JPH01125573U - - Google Patents
Info
- Publication number
- JPH01125573U JPH01125573U JP2092688U JP2092688U JPH01125573U JP H01125573 U JPH01125573 U JP H01125573U JP 2092688 U JP2092688 U JP 2092688U JP 2092688 U JP2092688 U JP 2092688U JP H01125573 U JPH01125573 U JP H01125573U
- Authority
- JP
- Japan
- Prior art keywords
- hybrid
- terminals
- insulating sheet
- base ribbon
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988020926U JP2514430Y2 (ja) | 1988-02-19 | 1988-02-19 | ハイブリッドｉｃ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988020926U JP2514430Y2 (ja) | 1988-02-19 | 1988-02-19 | ハイブリッドｉｃ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01125573U true JPH01125573U (US20100012521A1-20100121-C00001.png) | 1989-08-28 |
| JP2514430Y2 JP2514430Y2 (ja) | 1996-10-16 |
Family
ID=31237706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988020926U Expired - Lifetime JP2514430Y2 (ja) | 1988-02-19 | 1988-02-19 | ハイブリッドｉｃ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2514430Y2 (US20100012521A1-20100121-C00001.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01120856A (ja) * | 1987-11-04 | 1989-05-12 | Sony Corp | リードフレーム |
-
1988
- 1988-02-19 JP JP1988020926U patent/JP2514430Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01120856A (ja) * | 1987-11-04 | 1989-05-12 | Sony Corp | リードフレーム |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2514430Y2 (ja) | 1996-10-16 |
