JPH01123397U - - Google Patents
Info
- Publication number
- JPH01123397U JPH01123397U JP1988019511U JP1951188U JPH01123397U JP H01123397 U JPH01123397 U JP H01123397U JP 1988019511 U JP1988019511 U JP 1988019511U JP 1951188 U JP1951188 U JP 1951188U JP H01123397 U JPH01123397 U JP H01123397U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- heat sink
- insulating
- boss
- insulating sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例を示す分解斜視図、
第２図は同上の電子部品の取付状態を示す断面図
（電子部品の内部構造は省略する。）、第３図は
従来例の斜視図である。
１……絶縁シート、２……絶縁ボス、３……電
子部品、４……貫通孔、５……放熱板、６……止
め具。
FIG. 1 is an exploded perspective view showing an embodiment of the present invention;
FIG. 2 is a cross-sectional view showing how the electronic component is mounted (the internal structure of the electronic component is omitted), and FIG. 3 is a perspective view of a conventional example. DESCRIPTION OF SYMBOLS 1... Insulating sheet, 2... Insulating boss, 3... Electronic component, 4... Through hole, 5... Heat sink, 6... Stopper.
Claims (1)
し、電子部品に形成された貫通孔内に前記絶縁ボ
スを挿通させると共に間に前記絶縁シートを介在
させて電子部品を放熱板の表面に配設し、前記絶
縁ボスに挿通させたリベツトやねじ等の止め具の
先端部を放熱板に挿着して電子部品を放熱板に固
定したことを特徴とする電子部品の放熱板への取
付構造。 A cylindrical insulating boss is provided protrudingly on the surface of the insulating sheet, and the insulating boss is inserted into a through hole formed in the electronic component, and the electronic component is placed on the surface of the heat sink with the insulating sheet interposed therebetween. Attachment of an electronic component to a heat sink, characterized in that the electronic component is fixed to the heat sink by inserting the tip of a fastener such as a rivet or screw inserted into the insulating boss into the heat sink. structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988019511U JPH01123397U (en) | 1988-02-17 | 1988-02-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988019511U JPH01123397U (en) | 1988-02-17 | 1988-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01123397U true JPH01123397U (en) | 1989-08-22 |
Family
ID=31235084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988019511U Pending JPH01123397U (en) | 1988-02-17 | 1988-02-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01123397U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006351933A (en) * | 2005-06-17 | 2006-12-28 | Fuji Electric Systems Co Ltd | Semiconductor device |
-
1988
- 1988-02-17 JP JP1988019511U patent/JPH01123397U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006351933A (en) * | 2005-06-17 | 2006-12-28 | Fuji Electric Systems Co Ltd | Semiconductor device |
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