JP7515715B2 - 電極端子、半導体装置および半導体装置の製造方法 - Google Patents

電極端子、半導体装置および半導体装置の製造方法 Download PDF

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Publication number
JP7515715B2
JP7515715B2 JP2023522124A JP2023522124A JP7515715B2 JP 7515715 B2 JP7515715 B2 JP 7515715B2 JP 2023522124 A JP2023522124 A JP 2023522124A JP 2023522124 A JP2023522124 A JP 2023522124A JP 7515715 B2 JP7515715 B2 JP 7515715B2
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Japan
Prior art keywords
ball
electrode
electrode terminal
terminal according
contact
Prior art date
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JP2023522124A
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Japanese (ja)
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JPWO2022244194A1 (https=
JPWO2022244194A5 (https=
Inventor
祐貴 河村
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication of JPWO2022244194A1 publication Critical patent/JPWO2022244194A1/ja
Publication of JPWO2022244194A5 publication Critical patent/JPWO2022244194A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H01R13/2478—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point spherical

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  • Connecting Device With Holders (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Measuring Leads Or Probes (AREA)
JP2023522124A 2021-05-20 2021-05-20 電極端子、半導体装置および半導体装置の製造方法 Active JP7515715B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/019177 WO2022244194A1 (ja) 2021-05-20 2021-05-20 電極端子、半導体装置および半導体装置の製造方法

Publications (3)

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JPWO2022244194A1 JPWO2022244194A1 (https=) 2022-11-24
JPWO2022244194A5 JPWO2022244194A5 (https=) 2024-01-04
JP7515715B2 true JP7515715B2 (ja) 2024-07-12

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ID=84141552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023522124A Active JP7515715B2 (ja) 2021-05-20 2021-05-20 電極端子、半導体装置および半導体装置の製造方法

Country Status (3)

Country Link
JP (1) JP7515715B2 (https=)
DE (1) DE112021007682T5 (https=)
WO (1) WO2022244194A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000331141A (ja) 1999-05-17 2000-11-30 Sony Corp 情報記録媒体および情報記録媒体を備える電子機器

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0316075U (https=) * 1989-06-29 1991-02-18
JP2013051052A (ja) 2011-08-30 2013-03-14 Denso Corp 脱着接続構造

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000331141A (ja) 1999-05-17 2000-11-30 Sony Corp 情報記録媒体および情報記録媒体を備える電子機器

Also Published As

Publication number Publication date
DE112021007682T5 (de) 2024-02-29
JPWO2022244194A1 (https=) 2022-11-24
WO2022244194A1 (ja) 2022-11-24

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