JPH01112053U - - Google Patents

Info

Publication number
JPH01112053U
JPH01112053U JP676088U JP676088U JPH01112053U JP H01112053 U JPH01112053 U JP H01112053U JP 676088 U JP676088 U JP 676088U JP 676088 U JP676088 U JP 676088U JP H01112053 U JPH01112053 U JP H01112053U
Authority
JP
Japan
Prior art keywords
semiconductor element
resin
sealed
mounting surface
electrode body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP676088U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP676088U priority Critical patent/JPH01112053U/ja
Publication of JPH01112053U publication Critical patent/JPH01112053U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP676088U 1988-01-22 1988-01-22 Pending JPH01112053U (US20070244113A1-20071018-C00087.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP676088U JPH01112053U (US20070244113A1-20071018-C00087.png) 1988-01-22 1988-01-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP676088U JPH01112053U (US20070244113A1-20071018-C00087.png) 1988-01-22 1988-01-22

Publications (1)

Publication Number Publication Date
JPH01112053U true JPH01112053U (US20070244113A1-20071018-C00087.png) 1989-07-27

Family

ID=31211199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP676088U Pending JPH01112053U (US20070244113A1-20071018-C00087.png) 1988-01-22 1988-01-22

Country Status (1)

Country Link
JP (1) JPH01112053U (US20070244113A1-20071018-C00087.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6917103B2 (en) 2001-12-27 2005-07-12 Denso Corporation Molded semiconductor power device having heat sinks exposed on one surface

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6917103B2 (en) 2001-12-27 2005-07-12 Denso Corporation Molded semiconductor power device having heat sinks exposed on one surface

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