JP7449210B2 - 配線基板及びその製造方法 - Google Patents

配線基板及びその製造方法 Download PDF

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Publication number
JP7449210B2
JP7449210B2 JP2020162183A JP2020162183A JP7449210B2 JP 7449210 B2 JP7449210 B2 JP 7449210B2 JP 2020162183 A JP2020162183 A JP 2020162183A JP 2020162183 A JP2020162183 A JP 2020162183A JP 7449210 B2 JP7449210 B2 JP 7449210B2
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JP
Japan
Prior art keywords
layer
resin
wiring
insulating layer
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020162183A
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English (en)
Japanese (ja)
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JP2022054913A (ja
JP2022054913A5 (https=
Inventor
裕司 雪入
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2020162183A priority Critical patent/JP7449210B2/ja
Priority to US17/447,977 priority patent/US11617264B2/en
Publication of JP2022054913A publication Critical patent/JP2022054913A/ja
Publication of JP2022054913A5 publication Critical patent/JP2022054913A5/ja
Application granted granted Critical
Publication of JP7449210B2 publication Critical patent/JP7449210B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0269—Non-uniform distribution or concentration of particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2020162183A 2020-09-28 2020-09-28 配線基板及びその製造方法 Active JP7449210B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2020162183A JP7449210B2 (ja) 2020-09-28 2020-09-28 配線基板及びその製造方法
US17/447,977 US11617264B2 (en) 2020-09-28 2021-09-17 Interconnect substrate and method of making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020162183A JP7449210B2 (ja) 2020-09-28 2020-09-28 配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2022054913A JP2022054913A (ja) 2022-04-07
JP2022054913A5 JP2022054913A5 (https=) 2023-03-31
JP7449210B2 true JP7449210B2 (ja) 2024-03-13

Family

ID=80822027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020162183A Active JP7449210B2 (ja) 2020-09-28 2020-09-28 配線基板及びその製造方法

Country Status (2)

Country Link
US (1) US11617264B2 (https=)
JP (1) JP7449210B2 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001203313A (ja) 1999-11-09 2001-07-27 Matsushita Electric Ind Co Ltd 熱伝導基板およびその製造方法
JP2007067217A (ja) 2005-08-31 2007-03-15 Sanyo Electric Co Ltd 回路装置およびその製造方法
JP2011164305A (ja) 2010-02-08 2011-08-25 Taiyo Holdings Co Ltd 積層構造体及びそれに用いる感光性ドライフィルム
JP2012235166A (ja) 2012-08-23 2012-11-29 Shinko Electric Ind Co Ltd 配線基板及びその製造方法
JP2016219478A (ja) 2015-05-15 2016-12-22 イビデン株式会社 配線基板及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013094606A1 (ja) * 2011-12-22 2013-06-27 太陽インキ製造株式会社 ドライフィルム及びそれを用いたプリント配線板、プリント配線板の製造方法、及びフリップチップ実装基板
US20140027163A1 (en) * 2012-07-30 2014-01-30 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method for manufacturing the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001203313A (ja) 1999-11-09 2001-07-27 Matsushita Electric Ind Co Ltd 熱伝導基板およびその製造方法
JP2007067217A (ja) 2005-08-31 2007-03-15 Sanyo Electric Co Ltd 回路装置およびその製造方法
JP2011164305A (ja) 2010-02-08 2011-08-25 Taiyo Holdings Co Ltd 積層構造体及びそれに用いる感光性ドライフィルム
JP2012235166A (ja) 2012-08-23 2012-11-29 Shinko Electric Ind Co Ltd 配線基板及びその製造方法
JP2016219478A (ja) 2015-05-15 2016-12-22 イビデン株式会社 配線基板及びその製造方法

Also Published As

Publication number Publication date
US20220104352A1 (en) 2022-03-31
JP2022054913A (ja) 2022-04-07
US11617264B2 (en) 2023-03-28

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