JP7650073B2 - 易破砕性ダイヤモンド砥粒の製造方法 - Google Patents

易破砕性ダイヤモンド砥粒の製造方法 Download PDF

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Publication number
JP7650073B2
JP7650073B2 JP2021551620A JP2021551620A JP7650073B2 JP 7650073 B2 JP7650073 B2 JP 7650073B2 JP 2021551620 A JP2021551620 A JP 2021551620A JP 2021551620 A JP2021551620 A JP 2021551620A JP 7650073 B2 JP7650073 B2 JP 7650073B2
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Japan
Prior art keywords
diamond
abrasive grains
oxidizing
grains
heat treatment
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Japanese (ja)
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JPWO2021066172A1 (https=
Inventor
博 石塚
良彰 石塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tomei Diamond Co Ltd
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Tomei Diamond Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/25—Diamond
    • C01B32/28—After-treatment, e.g. purification, irradiation, separation or recovery
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/06—Processes using ultra-high pressure, e.g. for the formation of diamonds; Apparatus therefor, e.g. moulds or dies
    • B01J3/062—Processes using ultra-high pressure, e.g. for the formation of diamonds; Apparatus therefor, e.g. moulds or dies characterised by the composition of the materials to be processed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2203/00—Processes utilising sub- or super atmospheric pressure
    • B01J2203/06—High pressure synthesis
    • B01J2203/065—Composition of the material produced
    • B01J2203/0655—Diamond
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/40—Electric properties
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/90—Other properties not specified above

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Geology (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP2021551620A 2019-10-04 2020-10-02 易破砕性ダイヤモンド砥粒の製造方法 Active JP7650073B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019183852 2019-10-04
JP2019183852 2019-10-04
PCT/JP2020/037635 WO2021066172A1 (ja) 2019-10-04 2020-10-02 易破砕性ダイヤモンド砥粒及びその製造方法

Publications (2)

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JPWO2021066172A1 JPWO2021066172A1 (https=) 2021-04-08
JP7650073B2 true JP7650073B2 (ja) 2025-03-24

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JP2021551620A Active JP7650073B2 (ja) 2019-10-04 2020-10-02 易破砕性ダイヤモンド砥粒の製造方法

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US (1) US20220348470A1 (https=)
EP (1) EP4039766A4 (https=)
JP (1) JP7650073B2 (https=)
KR (1) KR20220084081A (https=)
CN (1) CN114787315B (https=)
WO (1) WO2021066172A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025250873A1 (en) * 2024-05-30 2025-12-04 Engis Corporation Thermal graphitization of encapsulated micron size and submicron size diamond particles
CN119954152B (zh) * 2025-02-11 2025-10-17 长垣市新材料与装备产业研究院 一种金刚石面蚀刻方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002060733A (ja) 2000-08-17 2002-02-26 Ishizuka Kenkyusho:Kk ダイヤモンド研磨材粒子及びその製法
CN102757044A (zh) 2012-07-23 2012-10-31 河南省联合磨料磨具有限公司 高切削力金刚石微粉及其制备方法
JP2013543830A (ja) 2010-10-22 2013-12-09 エレメント シックス アブレイシヴズ ソシエテ アノニム 多結晶ダイヤモンド材料
JP2015507087A (ja) 2011-12-21 2015-03-05 エレメント シックス アブレイシヴズ ソシエテ アノニム 多結晶ダイヤモンド含有材料の物体を含む超硬質構造または物体
JP6149169B2 (ja) 2014-10-11 2017-06-14 ヘナン フェイマス ダイヤモンド インダストリアル カンパニー リミテッド 表面の粗いダイヤモンドの合成方法
CN108795383A (zh) 2018-06-05 2018-11-13 燕山大学 一种提高金刚石自锐性的制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5518654B1 (https=) * 1970-11-18 1980-05-20
JPS51139796A (en) 1975-05-28 1976-12-02 Toyo Commun Equip Co Ltd Asynchronous response elimination system
JPS5969266A (ja) * 1982-09-14 1984-04-19 Nippon Gureen Kenkyusho:Kk ビトリフアイドボンドダイヤモンド砥石の製造方法
JP3119098B2 (ja) * 1994-10-17 2000-12-18 株式会社ティ・ケー・エックス ダイヤモンド砥粒、砥石及びそれらの製造方法
JP3411239B2 (ja) 1998-08-28 2003-05-26 石塚 博 ダイヤモンド研磨材粒子及びその製法
ES2814225T3 (es) * 2008-09-16 2021-03-26 Diamond Innovations Inc Partículas abrasivas que tienen una morfología única
US20100213175A1 (en) * 2009-02-22 2010-08-26 General Electric Company Diamond etching method and articles produced thereby
KR20160113373A (ko) * 2015-03-18 2016-09-29 일진다이아몬드(주) 표면처리된 다이아몬드 및 그 다이아몬드의 표면 처리방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002060733A (ja) 2000-08-17 2002-02-26 Ishizuka Kenkyusho:Kk ダイヤモンド研磨材粒子及びその製法
JP2013543830A (ja) 2010-10-22 2013-12-09 エレメント シックス アブレイシヴズ ソシエテ アノニム 多結晶ダイヤモンド材料
JP2015507087A (ja) 2011-12-21 2015-03-05 エレメント シックス アブレイシヴズ ソシエテ アノニム 多結晶ダイヤモンド含有材料の物体を含む超硬質構造または物体
CN102757044A (zh) 2012-07-23 2012-10-31 河南省联合磨料磨具有限公司 高切削力金刚石微粉及其制备方法
JP6149169B2 (ja) 2014-10-11 2017-06-14 ヘナン フェイマス ダイヤモンド インダストリアル カンパニー リミテッド 表面の粗いダイヤモンドの合成方法
CN108795383A (zh) 2018-06-05 2018-11-13 燕山大学 一种提高金刚石自锐性的制备方法

Also Published As

Publication number Publication date
WO2021066172A1 (ja) 2021-04-08
EP4039766A1 (en) 2022-08-10
US20220348470A1 (en) 2022-11-03
CN114787315B (zh) 2024-06-11
CN114787315A (zh) 2022-07-22
KR20220084081A (ko) 2022-06-21
JPWO2021066172A1 (https=) 2021-04-08
EP4039766A4 (en) 2023-10-25

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