JP7587766B2 - 共振子 - Google Patents

共振子 Download PDF

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Publication number
JP7587766B2
JP7587766B2 JP2023516025A JP2023516025A JP7587766B2 JP 7587766 B2 JP7587766 B2 JP 7587766B2 JP 2023516025 A JP2023516025 A JP 2023516025A JP 2023516025 A JP2023516025 A JP 2023516025A JP 7587766 B2 JP7587766 B2 JP 7587766B2
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JP
Japan
Prior art keywords
piezoelectric layer
crystal
acoustic velocity
substrate
axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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JP2023516025A
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English (en)
Japanese (ja)
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JPWO2022224470A5 (https=
JPWO2022224470A1 (https=
Inventor
俊雄 西村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2022224470A1 publication Critical patent/JPWO2022224470A1/ja
Publication of JPWO2022224470A5 publication Critical patent/JPWO2022224470A5/ja
Application granted granted Critical
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02834—Means for compensation or elimination of undesirable effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02551—Characteristics of substrate, e.g. cutting angles of quartz substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14544—Transducers of particular shape or position
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2023516025A 2021-04-20 2021-10-28 共振子 Active JP7587766B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021071400 2021-04-20
JP2021071400 2021-04-20
PCT/JP2021/039760 WO2022224470A1 (ja) 2021-04-20 2021-10-28 共振子

Publications (3)

Publication Number Publication Date
JPWO2022224470A1 JPWO2022224470A1 (https=) 2022-10-27
JPWO2022224470A5 JPWO2022224470A5 (https=) 2023-09-01
JP7587766B2 true JP7587766B2 (ja) 2024-11-21

Family

ID=83722182

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023516025A Active JP7587766B2 (ja) 2021-04-20 2021-10-28 共振子

Country Status (5)

Country Link
US (1) US20230402991A1 (https=)
JP (1) JP7587766B2 (https=)
CN (1) CN116888891A (https=)
DE (1) DE212021000552U1 (https=)
WO (1) WO2022224470A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12483221B2 (en) 2021-07-15 2025-11-25 Skyworks Solutions, Inc. Multilayer piezoelectric substrate device with partially recessed passivation layer
US12542524B2 (en) * 2022-04-08 2026-02-03 Skyworks Solutions, Inc. Acoustic wave device with trench portions and narrow interdigital transducer tip portions for transverse mode suppression
CN118337167A (zh) * 2024-04-10 2024-07-12 无锡市好达电子股份有限公司 弹性波装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005065160A (ja) 2003-08-20 2005-03-10 Seiko Epson Corp 弾性表面波デバイス及びその製造方法
JP2006191330A (ja) 2005-01-06 2006-07-20 Epson Toyocom Corp 弾性表面波デバイス
WO2019138812A1 (ja) 2018-01-12 2019-07-18 株式会社村田製作所 弾性波装置、マルチプレクサ、高周波フロントエンド回路、及び通信装置
WO2020121976A1 (ja) 2018-12-13 2020-06-18 株式会社村田製作所 弾性波装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006203408A (ja) 2005-01-19 2006-08-03 Epson Toyocom Corp 弾性表面波デバイス
CN103262410B (zh) 2010-12-24 2016-08-10 株式会社村田制作所 弹性波装置及其制造方法
JP7080671B2 (ja) 2018-02-27 2022-06-06 ＮＤＫ ＳＡＷ ｄｅｖｉｃｅｓ株式会社 弾性表面波デバイス

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005065160A (ja) 2003-08-20 2005-03-10 Seiko Epson Corp 弾性表面波デバイス及びその製造方法
JP2006191330A (ja) 2005-01-06 2006-07-20 Epson Toyocom Corp 弾性表面波デバイス
WO2019138812A1 (ja) 2018-01-12 2019-07-18 株式会社村田製作所 弾性波装置、マルチプレクサ、高周波フロントエンド回路、及び通信装置
WO2020121976A1 (ja) 2018-12-13 2020-06-18 株式会社村田製作所 弾性波装置

Also Published As

Publication number Publication date
CN116888891A (zh) 2023-10-13
JPWO2022224470A1 (https=) 2022-10-27
US20230402991A1 (en) 2023-12-14
WO2022224470A1 (ja) 2022-10-27
DE212021000552U1 (de) 2023-11-07

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