JP7630093B2 - 部品搭載装置 - Google Patents

部品搭載装置 Download PDF

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Publication number
JP7630093B2
JP7630093B2 JP2023566387A JP2023566387A JP7630093B2 JP 7630093 B2 JP7630093 B2 JP 7630093B2 JP 2023566387 A JP2023566387 A JP 2023566387A JP 2023566387 A JP2023566387 A JP 2023566387A JP 7630093 B2 JP7630093 B2 JP 7630093B2
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Japan
Prior art keywords
cassette
tape
unit
component
information
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JP2023566387A
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Japanese (ja)
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JPWO2023106403A1 (https=
Inventor
寛昭 加藤
美伯 礒端
輝明 西中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Publication of JPWO2023106403A1 publication Critical patent/JPWO2023106403A1/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2023566387A 2021-12-10 2022-12-09 部品搭載装置 Active JP7630093B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021200912 2021-12-10
JP2021200912 2021-12-10
PCT/JP2022/045467 WO2023106403A1 (ja) 2021-12-10 2022-12-09 部品搭載装置

Publications (2)

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JPWO2023106403A1 JPWO2023106403A1 (https=) 2023-06-15
JP7630093B2 true JP7630093B2 (ja) 2025-02-17

Family

ID=86730522

Family Applications (1)

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JP2023566387A Active JP7630093B2 (ja) 2021-12-10 2022-12-09 部品搭載装置

Country Status (4)

Country Link
JP (1) JP7630093B2 (https=)
CN (1) CN117837284A (https=)
DE (1) DE112022005883T5 (https=)
WO (1) WO2023106403A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004047858A (ja) 2002-07-15 2004-02-12 Yamaha Motor Co Ltd 部品実装装置
JP2010251774A (ja) 2010-06-04 2010-11-04 Fujitsu Ltd 部品搭載装置における作業支援システム、部品配列の認識方法およびカセット配列の認識方法
WO2021181759A1 (ja) 2020-03-12 2021-09-16 パナソニックＩｐマネジメント株式会社 保持装置および部品装着システム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004047858A (ja) 2002-07-15 2004-02-12 Yamaha Motor Co Ltd 部品実装装置
JP2010251774A (ja) 2010-06-04 2010-11-04 Fujitsu Ltd 部品搭載装置における作業支援システム、部品配列の認識方法およびカセット配列の認識方法
WO2021181759A1 (ja) 2020-03-12 2021-09-16 パナソニックＩｐマネジメント株式会社 保持装置および部品装着システム

Also Published As

Publication number Publication date
WO2023106403A1 (ja) 2023-06-15
DE112022005883T5 (de) 2024-09-19
CN117837284A (zh) 2024-04-05
JPWO2023106403A1 (https=) 2023-06-15

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