JPH01105864U - - Google Patents
Info
- Publication number
- JPH01105864U JPH01105864U JP194688U JP194688U JPH01105864U JP H01105864 U JPH01105864 U JP H01105864U JP 194688 U JP194688 U JP 194688U JP 194688 U JP194688 U JP 194688U JP H01105864 U JPH01105864 U JP H01105864U
- Authority
- JP
- Japan
- Prior art keywords
- groove
- strain gauge
- sensor
- view
- free end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000088 plastic resin Substances 0.000 claims 1
- 230000002787 reinforcement Effects 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Pressure Sensors (AREA)
Description
第１図は、この考案の好適な実施例を示す斜視
図である。第２図は、第１図に示すＧセンサを基
部に組付けた状態の側面図である。第３図は、第
１図に示すＧセンサを形成するシリコンウエーハ
の一部切欠した斜視図である。第４図は、従来の
技術を示すＧセンサの平面図である。第５図は、
第４図の側面図である。
１……Ｇセンサ、２……補強用樹脂、３……重
錘片、４……ガラス基台、５……基部、１１……
固定端部、１２……自由端部、１３……溝部、１
４……歪ゲージ。
FIG. 1 is a perspective view showing a preferred embodiment of this invention. FIG. 2 is a side view of the G sensor shown in FIG. 1 assembled to the base. 3 is a partially cutaway perspective view of a silicon wafer forming the G sensor shown in FIG. 1. FIG. FIG. 4 is a plan view of a G sensor showing a conventional technique. Figure 5 shows
FIG. 5 is a side view of FIG. 4; 1... G sensor, 2... Reinforcing resin, 3... Weight piece, 4... Glass base, 5... Base, 11...
Fixed end, 12... Free end, 13... Groove, 1
4...Strain gauge.
Claims (1)
の側に自由端部を形成し、溝部の部位近傍に歪ゲ
ージを固着した片持ち梁形状のＧセンサに於いて
、前記溝部内に補強用樹脂を充填したことを特徴
とする歪ゲージ型Ｇセンサ。 In a cantilever-shaped G sensor that has a fixed end on one side and a free end on the other side with the groove as a boundary, and a strain gauge is fixed near the groove, reinforcement is provided within the groove. A strain gauge type G sensor characterized by being filled with a plastic resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP194688U JPH01105864U (en) | 1988-01-11 | 1988-01-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP194688U JPH01105864U (en) | 1988-01-11 | 1988-01-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01105864U true JPH01105864U (en) | 1989-07-17 |
Family
ID=31202281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP194688U Pending JPH01105864U (en) | 1988-01-11 | 1988-01-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01105864U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01163672A (en) * | 1987-12-21 | 1989-06-27 | Fujikura Ltd | Semiconductor acceleration sensor |
-
1988
- 1988-01-11 JP JP194688U patent/JPH01105864U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01163672A (en) * | 1987-12-21 | 1989-06-27 | Fujikura Ltd | Semiconductor acceleration sensor |