JPH01127255U - - Google Patents
Info
- Publication number
- JPH01127255U JPH01127255U JP2265888U JP2265888U JPH01127255U JP H01127255 U JPH01127255 U JP H01127255U JP 2265888 U JP2265888 U JP 2265888U JP 2265888 U JP2265888 U JP 2265888U JP H01127255 U JPH01127255 U JP H01127255U
- Authority
- JP
- Japan
- Prior art keywords
- chip carrier
- bridge
- ceramic substrate
- assembled
- carrier type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2265888U JPH01127255U (US06373033-20020416-M00071.png) | 1988-02-22 | 1988-02-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2265888U JPH01127255U (US06373033-20020416-M00071.png) | 1988-02-22 | 1988-02-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01127255U true JPH01127255U (US06373033-20020416-M00071.png) | 1989-08-31 |
Family
ID=31240968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2265888U Pending JPH01127255U (US06373033-20020416-M00071.png) | 1988-02-22 | 1988-02-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01127255U (US06373033-20020416-M00071.png) |
-
1988
- 1988-02-22 JP JP2265888U patent/JPH01127255U/ja active Pending
