JPH01108942U - - Google Patents
Info
- Publication number
- JPH01108942U JPH01108942U JP278188U JP278188U JPH01108942U JP H01108942 U JPH01108942 U JP H01108942U JP 278188 U JP278188 U JP 278188U JP 278188 U JP278188 U JP 278188U JP H01108942 U JPH01108942 U JP H01108942U
- Authority
- JP
- Japan
- Prior art keywords
- mount seat
- metal base
- type semiconductor
- case body
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP278188U JPH01108942U (US08124630-20120228-C00152.png) | 1988-01-13 | 1988-01-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP278188U JPH01108942U (US08124630-20120228-C00152.png) | 1988-01-13 | 1988-01-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01108942U true JPH01108942U (US08124630-20120228-C00152.png) | 1989-07-24 |
Family
ID=31203851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP278188U Pending JPH01108942U (US08124630-20120228-C00152.png) | 1988-01-13 | 1988-01-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01108942U (US08124630-20120228-C00152.png) |
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1988
- 1988-01-13 JP JP278188U patent/JPH01108942U/ja active Pending