JP7596393B2 - 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び、タッチパネルの製造方法 - Google Patents

感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び、タッチパネルの製造方法 Download PDF

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JP7596393B2
JP7596393B2 JP2022550420A JP2022550420A JP7596393B2 JP 7596393 B2 JP7596393 B2 JP 7596393B2 JP 2022550420 A JP2022550420 A JP 2022550420A JP 2022550420 A JP2022550420 A JP 2022550420A JP 7596393 B2 JP7596393 B2 JP 7596393B2
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mass
resin layer
photosensitive resin
meth
compound
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JPWO2022059417A1 (https=
Inventor
晃男 片山
隆志 有冨
英宏 望月
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Fujifilm Corp
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Fujifilm Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP2022550420A 2020-09-17 2021-08-19 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び、タッチパネルの製造方法 Active JP7596393B2 (ja)

Priority Applications (1)

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JP2024012201A JP2024036431A (ja) 2020-09-17 2024-01-30 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び、タッチパネルの製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020156353 2020-09-17
JP2020156353 2020-09-17
PCT/JP2021/030437 WO2022059417A1 (ja) 2020-09-17 2021-08-19 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び、タッチパネルの製造方法

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JPWO2022059417A1 JPWO2022059417A1 (https=) 2022-03-24
JP7596393B2 true JP7596393B2 (ja) 2024-12-09

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JP2024012201A Ceased JP2024036431A (ja) 2020-09-17 2024-01-30 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び、タッチパネルの製造方法

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CN (1) CN116235111B (https=)
WO (1) WO2022059417A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001356493A (ja) 2000-06-16 2001-12-26 Toyobo Co Ltd 感光性樹脂組成物
JP2018517169A (ja) 2015-04-21 2018-06-28 フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド 感光性ポリイミド組成物
WO2019066000A1 (ja) 2017-09-29 2019-04-04 学校法人関西大学 リソグラフィー用組成物、パターン形成方法、及び化合物
JP2019105713A (ja) 2017-12-12 2019-06-27 東洋インキＳｃホールディングス株式会社 カラーフィルタ用感光性着色組成物、カラーフィルタ
WO2019187364A1 (ja) 2018-03-29 2019-10-03 富士フイルム株式会社 感光性転写材料、レジストパターンの製造方法、回路配線の製造方法、タッチパネル、及び、タッチパネル表示装置
WO2020066351A1 (ja) 2018-09-28 2020-04-02 富士フイルム株式会社 パターン付き基材の製造方法、回路基板の製造方法及びタッチパネルの製造方法
WO2020105523A1 (ja) 2018-11-22 2020-05-28 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、レジスト膜、パターン形成方法、電子デバイスの製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6555490B2 (ja) * 2017-10-24 2019-08-07 東洋インキＳｃホールディングス株式会社 カラーフィルタ用感光性組成物、及びカラーフィルタ

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001356493A (ja) 2000-06-16 2001-12-26 Toyobo Co Ltd 感光性樹脂組成物
JP2018517169A (ja) 2015-04-21 2018-06-28 フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド 感光性ポリイミド組成物
WO2019066000A1 (ja) 2017-09-29 2019-04-04 学校法人関西大学 リソグラフィー用組成物、パターン形成方法、及び化合物
JP2019105713A (ja) 2017-12-12 2019-06-27 東洋インキＳｃホールディングス株式会社 カラーフィルタ用感光性着色組成物、カラーフィルタ
WO2019187364A1 (ja) 2018-03-29 2019-10-03 富士フイルム株式会社 感光性転写材料、レジストパターンの製造方法、回路配線の製造方法、タッチパネル、及び、タッチパネル表示装置
WO2020066351A1 (ja) 2018-09-28 2020-04-02 富士フイルム株式会社 パターン付き基材の製造方法、回路基板の製造方法及びタッチパネルの製造方法
WO2020105523A1 (ja) 2018-11-22 2020-05-28 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、レジスト膜、パターン形成方法、電子デバイスの製造方法

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CN116235111A (zh) 2023-06-06
JP2024036431A (ja) 2024-03-15
WO2022059417A1 (ja) 2022-03-24
JPWO2022059417A1 (https=) 2022-03-24
CN116235111B (zh) 2026-01-13

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