JP7527272B2 - 半導体装置、撮像装置 - Google Patents

半導体装置、撮像装置 Download PDF

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Publication number
JP7527272B2
JP7527272B2 JP2021505594A JP2021505594A JP7527272B2 JP 7527272 B2 JP7527272 B2 JP 7527272B2 JP 2021505594 A JP2021505594 A JP 2021505594A JP 2021505594 A JP2021505594 A JP 2021505594A JP 7527272 B2 JP7527272 B2 JP 7527272B2
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Prior art keywords
semiconductor device
shielding film
outer casing
door portion
door
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JP2021505594A
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English (en)
Japanese (ja)
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JPWO2020184003A1 (enrdf_load_stackoverflow
Inventor
成和 石井
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Sony Semiconductor Solutions Corp
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Sony Semiconductor Solutions Corp
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Publication of JPWO2020184003A1 publication Critical patent/JPWO2020184003A1/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2021505594A 2019-03-13 2020-02-05 半導体装置、撮像装置 Active JP7527272B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019045876 2019-03-13
JP2019045876 2019-03-13
PCT/JP2020/004377 WO2020184003A1 (ja) 2019-03-13 2020-02-05 半導体装置、撮像装置

Publications (2)

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JPWO2020184003A1 JPWO2020184003A1 (enrdf_load_stackoverflow) 2020-09-17
JP7527272B2 true JP7527272B2 (ja) 2024-08-02

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JP2021505594A Active JP7527272B2 (ja) 2019-03-13 2020-02-05 半導体装置、撮像装置

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JP (1) JP7527272B2 (enrdf_load_stackoverflow)
WO (1) WO2020184003A1 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3120987B1 (fr) * 2021-03-22 2023-05-26 St Microelectronics Grenoble 2 Dispositif d’encapuslation de puce et procede de fabrication correspondant
JP7686179B1 (ja) * 2024-09-24 2025-05-30 三菱電機株式会社 半導体モジュールの製造方法及び電子装置の製造方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000307019A (ja) 1999-04-22 2000-11-02 Mitsubishi Electric Corp マイクロ波パッケージ構造
US6448637B1 (en) 2001-11-28 2002-09-10 Intersil Americas Inc. Hermetically sealed integrated circuit package incorporating pressure relief valve for equalizing interior and exterior pressures when placed in spaceborne environment
JP2004119881A (ja) 2002-09-27 2004-04-15 Sony Corp 半導体装置及びその製造方法
US20040144435A1 (en) 2003-01-23 2004-07-29 Dark Richard C.G. Check valve
JP2008223968A (ja) 2007-03-15 2008-09-25 Toyota Motor Corp 液体封入式防振装置
JP2008311940A (ja) 2007-06-14 2008-12-25 Yamaha Corp 半導体装置及びその製造方法
US7675149B1 (en) 2006-09-12 2010-03-09 Maxim Integrated Products, Inc. Check valve package for Pb-free, single piece electronic modules
JP2010212511A (ja) 2009-03-11 2010-09-24 Kyocera Corp 電子装置、および電子システム
JP2011159900A (ja) 2010-02-03 2011-08-18 Panasonic Corp 固体撮像装置
US20150014796A1 (en) 2013-07-12 2015-01-15 Infineon Technologies Ag Device with MEMS Structure and Ventilation Path in Support Structure

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6126055U (ja) * 1984-07-20 1986-02-17 東静容器株式会社 定量注出容器
JPS6178638U (enrdf_load_stackoverflow) * 1984-10-31 1986-05-26

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000307019A (ja) 1999-04-22 2000-11-02 Mitsubishi Electric Corp マイクロ波パッケージ構造
US6448637B1 (en) 2001-11-28 2002-09-10 Intersil Americas Inc. Hermetically sealed integrated circuit package incorporating pressure relief valve for equalizing interior and exterior pressures when placed in spaceborne environment
JP2004119881A (ja) 2002-09-27 2004-04-15 Sony Corp 半導体装置及びその製造方法
US20040144435A1 (en) 2003-01-23 2004-07-29 Dark Richard C.G. Check valve
US7675149B1 (en) 2006-09-12 2010-03-09 Maxim Integrated Products, Inc. Check valve package for Pb-free, single piece electronic modules
JP2008223968A (ja) 2007-03-15 2008-09-25 Toyota Motor Corp 液体封入式防振装置
JP2008311940A (ja) 2007-06-14 2008-12-25 Yamaha Corp 半導体装置及びその製造方法
JP2010212511A (ja) 2009-03-11 2010-09-24 Kyocera Corp 電子装置、および電子システム
JP2011159900A (ja) 2010-02-03 2011-08-18 Panasonic Corp 固体撮像装置
US20150014796A1 (en) 2013-07-12 2015-01-15 Infineon Technologies Ag Device with MEMS Structure and Ventilation Path in Support Structure

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JPWO2020184003A1 (enrdf_load_stackoverflow) 2020-09-17
WO2020184003A1 (ja) 2020-09-17

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