JP7479498B2 - 半導体試験装置および半導体試験方法 - Google Patents

半導体試験装置および半導体試験方法 Download PDF

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JP7479498B2
JP7479498B2 JP2022555295A JP2022555295A JP7479498B2 JP 7479498 B2 JP7479498 B2 JP 7479498B2 JP 2022555295 A JP2022555295 A JP 2022555295A JP 2022555295 A JP2022555295 A JP 2022555295A JP 7479498 B2 JP7479498 B2 JP 7479498B2
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constant current
electrode
semiconductor
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semiconductor element
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JPWO2022074952A1 (https=
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学 中西
幸一 高山
和起 上野
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Mitsubishi Electric Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2022555295A 2020-10-05 2021-08-25 半導体試験装置および半導体試験方法 Active JP7479498B2 (ja)

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JP2020168349 2020-10-05
JP2020168349 2020-10-05
PCT/JP2021/031177 WO2022074952A1 (ja) 2020-10-05 2021-08-25 半導体試験装置および半導体試験方法

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JP7479498B2 true JP7479498B2 (ja) 2024-05-08

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Publication number Priority date Publication date Assignee Title
CN120188268A (zh) * 2022-11-17 2025-06-20 三菱电机株式会社 半导体试验装置、半导体试验方法以及半导体装置的制造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006071467A (ja) 2004-09-02 2006-03-16 Toyota Industries Corp 半導体チップの電気特性測定方法及び装置
JP2011138865A (ja) 2009-12-28 2011-07-14 Micronics Japan Co Ltd 半導体デバイスの検査装置
JP2012151323A (ja) 2011-01-20 2012-08-09 Toshiba Corp 半導体装置およびその製造方法
JP2014036105A (ja) 2012-08-08 2014-02-24 Mitsubishi Electric Corp 半導体装置の測定方法、測定器
JP2018179618A (ja) 2017-04-06 2018-11-15 トヨタ自動車株式会社 半導体素子の検査装置
JP2019125642A (ja) 2018-01-15 2019-07-25 信越半導体株式会社 半導体装置の評価装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0233437U (https=) * 1988-08-26 1990-03-02

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006071467A (ja) 2004-09-02 2006-03-16 Toyota Industries Corp 半導体チップの電気特性測定方法及び装置
JP2011138865A (ja) 2009-12-28 2011-07-14 Micronics Japan Co Ltd 半導体デバイスの検査装置
JP2012151323A (ja) 2011-01-20 2012-08-09 Toshiba Corp 半導体装置およびその製造方法
JP2014036105A (ja) 2012-08-08 2014-02-24 Mitsubishi Electric Corp 半導体装置の測定方法、測定器
JP2018179618A (ja) 2017-04-06 2018-11-15 トヨタ自動車株式会社 半導体素子の検査装置
JP2019125642A (ja) 2018-01-15 2019-07-25 信越半導体株式会社 半導体装置の評価装置

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CN116325104A (zh) 2023-06-23
WO2022074952A1 (ja) 2022-04-14
JPWO2022074952A1 (https=) 2022-04-14

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