled by integral heat-energy-removal means
US6661664B2 (en) Electronic module with high cooling power
US20110277967A1 (en) Liquid cooled condensers for loop heat pipe like enclosure cooling
US20080225478A1 (en) Heat Exchange System for Blade Server Systems and Method
US5036384A (en) Cooling system for IC package
US6305463B1 (en) Air or liquid cooled computer module cold plate
US5986882A (en) Electronic apparatus having removable processor/heat pipe cooling device modules therein
US3904933A (en) Cooling apparatus for electronic modules
US6205022B1 (en) Apparatus for managing heat in a computer environment or the like
US5049982A (en) Article comprising a stacked array of electronic subassemblies
US7149087B2 (en) Liquid cooled heat sink with cold plate retention mechanism
US5424916A (en) Combination conductive and convective heatsink
US20080084664A1 (en) Liquid-based cooling system for cooling a multi-component electronics system
US4627242A (en) Thermoelectric cooler
US4979074A (en) Printed circuit board heat sink
US4442475A (en) Tapered seal for flow-through module
US5001601A (en) Modular cooling fixture for power transistors
US4665467A (en) Heat transfer mounting device
JPH01233796A (en) Radiator
DE3203609A1 (en) Cooling device for integrated components