JP7733583B2 - 導電性粒子、ソケット、導電材料及び接続構造体 - Google Patents

導電性粒子、ソケット、導電材料及び接続構造体

Info

Publication number
JP7733583B2
JP7733583B2 JP2021577501A JP2021577501A JP7733583B2 JP 7733583 B2 JP7733583 B2 JP 7733583B2 JP 2021577501 A JP2021577501 A JP 2021577501A JP 2021577501 A JP2021577501 A JP 2021577501A JP 7733583 B2 JP7733583 B2 JP 7733583B2
Authority
JP
Japan
Prior art keywords
conductive
conductive particles
particle
particles
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021577501A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022131359A1 (https=
Inventor
理 杉本
悠人 土橋
良 栗浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of JPWO2022131359A1 publication Critical patent/JPWO2022131359A1/ja
Priority to JP2025138973A priority Critical patent/JP2025161917A/ja
Application granted granted Critical
Publication of JP7733583B2 publication Critical patent/JP7733583B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2021577501A 2020-12-17 2021-12-17 導電性粒子、ソケット、導電材料及び接続構造体 Active JP7733583B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025138973A JP2025161917A (ja) 2020-12-17 2025-08-22 導電性粒子、ソケット、導電材料及び接続構造体

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020209444 2020-12-17
JP2020209444 2020-12-17
PCT/JP2021/046708 WO2022131359A2 (ja) 2020-12-17 2021-12-17 導電性粒子、ソケット、導電材料及び接続構造体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025138973A Division JP2025161917A (ja) 2020-12-17 2025-08-22 導電性粒子、ソケット、導電材料及び接続構造体

Publications (2)

Publication Number Publication Date
JPWO2022131359A1 JPWO2022131359A1 (https=) 2022-06-23
JP7733583B2 true JP7733583B2 (ja) 2025-09-03

Family

ID=82060133

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021577501A Active JP7733583B2 (ja) 2020-12-17 2021-12-17 導電性粒子、ソケット、導電材料及び接続構造体
JP2025138973A Withdrawn JP2025161917A (ja) 2020-12-17 2025-08-22 導電性粒子、ソケット、導電材料及び接続構造体

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025138973A Withdrawn JP2025161917A (ja) 2020-12-17 2025-08-22 導電性粒子、ソケット、導電材料及び接続構造体

Country Status (3)

Country Link
JP (2) JP7733583B2 (https=)
TW (1) TW202236310A (https=)
WO (1) WO2022131359A2 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000309715A (ja) 1999-04-26 2000-11-07 Sekisui Chem Co Ltd 重合体微粒子及び導電性微粒子
JP2001216840A (ja) 1999-11-26 2001-08-10 Sekisui Chem Co Ltd 導電性微粒子及び導電接続構造体
JP2001216841A (ja) 1999-11-26 2001-08-10 Sekisui Chem Co Ltd 導電性微粒子及び導電接続構造体
JP2006117850A (ja) 2004-10-22 2006-05-11 Nippon Shokubai Co Ltd 重合体微粒子およびその製造方法、導電性微粒子
JP2007253425A (ja) 2006-03-22 2007-10-04 Tdk Corp 転写用導電性フィルム及びそれを用いた透明導電層が付与された物体
JP2008533212A (ja) 2005-03-24 2008-08-21 株式会社日本触媒 被覆微粒子およびその製造方法、ならびに、導電性微粒子
WO2020230842A1 (ja) 2019-05-14 2020-11-19 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料及び接続構造体

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011040189A (ja) * 2009-08-07 2011-02-24 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体
JP2011060502A (ja) * 2009-09-08 2011-03-24 Sekisui Chem Co Ltd 絶縁粒子付き導電性粒子、異方性導電材料及び接続構造体

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000309715A (ja) 1999-04-26 2000-11-07 Sekisui Chem Co Ltd 重合体微粒子及び導電性微粒子
JP2001216840A (ja) 1999-11-26 2001-08-10 Sekisui Chem Co Ltd 導電性微粒子及び導電接続構造体
JP2001216841A (ja) 1999-11-26 2001-08-10 Sekisui Chem Co Ltd 導電性微粒子及び導電接続構造体
JP2006117850A (ja) 2004-10-22 2006-05-11 Nippon Shokubai Co Ltd 重合体微粒子およびその製造方法、導電性微粒子
JP2008533212A (ja) 2005-03-24 2008-08-21 株式会社日本触媒 被覆微粒子およびその製造方法、ならびに、導電性微粒子
JP2007253425A (ja) 2006-03-22 2007-10-04 Tdk Corp 転写用導電性フィルム及びそれを用いた透明導電層が付与された物体
WO2020230842A1 (ja) 2019-05-14 2020-11-19 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料及び接続構造体

Also Published As

Publication number Publication date
JP2025161917A (ja) 2025-10-24
JPWO2022131359A1 (https=) 2022-06-23
TW202236310A (zh) 2022-09-16
WO2022131359A2 (ja) 2022-06-23

Similar Documents

Publication Publication Date Title
KR102095826B1 (ko) 절연성 입자 부착 도전성 입자, 도전 재료 및 접속 구조체
TW201841170A (zh) 導電性粒子、導電材料及連接構造體
TW202110980A (zh) 樹脂粒子、導電性粒子、導電材料及連接構造體
JP7767300B2 (ja) 導電性粒子、導電材料及び接続構造体
JP6431411B2 (ja) 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
JP7335687B2 (ja) 基材粒子、導電性粒子、導電材料及び接続構造体
JP6151990B2 (ja) 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
TWI841692B (zh) 導電材料及連接構造體
JP7733583B2 (ja) 導電性粒子、ソケット、導電材料及び接続構造体
JP5996806B2 (ja) 導電性粒子、導電材料及び接続構造体
JP2014026971A (ja) 導電性粒子、導電材料及び接続構造体
JP7839258B2 (ja) 導電性粒子
JP7288487B2 (ja) 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
JP7328856B2 (ja) 導電性粒子、導電材料及び接続構造体
JP7688617B2 (ja) 導電性粒子、導電材料及び接続構造体
JP7808242B2 (ja) 導電性粒子、導電材料及び接続構造体
JP2024035972A (ja) 被覆粒子、樹脂組成物及び接続構造体
JP2025037114A (ja) 導電性粒子、導電材料及び接続構造体
WO2024034386A1 (ja) 導電性粒子、導電材料及び接続構造体
KR20210029143A (ko) 절연성 입자 구비 도전성 입자, 도전 재료 및 접속 구조체
WO2019107572A1 (ja) 導電性組成物及びその硬化物、導通検査装置用部材並びに導通検査装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240903

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240903

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250708

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250715

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250729

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250822

R150 Certificate of patent or registration of utility model

Ref document number: 7733583

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150