JPH01115112A - Chip component - Google Patents
Chip componentInfo
- Publication number
- JPH01115112A JPH01115112A JP62273682A JP27368287A JPH01115112A JP H01115112 A JPH01115112 A JP H01115112A JP 62273682 A JP62273682 A JP 62273682A JP 27368287 A JP27368287 A JP 27368287A JP H01115112 A JPH01115112 A JP H01115112A
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- base material
- mounting
- shaped ceramic
- circumferential section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 10
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract description 4
- 238000007493 shaping process Methods 0.000 abstract 1
- 239000003990 capacitor Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Ceramic Capacitors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、基板上に装着されるリードレスチップ部品に
関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to leadless chip components mounted on a substrate.
従来の技術
一般に、この種のチップ部品の形状は、第２図および第
３図に示されるように角形のものと円筒形のものがあシ
、電槙部ムは角形の場合には長辺両端部およびその側面
部に形成され、また１円筒形の場合にはその両端部に金
属性の電極キャップＢが圧入されて形成されている。Conventional technology In general, the shape of this type of chip component is either square or cylindrical, as shown in FIGS. 2 and 3, and in the case of a square shape, the long side They are formed at both ends and their side faces, and in the case of a cylindrical shape, metal electrode caps B are press-fitted into both ends.
発明が解決しようとする問題点
しかしながら、上記従来の構成では、角形チップの場合
、四辺に対する方向性があり、基板への実装の際に、そ
の方向性を考慮する必要があった。Problems to be Solved by the Invention However, in the conventional configuration described above, in the case of a square chip, there is a directionality with respect to the four sides, and it is necessary to take this directionality into consideration when mounting it on a board.
また、包装形態および供給形態においても、常にその方
向性を考慮して設計および搬送を行なう必要があった。In addition, it is necessary to always consider the direction of packaging and supply formats when designing and transporting.
さらに１円筒形チップの場合も、両端部に対する両端部
に電極が付与されているために、その取付けに方向性が
あるため、角形チップと同様の考慮が必要であった。Furthermore, in the case of a single cylindrical chip, since electrodes are provided on both ends thereof, there is a directionality in the attachment thereof, and the same considerations as with the square chip are required.
本発明は上記従来の問題点を解決するものであシ、チッ
プ部品の実装、包装、供給等の際に、形状の方向性を考
慮することなく、自由に精度よく実装、包装、供給等を
行なうことができるチップ部品を提供することを目的と
する。The present invention solves the above-mentioned conventional problems.When mounting, packaging, supplying, etc. chip components, the present invention can freely and accurately mount, package, supply, etc., without considering the directionality of the shape. The purpose is to provide chip components that can be
問題点を解決するための手段
この目的を達成するために１本発明のチップ部品は、ド
ーナツ形セラミック基板の中心部にヌル−ホールを備え
、前記基材の外周部および内周部に電極を設けた構成を
有している。Means for Solving the Problems In order to achieve this object, the chip component of the present invention is provided with a null hole in the center of a donut-shaped ceramic substrate, and electrodes on the outer and inner peripheries of the base material. It has a set configuration.
作用
この構成により、円環形チップ部品の平面上での方向性
は全くなく、配線回路板への実装においては、目的とす
る実装位置のセンターを狙って行えばよいだけとなり、
チップ部品及び配線回路板への特別な位置および姿勢の
制御は必要となくなる。包装形態及び搬送形態にしても
１円形という特性を生かした形態が考えられ、設備及び
治工具も安価なものとなる。Effect: With this configuration, there is no directionality on the plane of the annular chip component, and when mounting it on a printed circuit board, it is only necessary to aim at the center of the intended mounting position.
Special position and orientation controls for chip components and printed circuit boards are no longer required. A packaging form and a transport form that take advantage of the characteristics of a single circle can be considered, and the equipment and jigs and tools will also be inexpensive.
実施例
以下１本発明の一実施例について、図面を参照しながら
説明する。なお、第１図は抵抗チップ部品、第２図はコ
ンデンサチップ部品を示している。Embodiment One embodiment of the present invention will be described below with reference to the drawings. Note that FIG. 1 shows a resistor chip component, and FIG. 2 shows a capacitor chip component.
第１図において、１はドーナツ形のセラミック基材であ
り、その中心部にスルーホール２を有している。また、
ドーナツ形セラミック基材１の内周部および外周部には
、それぞれ内側電極３および外側電極４が焼付けられて
おり、この両電極間には抵抗素子４が形成されている。In FIG. 1, 1 is a donut-shaped ceramic base material, which has a through hole 2 in its center. Also,
An inner electrode 3 and an outer electrode 4 are baked on the inner and outer circumferential parts of the donut-shaped ceramic base material 1, respectively, and a resistive element 4 is formed between these two electrodes.
次に、第２図において、６はドーナツ型のセラミック基
板であシ、その中心部にスルーホール７を有している。Next, in FIG. 2, 6 is a donut-shaped ceramic substrate, which has a through hole 7 in its center.
また、ドーナツ型セラミツク基材６内周部および外周部
には、それぞれ内側電極８および外１ｉｌｌｌ電極９が
焼付けられており１両電極８゜９には内部電極が設けら
れている。Further, an inner electrode 8 and an outer electrode 9 are baked on the inner and outer circumferential parts of the donut-shaped ceramic base material 6, respectively, and each electrode 8.9 is provided with an internal electrode.
発明の効果
μ上の実施例の説明より明らかなように、本発明のチッ
プ部品は以下のような効果を有している。Effects of the Invention As is clear from the description of the embodiment above, the chip component of the present invention has the following effects.
（１）形状的に方向性がないため、配線回路板への実装
時の位置及び姿勢の補正等を必要とせず、目的位置へは
点を狙うことになり、特別の制御がいらない。(1) Since there is no directionality in shape, there is no need to correct the position and orientation when mounting on a printed circuit board, and the target position is aimed at a point, so no special control is required.
（２）包装形態では平面、積重ね（スルーホール穴を利
用しても可能）が自由である。(2) The packaging form can be flat or stacked (possibly by using through-holes).
（３）供給形態では１円板ということを特徴とするあら
ゆる形態が考えられ、位置決め精度も１円のセンター狙
いでよｈため、設備および治工具などで安価なものにな
る。(3) As for the supply form, all kinds of forms characterized by one circular plate can be considered, and the positioning accuracy is good enough to aim at the center of one circle, so the equipment, jigs, etc. can be inexpensive.
ａ）平面的には角ばったエツジ部がないため、取扱いに
おいて、カケ、パリおよびチッピング等の損壊が絶無に
近く、品質的にすぐれて層る。a) Since there are no angular edges in plan view, damage such as chipping, cracking, and chipping is virtually eliminated during handling, and the layer is of excellent quality.
第１図は本発明の一実施例における抵抗チップ部品を一
部切欠した斜視図、第２図は他の実施例におけるコンデ
ンサチップ部品を一部切欠した斜視図、第３図（ａ）お
よびΦ）は従来の角形抵抗チップ部品および角形コンデ
ンサチップ部品を一部切欠した斜視図、第４図は従来の
円筒形抵抗チップ部品を一部切欠した斜視図である。
１・・・・・セラミック基材、２・・・・・スルーホー
ル。
３・・・・・・内側電極、４・・・・・・外側電極。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名書
１ 図
第 ３ 図
宵 ４ 図FIG. 1 is a partially cutaway perspective view of a resistor chip component in one embodiment of the present invention, FIG. 2 is a partially cutaway perspective view of a capacitor chip component in another embodiment, and FIGS. 3(a) and Φ ) is a partially cutaway perspective view of a conventional prismatic resistor chip component and a prismatic capacitor chip component, and FIG. 4 is a partially cutaway perspective view of a conventional cylindrical resistor chip component. 1...Ceramic base material, 2...Through hole. 3...Inner electrode, 4...Outer electrode. Name of agent: Patent attorney Toshio Nakao and one other person
1 Figure 3 Figure 4
Claims (1)
備え、前記ドーナツ形セラミック基材の外周部および内
周部に電極を設けたチップ部品。A chip component comprising a through hole in the center of a donut-shaped ceramic base material and electrodes provided on the outer and inner peripheral parts of the donut-shaped ceramic base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62273682A JPH01115112A (en) | 1987-10-29 | 1987-10-29 | Chip component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62273682A JPH01115112A (en) | 1987-10-29 | 1987-10-29 | Chip component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01115112A true JPH01115112A (en) | 1989-05-08 |
Family
ID=17531080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62273682A Pending JPH01115112A (en) | 1987-10-29 | 1987-10-29 | Chip component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01115112A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03122526U (en) * | 1990-03-27 | 1991-12-13 | ||
| KR100771307B1 (en) * | 2006-08-18 | 2007-10-29 | 삼성전기주식회사 | Printed circuit board |
-
1987
- 1987-10-29 JP JP62273682A patent/JPH01115112A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03122526U (en) * | 1990-03-27 | 1991-12-13 | ||
| KR100771307B1 (en) * | 2006-08-18 | 2007-10-29 | 삼성전기주식회사 | Printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20050729 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20050928 |
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| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20060315 |