JP7438454B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP7438454B2
JP7438454B2 JP2023509917A JP2023509917A JP7438454B2 JP 7438454 B2 JP7438454 B2 JP 7438454B2 JP 2023509917 A JP2023509917 A JP 2023509917A JP 2023509917 A JP2023509917 A JP 2023509917A JP 7438454 B2 JP7438454 B2 JP 7438454B2
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Japan
Prior art keywords
circuit pattern
electrode
semiconductor device
pair
sub
Prior art date
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Active
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JP2023509917A
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English (en)
Japanese (ja)
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JPWO2022208603A1 (https=
Inventor
賢太 中原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of JPWO2022208603A1 publication Critical patent/JPWO2022208603A1/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023509917A 2021-03-29 2021-03-29 半導体装置 Active JP7438454B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/013259 WO2022208603A1 (ja) 2021-03-29 2021-03-29 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2022208603A1 JPWO2022208603A1 (https=) 2022-10-06
JP7438454B2 true JP7438454B2 (ja) 2024-02-26

Family

ID=83455713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023509917A Active JP7438454B2 (ja) 2021-03-29 2021-03-29 半導体装置

Country Status (5)

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US (1) US20240071868A1 (https=)
JP (1) JP7438454B2 (https=)
CN (1) CN117043939A (https=)
DE (1) DE112021007408T5 (https=)
WO (1) WO2022208603A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0277870A (ja) * 1988-06-30 1990-03-16 Mitsubishi Electric Corp 並列計算機システム
JPH0277870U (https=) * 1988-12-02 1990-06-14
JP2850606B2 (ja) * 1991-11-25 1999-01-27 富士電機株式会社 トランジスタモジュール
JP3396566B2 (ja) * 1995-10-25 2003-04-14 三菱電機株式会社 半導体装置
DE102008005547B4 (de) * 2008-01-23 2013-08-29 Infineon Technologies Ag Leistungshalbleitermodul und Schaltungsanordnung mit einem Leistungshalbleitermodul
CN105981167B (zh) * 2014-08-12 2019-05-28 富士电机株式会社 半导体装置
BE1028071B1 (de) * 2020-02-19 2021-09-13 Phoenix Contact Gmbh & Co Elektrisches Kontaktelement

Also Published As

Publication number Publication date
DE112021007408T5 (de) 2024-01-18
JPWO2022208603A1 (https=) 2022-10-06
US20240071868A1 (en) 2024-02-29
WO2022208603A1 (ja) 2022-10-06
CN117043939A (zh) 2023-11-10

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