JPH01110469U - - Google Patents

Info

Publication number

JPH01110469U

JPH01110469U JP660388U JP660388U JPH01110469U JP H01110469 U JPH01110469 U JP H01110469U JP 660388 U JP660388 U JP 660388U JP 660388 U JP660388 U JP 660388U JP H01110469 U JPH01110469 U JP H01110469U

Authority

JP

Japan

Prior art keywords

layer wiring

lower layer

upper layer

chip

connecting portion

Prior art date

1988-01-19

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000011347 resin Substances 0.000 claims description 2
• 229920005989 resin Polymers 0.000 claims description 2
• 238000009713 electroplating Methods 0.000 claims 1
• 239000000758 substrate Substances 0.000 claims 1
• 239000011248 coating agent Substances 0.000 description 1
• 238000000576 coating method Methods 0.000 description 1
• 239000002184 metal Substances 0.000 description 1