JP7607640B2 - 電子装置 - Google Patents

電子装置 Download PDF

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Publication number
JP7607640B2
JP7607640B2 JP2022511955A JP2022511955A JP7607640B2 JP 7607640 B2 JP7607640 B2 JP 7607640B2 JP 2022511955 A JP2022511955 A JP 2022511955A JP 2022511955 A JP2022511955 A JP 2022511955A JP 7607640 B2 JP7607640 B2 JP 7607640B2
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JP
Japan
Prior art keywords
electronic device
main surface
lead
substrate
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022511955A
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English (en)
Japanese (ja)
Other versions
JPWO2021200336A1 (https=
Inventor
祐司 石松
憲治 ▲濱▼
英夫 原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of JPWO2021200336A1 publication Critical patent/JPWO2021200336A1/ja
Application granted granted Critical
Publication of JP7607640B2 publication Critical patent/JP7607640B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/442—Shapes or dispositions of multiple leadframes in a single chip
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/468—Circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
JP2022511955A 2020-04-01 2021-03-22 電子装置 Active JP7607640B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020065762 2020-04-01
JP2020065762 2020-04-01
PCT/JP2021/011701 WO2021200336A1 (ja) 2020-04-01 2021-03-22 電子装置

Publications (2)

Publication Number Publication Date
JPWO2021200336A1 JPWO2021200336A1 (https=) 2021-10-07
JP7607640B2 true JP7607640B2 (ja) 2024-12-27

Family

ID=77929554

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022511955A Active JP7607640B2 (ja) 2020-04-01 2021-03-22 電子装置

Country Status (5)

Country Link
US (1) US12599006B2 (https=)
JP (1) JP7607640B2 (https=)
CN (1) CN115335986A (https=)
DE (2) DE112021000700T5 (https=)
WO (1) WO2021200336A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7716402B2 (ja) * 2020-06-08 2025-07-31 ローム株式会社 半導体装置
USD1021830S1 (en) * 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
USD1022932S1 (en) * 2021-03-16 2024-04-16 Rohm Co., Ltd. Semiconductor module
USD1021829S1 (en) * 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
JP7779690B2 (ja) * 2021-09-24 2025-12-03 ローム株式会社 半導体装置、及び半導体モジュール
WO2026048723A1 (ja) * 2024-08-29 2026-03-05 ローム株式会社 半導体装置および車両

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017112153A (ja) 2015-12-14 2017-06-22 株式会社村田製作所 パワー半導体モジュール
JP2019186321A (ja) 2018-04-05 2019-10-24 ローム株式会社 半導体装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2938344B2 (ja) * 1994-05-15 1999-08-23 株式会社東芝 半導体装置
US6585905B1 (en) * 1998-06-10 2003-07-01 Asat Ltd. Leadless plastic chip carrier with partial etch die attach pad
JPWO2007026944A1 (ja) * 2005-08-31 2009-03-12 三洋電機株式会社 回路装置およびその製造方法
KR101221807B1 (ko) 2006-12-29 2013-01-14 페어차일드코리아반도체 주식회사 전력 소자 패키지
JP6070955B2 (ja) * 2011-09-30 2017-02-01 ローム株式会社 半導体装置
JP2015220429A (ja) * 2014-05-21 2015-12-07 ローム株式会社 半導体装置
WO2016125363A1 (ja) 2015-02-06 2016-08-11 株式会社 村田製作所 パワー半導体モジュール
JP6633861B2 (ja) * 2015-07-31 2020-01-22 ルネサスエレクトロニクス株式会社 半導体装置
EP3226014B1 (en) * 2016-03-30 2024-01-10 Mitsubishi Electric R&D Centre Europe B.V. Method for estimating a level of damage or a lifetime expectation of a power semiconductor module comprising at least one die
US10580754B2 (en) * 2016-04-01 2020-03-03 Mitsubishi Electric Corporation Semiconductor module with temperature detecting element
US10529672B2 (en) * 2017-08-31 2020-01-07 Stmicroelectronics, Inc. Package with interlocking leads and manufacturing the same
JP7199167B2 (ja) 2018-06-29 2023-01-05 三菱電機株式会社 パワー半導体モジュール、電力変換装置、およびパワー半導体モジュールの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017112153A (ja) 2015-12-14 2017-06-22 株式会社村田製作所 パワー半導体モジュール
JP2019186321A (ja) 2018-04-05 2019-10-24 ローム株式会社 半導体装置

Also Published As

Publication number Publication date
DE112021000700T5 (de) 2022-11-17
DE212021000242U1 (de) 2022-05-19
US20230121777A1 (en) 2023-04-20
US12599006B2 (en) 2026-04-07
JPWO2021200336A1 (https=) 2021-10-07
WO2021200336A1 (ja) 2021-10-07
CN115335986A (zh) 2022-11-11

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