JP7504213B2 - 硬化物の製造方法、積層体の製造方法、及び、半導体デバイスの製造方法 - Google Patents

硬化物の製造方法、積層体の製造方法、及び、半導体デバイスの製造方法 Download PDF

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JP7504213B2
JP7504213B2 JP2022551204A JP2022551204A JP7504213B2 JP 7504213 B2 JP7504213 B2 JP 7504213B2 JP 2022551204 A JP2022551204 A JP 2022551204A JP 2022551204 A JP2022551204 A JP 2022551204A JP 7504213 B2 JP7504213 B2 JP 7504213B2
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carbon atoms
acid
cured product
producing
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JPWO2022064917A1 (zh
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孝徳 小泉
敦 中村
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Fujifilm Corp
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Fujifilm Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP2022551204A 2020-09-25 2021-08-20 硬化物の製造方法、積層体の製造方法、及び、半導体デバイスの製造方法 Active JP7504213B2 (ja)

Applications Claiming Priority (3)

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JP2020161178 2020-09-25
JP2020161178 2020-09-25
PCT/JP2021/030563 WO2022064917A1 (ja) 2020-09-25 2021-08-20 硬化物の製造方法、積層体の製造方法、及び、半導体デバイスの製造方法

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JPWO2022064917A1 JPWO2022064917A1 (zh) 2022-03-31
JP7504213B2 true JP7504213B2 (ja) 2024-06-21

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JP2022551204A Active JP7504213B2 (ja) 2020-09-25 2021-08-20 硬化物の製造方法、積層体の製造方法、及び、半導体デバイスの製造方法

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JP (1) JP7504213B2 (zh)
KR (1) KR20230043155A (zh)
CN (1) CN115989457A (zh)
TW (1) TW202212992A (zh)
WO (1) WO2022064917A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115947940A (zh) * 2023-01-10 2023-04-11 山东大学 一种具有双功能的光敏聚酰亚胺前体材料及其制备方法与在光刻中的应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017146153A1 (ja) 2016-02-26 2017-08-31 富士フイルム株式会社 積層体の製造方法および半導体デバイスの製造方法
JP2020154205A (ja) 2019-03-22 2020-09-24 富士フイルム株式会社 パターン形成方法、硬化性樹脂組成物、膜、硬化膜、積層体、及び、半導体デバイス

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06348039A (ja) * 1993-06-14 1994-12-22 Mitsubishi Kasei Corp 感光性平版印刷版の製版方法
JP3100041B2 (ja) * 1997-07-04 2000-10-16 日本合成化学工業株式会社 レジストパターン形成方法
JP4683763B2 (ja) * 2001-05-11 2011-05-18 リコー光学株式会社 高分子材料層の加熱方法及び装置
US20110144297A1 (en) 2009-12-15 2011-06-16 E. I. Du Pont De Nemours And Company Rapid thermal conversion of a polyamic acid fiber to a polyimide fiber
JP7327983B2 (ja) 2018-05-16 2023-08-16 旭化成株式会社 ポリイミド前駆体樹脂組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017146153A1 (ja) 2016-02-26 2017-08-31 富士フイルム株式会社 積層体の製造方法および半導体デバイスの製造方法
JP2020154205A (ja) 2019-03-22 2020-09-24 富士フイルム株式会社 パターン形成方法、硬化性樹脂組成物、膜、硬化膜、積層体、及び、半導体デバイス

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CN115989457A (zh) 2023-04-18
KR20230043155A (ko) 2023-03-30
JPWO2022064917A1 (zh) 2022-03-31
TW202212992A (zh) 2022-04-01
WO2022064917A1 (ja) 2022-03-31

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