JPH01117540U - - Google Patents

Info

Publication number

JPH01117540U

JPH01117540U JP1341688U JP1341688U JPH01117540U JP H01117540 U JPH01117540 U JP H01117540U JP 1341688 U JP1341688 U JP 1341688U JP 1341688 U JP1341688 U JP 1341688U JP H01117540 U JPH01117540 U JP H01117540U

Authority

JP

Japan

Prior art keywords

case

temperature sensor

adhesive

lead wire

rubber

Prior art date

1988-02-02

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000853 adhesive Substances 0.000 claims description 3
• 230000001070 adhesive effect Effects 0.000 claims description 3
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
• 239000012212 insulator Substances 0.000 claims description 2
• 230000002093 peripheral effect Effects 0.000 claims 1
• 238000005219 brazing Methods 0.000 description 1