JP7576805B2 - 低温半田、低温半田の製造方法、および低温半田被覆リード線 - Google Patents

低温半田、低温半田の製造方法、および低温半田被覆リード線 Download PDF

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Publication number
JP7576805B2
JP7576805B2 JP2022553794A JP2022553794A JP7576805B2 JP 7576805 B2 JP7576805 B2 JP 7576805B2 JP 2022553794 A JP2022553794 A JP 2022553794A JP 2022553794 A JP2022553794 A JP 2022553794A JP 7576805 B2 JP7576805 B2 JP 7576805B2
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Japan
Prior art keywords
low
temperature solder
temperature
soldering
soldered
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Active
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JP2022553794A
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English (en)
Japanese (ja)
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JPWO2022070910A1 (https=
Inventor
守弘 岡田
卓 新井
傑也 新井
寛昭 新井
ミエ子 菅原
賢一 小林
秀利 小宮
正五 松井
潤 錦織
尚久 森
遼 ▲徳▼田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Artbeam Co Ltd
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Artbeam Co Ltd
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Publication of JPWO2022070910A1 publication Critical patent/JPWO2022070910A1/ja
Priority to JP2024091175A priority Critical patent/JP7770637B2/ja
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Publication of JP7576805B2 publication Critical patent/JP7576805B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
JP2022553794A 2020-10-01 2021-09-15 低温半田、低温半田の製造方法、および低温半田被覆リード線 Active JP7576805B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024091175A JP7770637B2 (ja) 2020-10-01 2024-06-05 低温半田、低温半田の製造方法、および低温半田被覆リード線

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020166977 2020-10-01
JP2020166977 2020-10-01
JP2020219193 2020-12-28
JP2020219193 2020-12-28
PCT/JP2021/033865 WO2022070910A1 (ja) 2020-10-01 2021-09-15 低温半田、低温半田の製造方法、および低温半田被覆リード線

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JP2024091175A Division JP7770637B2 (ja) 2020-10-01 2024-06-05 低温半田、低温半田の製造方法、および低温半田被覆リード線

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JPWO2022070910A1 JPWO2022070910A1 (https=) 2022-04-07
JP7576805B2 true JP7576805B2 (ja) 2024-11-01

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JP2022553794A Active JP7576805B2 (ja) 2020-10-01 2021-09-15 低温半田、低温半田の製造方法、および低温半田被覆リード線
JP2024091175A Active JP7770637B2 (ja) 2020-10-01 2024-06-05 低温半田、低温半田の製造方法、および低温半田被覆リード線

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JP (2) JP7576805B2 (https=)
KR (1) KR102877569B1 (https=)
CN (1) CN116324001A (https=)
TW (2) TW202344326A (https=)
WO (1) WO2022070910A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024113075A (ja) * 2020-10-01 2024-08-21 アートビーム株式会社 低温半田、低温半田の製造方法、および低温半田被覆リード線

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11832386B2 (en) * 2021-12-16 2023-11-28 Dell Products L.P. Solder composition for use in solder joints of printed circuit boards

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000141079A (ja) 1998-09-04 2000-05-23 Toyota Central Res & Dev Lab Inc 無鉛はんだ合金
JP2005296983A (ja) 2004-04-09 2005-10-27 Hitachi Metals Ltd はんだ合金およびはんだボール
JP2010167472A (ja) 2009-01-26 2010-08-05 Fujitsu Ltd はんだ、はんだ付け方法及び半導体装置
JP2013248664A (ja) 2012-06-04 2013-12-12 Nippon Genma:Kk 鉛フリーはんだ合金およびはんだペースト
WO2015019966A1 (ja) 2013-08-05 2015-02-12 千住金属工業株式会社 鉛フリーはんだ合金
JP2016026884A (ja) 2014-07-02 2016-02-18 住友金属鉱山株式会社 中低温用のＢｉ−Ｓｎ−Ａｌ系はんだ合金及びはんだペースト
JP2019527145A (ja) 2016-08-11 2019-09-26 ベイジン コンポー アドバンスト テクノロジー カンパニー リミテッドＢｅｉｊｉｎｇ Ｃｏｍｐｏ Ａｄｖａｎｃｅｄ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ． ＳｎＢｉＳｂ系低温鉛フリーはんだ

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09155587A (ja) * 1995-11-30 1997-06-17 Mitsui Mining & Smelting Co Ltd 錫−亜鉛系無鉛半田合金
JP2007292901A (ja) 2006-04-24 2007-11-08 Optrex Corp 表示モジュール
US9279176B2 (en) 2008-11-27 2016-03-08 Hitachi Metals, Ltd. Lead wire for solar cell, manufacturing method and storage method thereof, and solar cell
TWI714127B (zh) * 2018-06-26 2020-12-21 日商亞特比目有限公司 太陽能電池及太陽能電池的製造方法
CN108971793B (zh) * 2018-08-24 2021-04-23 云南科威液态金属谷研发有限公司 一种低温无铅焊料
TW202206614A (zh) 2019-07-12 2022-02-16 日商亞特比目有限公司 ＳｎＺｎ焊料及其製造方法
CN116324001A (zh) 2020-10-01 2023-06-23 亚特比目有限会社 低温焊料、低温焊料的制造方法及低温焊料包覆导线

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000141079A (ja) 1998-09-04 2000-05-23 Toyota Central Res & Dev Lab Inc 無鉛はんだ合金
JP2005296983A (ja) 2004-04-09 2005-10-27 Hitachi Metals Ltd はんだ合金およびはんだボール
JP2010167472A (ja) 2009-01-26 2010-08-05 Fujitsu Ltd はんだ、はんだ付け方法及び半導体装置
JP2013248664A (ja) 2012-06-04 2013-12-12 Nippon Genma:Kk 鉛フリーはんだ合金およびはんだペースト
WO2015019966A1 (ja) 2013-08-05 2015-02-12 千住金属工業株式会社 鉛フリーはんだ合金
JP2016026884A (ja) 2014-07-02 2016-02-18 住友金属鉱山株式会社 中低温用のＢｉ−Ｓｎ−Ａｌ系はんだ合金及びはんだペースト
JP2019527145A (ja) 2016-08-11 2019-09-26 ベイジン コンポー アドバンスト テクノロジー カンパニー リミテッドＢｅｉｊｉｎｇ Ｃｏｍｐｏ Ａｄｖａｎｃｅｄ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ． ＳｎＢｉＳｂ系低温鉛フリーはんだ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024113075A (ja) * 2020-10-01 2024-08-21 アートビーム株式会社 低温半田、低温半田の製造方法、および低温半田被覆リード線
JP7770637B2 (ja) 2020-10-01 2025-11-17 アートビーム株式会社 低温半田、低温半田の製造方法、および低温半田被覆リード線

Also Published As

Publication number Publication date
CN116324001A (zh) 2023-06-23
KR102877569B1 (ko) 2025-10-27
KR20230075504A (ko) 2023-05-31
JP2024113075A (ja) 2024-08-21
JPWO2022070910A1 (https=) 2022-04-07
WO2022070910A1 (ja) 2022-04-07
TW202219286A (zh) 2022-05-16
TW202344326A (zh) 2023-11-16
JP7770637B2 (ja) 2025-11-17

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