JPH01133393A - Mounting method for electronic component - Google Patents
Mounting method for electronic componentInfo
- Publication number
- JPH01133393A JPH01133393A JP62291203A JP29120387A JPH01133393A JP H01133393 A JPH01133393 A JP H01133393A JP 62291203 A JP62291203 A JP 62291203A JP 29120387 A JP29120387 A JP 29120387A JP H01133393 A JPH01133393 A JP H01133393A
- Authority
- JP
- Japan
- Prior art keywords
- components
- electronic components
- substrate
- solders
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 9
- 229910000679 solder Inorganic materials 0.000 claims abstract description 20
- 239000006071 cream Substances 0.000 abstract description 8
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 8
- 238000005476 soldering Methods 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は印刷配線板への電子部品の実装法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of mounting electronic components on printed wiring boards.
従来の技術
従来、この種の電子部品の実装法としては、半田ごてを
用いて部品を１つづつ半田付けする方法や、環状または
棒状の糸半田を電子部品または印刷配線板のいずれか一
方にあらかじめ接着剤で接着しておき、電子部品を印刷
配線板の所定位置に配置してから、高温トンネル炉中を
通過させて、複数個の電子部品を印刷配線板に同時に半
田付けする溶融塗着法が知られている。Conventional technology Conventionally, methods for mounting this type of electronic component include soldering the components one by one using a soldering iron, or applying ring-shaped or rod-shaped thread solder to either the electronic component or the printed wiring board. Melt coating is a process in which multiple electronic components are soldered to the printed wiring board at the same time by adhering them with adhesive in advance, placing them in predetermined positions on the printed wiring board, and then passing them through a high-temperature tunnel furnace. The method of wearing it is known.
発明が解決しようとする問題点
上記のように半田ごてを用いて部品を１つづつ半ｔｔＪ
付けする方法では作業能率が悪いという問題があった。Problems to be Solved by the Invention As mentioned above, parts are soldered one by one using a soldering iron.
The problem with this method was that work efficiency was poor.
また溶融塗着法では、半田を接着しておくために接着剤
を使用しており、高温トンネル炉内を通過させると、接
着剤の熱分解生成物が半田付けする金属の表面を汚染し
、半田付は性が阻害されたり、環状または棒状の糸半田
と半田付けすべきものとの接着が不充分となって衝撃な
どにより簡単゛に破壊し、せっかく接着した棒状または
環状の糸半田と一半田付けすべきものとが分離するなど
の問題があった。In addition, in the melt-applying method, adhesive is used to hold the solder together, and when passed through a high-temperature tunnel furnace, thermal decomposition products of the adhesive contaminate the surface of the metal to be soldered. Soldering properties may be impaired, or the adhesion between the ring-shaped or rod-shaped solder thread and the object to be soldered may be insufficient, causing it to easily break due to impact, etc. There were problems such as the items that were supposed to be attached being separated.
本発明はこのような問題点を解決するもので、電子部品
の実装作業の高能率化を図るとともに、電子部品と印刷
配線板を電気機械的に強固に接続することを目的とする
ものである。The present invention is intended to solve these problems, and aims to improve the efficiency of electronic component mounting work and to provide a strong electromechanical connection between electronic components and printed wiring boards. .
問題点を解決するための手段
この問題点を解決するために本発明は、複数個の電子部
品が歳入できる複数個の四部を備えた位置決め板の前記
凹部に前記複数個の電子部品をそれぞれ嵌入した状態で
、位置決め板を印刷配線板に当てがい、前記複数個の電
子部品の端子を印刷配線板上に塗布された半田部に対し
て電気機械的に接続するものである。Means for Solving the Problem In order to solve this problem, the present invention provides a method of fitting the plurality of electronic components into the recesses of a positioning plate having a plurality of four parts into which the plurality of electronic components can be inserted. In this state, the positioning plate is applied to the printed wiring board, and the terminals of the plurality of electronic components are electromechanically connected to the solder portions applied on the printed wiring board.
作用
この構成により、複数個の電子部品を印刷配線板に実装
するに際し、従来のような半田付は部が分離するような
ことなく、実装作業の高能率化を図るとともに電子部品
を印刷配線板に電気機械的に強固に接続することができ
る。Function: With this configuration, when multiple electronic components are mounted on a printed wiring board, the soldering parts do not separate like in conventional methods, making the mounting work more efficient and allowing the electronic components to be mounted on the printed wiring board. A strong electromechanical connection can be made to the
実施例
以下、本発明の一実施例について、図面に基づいて説明
する。EXAMPLE Hereinafter, an example of the present invention will be described based on the drawings.
第１図〜第３図において、１は複数個の電子部品２を所
定位置に収り付番する印刷配線板、３はこの印刷配線板
１の電子部品取付位買に合った位置に電子部品嵌入用の
凹部４を複数個備えている位置決め板である。In FIGS. 1 to 3, 1 is a printed wiring board on which a plurality of electronic components 2 are placed in predetermined positions and numbered, and 3 is a printed wiring board in which electronic components are placed at positions that match the mounting position of the electronic components on this printed wiring board 1. This is a positioning plate that includes a plurality of recesses 4 for insertion.
＃記電子郡品２は位置決め板３の凹部４に嵌入され、一
方前記印刷配線板１には電子部品２を電気機械的に接続
する箇所にクリーム半田５を塗布しておき、この塗布さ
れたクリーム半田５の部分に電子部品２の端子６が当接
するように前記位置決め板３を印刷配線板１に当てかう
。この状態でクリーム半田５を位置決め板３の外側から
加熱することによりクリーム半田５が溶融してクリーム
半Ｉｌｌ ５と端子６とが接続される。クリーム半田５
の硬化後、前記印刷配線板１から位置決め板３を取り除
Ｃブば第３図に示すように印刷配線板１上での電子部品
２の実装が完了する。以上の工程により複数個の電子部
品２は印刷配線板１に電気機械的に強固に接続されるこ
とになる。#The electronic component 2 is fitted into the recess 4 of the positioning plate 3, while the printed wiring board 1 is coated with cream solder 5 at the locations where the electronic components 2 are electromechanically connected. The positioning plate 3 is placed on the printed wiring board 1 so that the terminals 6 of the electronic component 2 come into contact with the cream solder 5. In this state, by heating the cream solder 5 from the outside of the positioning plate 3, the cream solder 5 is melted and the cream solder 5 and the terminal 6 are connected. cream solder 5
After curing, the positioning plate 3 is removed from the printed wiring board 1, and the mounting of the electronic components 2 on the printed wiring board 1 is completed as shown in FIG. Through the above steps, the plurality of electronic components 2 are firmly electromechanically connected to the printed wiring board 1.
なお、図面に示す実施例では複数個の電子部品２はとも
に同じ形状をデしているが、実装される電子部品２の種
類や形状は互いに異なっていても良く、その場合電子部
品２に応じた凹部を持つ位置決め板を用意しておけば良
い。また、実装される部品がたとえば抵抗であって、抵
抗値の異なる抵抗であっても形状が同じであれば同じ位
置決め板３を使用することができる。さらに、＃記位置
決め板３に複数個の電子部品２全体を覆うたとえば金属
板からなるシールド板を埋設しておき、位置決め板３を
印刷配線板１に取り付けた状態を最終実装状態とし、前
記シールド板により電子部品２を電気的にシールドする
ようにすることも可能である。In the embodiment shown in the drawings, the plurality of electronic components 2 all have the same shape, but the types and shapes of the electronic components 2 to be mounted may be different from each other. It is sufficient to prepare a positioning plate with a recessed portion. Furthermore, even if the mounted components are resistors, for example, and the resistors have different resistance values, the same positioning plate 3 can be used as long as they have the same shape. Further, a shield plate made of, for example, a metal plate is embedded in the # marked positioning plate 3 to cover the entire plurality of electronic components 2, and the state in which the positioning plate 3 is attached to the printed wiring board 1 is defined as the final mounting state, and the shield It is also possible to electrically shield the electronic component 2 with a plate.
発明の効果
以上のように本発明によれば、複数個の電子部品が嵌入
できる複数個の凹部を備えた位置決め板を用い、前記複
数個の電子部品を前記凹部にそれぞれ嵌入した状態で位
置決め板を印刷配線板に当てがい、前記複数個の電子部
品の端子を印刷配線板上に塗布された半田部に対して電
気機械的に接続することにより、従来のような半田付は
部が分離するようなことなく、実装作業の高能率化を図
るとともに電子部品を印刷配線板に電気機械的に強固に
接続することができる。Effects of the Invention As described above, according to the present invention, a positioning plate having a plurality of recesses into which a plurality of electronic components can be fitted is used, and the positioning plate is provided with the plurality of electronic components fitted into the respective recesses. is applied to a printed wiring board, and the terminals of the plurality of electronic components are electromechanically connected to the solder parts applied on the printed wiring board, which separates the parts from conventional soldering. Without this, it is possible to improve the efficiency of the mounting work and to firmly connect electronic components to the printed wiring board electromechanically.
図面は本発明の一実施例を示すもので、第１図は分解斜
視図、第２図は位置決め板を印栢配線板に当てがっだ状
態を示す断面図、第３図は実装後において印刷配線板か
ら位置決め板を取り外した状態を示す完成斜視図である
。
１・・・印刷配線板、２・・・電子部品、３・・・位置
決め板、４・・・凹部、５・・・クリーム半田、６・・
・端子。
代理人 森 本 義 弘
第２図The drawings show one embodiment of the present invention; Fig. 1 is an exploded perspective view, Fig. 2 is a cross-sectional view showing the positioning plate applied to the inkling wiring board, and Fig. 3 is a diagram showing the state after mounting. FIG. 3 is a completed perspective view showing a state in which the positioning plate is removed from the printed wiring board. DESCRIPTION OF SYMBOLS 1... Printed wiring board, 2... Electronic component, 3... Positioning plate, 4... Recessed part, 5... Cream solder, 6...
・Terminal. Agent Yoshihiro MorimotoFigure 2
Claims (1)
た位置決め板の前記凹部に前記複数個の電子部品をそれ
ぞれ嵌入した状態で、位置決め板を印刷配線板に当てが
い、前記複数個の電子部品の端子を印刷配線板上に塗布
された半田部に対して電気機械的に接続する電子部品の
実装法。1. With the plurality of electronic components fitted into the respective recesses of a positioning plate having a plurality of recesses into which a plurality of electronic components can be fitted, the positioning plate is applied to a printed wiring board, and the plurality of electronic components are inserted into the positioning plate. A mounting method for electronic components that electromechanically connects terminals to solder applied to a printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62291203A JPH01133393A (en) | 1987-11-18 | 1987-11-18 | Mounting method for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62291203A JPH01133393A (en) | 1987-11-18 | 1987-11-18 | Mounting method for electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01133393A true JPH01133393A (en) | 1989-05-25 |
Family
ID=17765793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62291203A Pending JPH01133393A (en) | 1987-11-18 | 1987-11-18 | Mounting method for electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01133393A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05206688A (en) * | 1992-01-24 | 1993-08-13 | Toshiba Corp | Semiconductor device and surface mounting of the same |
| JPH05327283A (en) * | 1992-02-18 | 1993-12-10 | Samsung Electron Co Ltd | Perpendicular mounting apparatus for semiconductor package and mounting method thereof |
-
1987
- 1987-11-18 JP JP62291203A patent/JPH01133393A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05206688A (en) * | 1992-01-24 | 1993-08-13 | Toshiba Corp | Semiconductor device and surface mounting of the same |
| JPH05327283A (en) * | 1992-02-18 | 1993-12-10 | Samsung Electron Co Ltd | Perpendicular mounting apparatus for semiconductor package and mounting method thereof |
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