JP7425618B2 - Method for manufacturing a light emitting device, and light emitting device - Google Patents

Description

The present invention relates to a method for manufacturing a light emitting device and a light emitting device.

A light emitting device has been proposed in which an LED element is bonded to a substrate having an electrode using an anisotropic conductive adhesive in which conductive particles are contained in the adhesive (Patent Document 1).

Japanese Patent Application Publication No. 2014-160708

Patent Document 1 discloses a light emitting device in which an LED chip including one LED element is bonded to a substrate having an electrode using an anisotropic conductive adhesive.
However, there is no disclosure of a light-emitting device having a large number of LED elements and a method for manufacturing the same, and it is difficult to manufacture a large-area light-emitting device having a large number of LED elements with high productivity.

According to a first aspect, a method for manufacturing a light emitting device includes a plurality of light emitting elements arranged with the light emitting side facing the front surface, and terminals of the plurality of light emitting elements are exposed on the back surface. A wiring board having wiring formed on a front surface is prepared, and the back surface of the light emitting board and the front surface of the wiring board are coated with a thermosetting resin. are arranged to face each other with an anisotropic conductive member containing conductive particles sandwiched therebetween, and the back surface of the light emitting substrate and the front surface of the wiring board are joined by the anisotropic conductive member; The method includes electrically connecting the terminals of the plurality of light emitting elements and the wiring of the wiring board by the conductive particles contained in the directional conductive member.
According to the second aspect, the light emitting device includes a light emitting board on which a plurality of light emitting elements are arranged, a wiring board on which wiring is formed, a plurality of the light emitting elements arranged on the light emitting board, and a wiring board on which wiring is formed. and an anisotropic conductive member made of resin containing conductive particles and electrically connected to the wiring.

A light-emitting device with a large-area light-emitting surface can be realized at low cost.

FIG. 1 is a diagram showing a light emitting device according to an embodiment. 1(a) shows a perspective view, FIG. 1(b) shows a top view, and FIG. 1(c) shows a partial cross-sectional view taken along line A in FIG. 1(b). FIG. 3 is a diagram illustrating a method for manufacturing a light emitting device. FIG. 2(a) is a bottom view of the light emitting substrate to be prepared. FIG. 2(b) is a top view of the wiring board to be prepared. FIG. 2(c) is a perspective view showing a state in which a light emitting board, a wiring board, and an anisotropic conductive member are aligned and placed facing each other. FIG. 3 is a diagram illustrating a method for manufacturing a light emitting device, and is a diagram showing a process subsequent to FIG. 2. FIG. 3A is a partial cross-sectional view showing a state in which a light emitting board, a wiring board, and an anisotropic conductive member are arranged facing each other in alignment. FIG. 3(b) is a diagram showing a state in which a light emitting board and a wiring board are joined via an anisotropic conductive member. The figure explaining the modification of the manufacturing method of a light emitting device.

(Light emitting device of one embodiment)
FIG. 1 is a diagram showing a light emitting device 1 of one embodiment. The X direction, Y direction, and Z direction indicated by arrows in each of FIGS. 1(a) to 1(c) are directions orthogonal to each other, and the direction of each arrow is defined as the + direction. The X direction, Y direction, and Z direction indicate the same direction in FIGS. 1(a) to 1(c) and in each subsequent figure.

Hereinafter, the +Z direction will also be referred to as "above", and viewing each member from the +Z direction will also be referred to as "viewing from above." Viewing each member from the -Z direction is also called "viewing from below." A view of each member viewed from above is referred to as a "top view," and a view of each member viewed from below is referred to as a "bottom view."

FIG. 1(a) is a perspective view of the light-emitting device 1, FIG. 1(b) is a top view of the light-emitting device 1, and FIG. 1(c) is the light emission along the line segment A shown in FIG. A partial cross-sectional view of the device 1 is shown.
As shown in FIG. 1(a), the light emitting device 1 is formed by joining a light emitting substrate 10 placed on its +Z side and a wiring board 20 placed on its -Z side.
Hereinafter, the +Z side surface of the light emitting substrate 10 will be referred to as a "front surface" 10f, and the -Z side surface will be referred to as a "back surface" 10b. Further, the +Z side surface of the wiring board 20 is referred to as an "upper surface" 20f.

As shown in FIGS. 1A and 1B, a plurality of light emitting elements 12 are two-dimensionally arranged on the light emitting substrate 10 along, for example, the X direction and the Y direction. FIGS. 1A and 1B show a state in which a total of 54 light emitting elements 12 are arranged, nine in the X direction and six in the Y direction. However, several dozen or more light emitting elements 12 may be arranged in both the X direction and the Y direction, and the total number may be 1000 or more. Furthermore, several hundred or more light emitting elements 12 may be arranged in both the X direction and the Y direction, and the total number may be tens of thousands or more.
The diagonal length of the light emitting substrate 10 may be, for example, 100 mm or more.

As an example, the length of the wiring board 20 in the Y direction is longer than the length of the light emitting board 10 in the Y direction, and the vicinity of the ends of the upper surface 20f of the wiring board 20 in the +Y direction and the -Y direction face the light emitting board 10. It's completely exposed. A connecting portion 22c and a connecting portion 22d, which are part of the wiring 22 shown in FIG. 2(b) etc., are formed near the +Y direction end and −Y direction end of the upper surface 20f of the wiring board 20, respectively. has been done.

Since most of the wiring 22 is shielded by the light emitting substrate 10, it is not shown in FIGS. 1(a) and 1(b). Therefore, an example of the shape of the wiring 22 formed on the upper surface 20f of the wiring board 20 will be described with reference to FIG. 2(b) showing a top view of the wiring board 20.

As shown in FIG. 2B as an example, the wiring 22 includes wiring 22a and wiring 22b each extending in the Y direction and alternately arranged in the X direction. The arrangement period of each of the plurality of wirings 22a and the plurality of wirings 22b in the X direction is equal to the arrangement period of the light emitting elements 12 arranged on the light emitting substrate 10 in the X direction.

Furthermore, the ends of the plurality of wirings 22a in the +Y direction are connected to each other, and a connection part 22c is formed in a part of the connected ends in the +Y direction. The ends of the plurality of wirings 22b in the -Y direction are also connected to each other, and a connection part 22d is formed in a part of the connected ends in the -Y direction.
The wiring 22a, the wiring 22b, the connecting portion 22c, and the connecting portion 22d are also referred to collectively or individually as the wiring 22.

FIG. 1(c) is a partial cross-sectional view showing a portion of the light emitting device 1 shown in FIG. 1(b) corresponding to the line segment A when viewed from the -Y side.
As shown in FIG. 1(c), the light emitting element 12 includes, for example, an inorganic or organic LED 13, a fluorescent member 14, and terminals 15a and 15b, and the LED 13 emits light by power supplied from the terminals 15a and 15b. .

A translucent resin 11b is provided on the +Z side of the fluorescent member 14, and the light emitted from the LED 13 and at least a part of which is wavelength-converted by the fluorescent member 14 passes through the resin 11b and is The light is emitted to the outside of the light emitting device 1 from the front surface 10f. In other words, among the light emitting elements 12, the LED 13 and the fluorescent member 14, which are the light emitting side, are arranged so as to face the front surface 10f of the light emitting substrate 10.
By arranging the plurality of light emitting elements 12, the front surface 10f of the light emitting substrate 10 functions as a large area light emitting surface.

Portions of the light emitting element 12 that are not in contact with the translucent resin 11b are covered with the resin 11a, except for the -Z side ends of the terminals 15a and 15b. The resin 11a may or may not be translucent. The resin 11a and the resin 11b constitute a support 11 that supports a plurality of light emitting elements 12. The light emitting substrate 10 includes a support 11 and a plurality of light emitting elements 12.

The back surface 10b of the light emitting board 10 and the top surface 20f of the wiring board 20 are joined via an anisotropic conductive member 30. The anisotropic conductive member 30 is a member made of a resin 31 containing conductive particles 32a and 32b (hereinafter collectively referred to as "conductive particles 32"). The resin 31 is, for example, a thermosetting resin, and also functions as an adhesive for bonding the light emitting board 10 and the wiring board 20 together. The conductive particles 32 are, for example, approximately spherical particles having a gold plating layer formed on the surface of nickel.

At the portions where the terminals 15a, 15b of the light-emitting board 10 and the wirings 22a, 22b of the wiring board 20 face each other, the conductive particles 32a in the anisotropic conductive member 30 come into contact with the terminals 15a, 15b and the wirings 22a, 22b. are doing. Therefore, the opposing terminals 15a, 15b and the wirings 22a, 22b are electrically connected by the conductive particles 32a.

On the other hand, in the portion where the terminals 15a, 15b and the wirings 22a, 22b do not face each other, the conductive particles 32b inside the anisotropic conductive member 30 do not come into contact with at least one of the terminals 15a, 15b or the wirings 22a, 22b. It is arranged without any problem. Therefore, the resin 31 electrically insulates between the terminals 15a, 15b and the wirings 22a, 22b that do not face each other, between the plurality of terminals 15a, 15b, and between the plurality of wirings 22a, 22b. ing.

For example, when a reference voltage is applied to the connection part 22d and a voltage more positive than the reference voltage is applied to the connection part 22c from a power source (not shown) via a conductive wire (not shown), the positive voltage is applied from the connection part 22c to the wiring 22a. A voltage is applied to the terminal 15a of the light emitting element 12. On the other hand, the reference voltage applied to the connection portion 22d is applied to the terminal 15b of the light emitting element 12 via the wiring 22b. As a result, a voltage (potential difference) is applied between the two terminals 15b, 15b of the light emitting element 12, and the light emitting element 12 emits light.

In the light emitting device 1 of the above-described embodiment, the length of the wiring board 20 in the Y direction is made longer than the length of the light emitting board 10 in the Y direction in order to expose the connecting portions 22c and 22d of the wiring 22. . However, if there is no need to expose the connecting parts 22c, 22d to the upper surface 20f of the wiring board 20, such as when the connecting parts 22c, 22d are provided on the side surface of the wiring board 20, The length may be the same as or shorter than the length of the light emitting substrate 10 in the Y direction.

Furthermore, the positions where the connecting portions 22c and 22d are exposed are not limited to both ends of the wiring board 20 in the Y direction, but both ends of the wiring board 20 in the X direction, or one end of the wiring board 20 in the X direction or the Y direction. It may be.
The shape of the wiring 22 formed on the upper surface 20f of the wiring board 20 is not limited to the above-mentioned shape, and may have a shape in which each of the terminals 15a and 15b is arranged facing each of the wirings 22a and 22b. For example, other shapes may be used.

Further, the light emitting section included in the light emitting element 12 is not limited to the above-mentioned LED 13, and may be another light emitting device. If the LED 13 or other light emitting device emits light in a wide wavelength range, the light emitting element 12 may not include the fluorescent member 14. Further, if the fluorescent member 14 does not need to be protected, the light-transmitting resin 11b may not be provided.

(Method for manufacturing a light emitting device according to one embodiment)
Hereinafter, with reference to FIGS. 2 and 3, an embodiment of a method for manufacturing the light emitting device 1 according to one embodiment will be described. It should be noted that the following description does not only explain the method for manufacturing the light emitting device 1, but also describes the detailed configuration of each part that constitutes the light emitting device 1 of one embodiment. .

(Step 1)
The light emitting substrate 10 shown in FIG. 2(a) is prepared. FIG. 2(a) is a bottom view of the light emitting substrate 10.
The light emitting substrate 10 is, for example, a rectangular substrate having sides parallel to the X direction and the Y direction, and as described above, a plurality of light emitting elements 12 are arranged two-dimensionally along the X direction and the Y direction. It is something.

As shown in FIG. 1(c) above, the light emitting substrate 10 has a plurality of light emitting elements 12, and each of the light emitting elements 12 has an LED 13 and a fluorescent member 14 on the light emitting side. It is arranged so as to face the front surface 10f of 10. Further, the LED 13 and the fluorescent member 14 of the light emitting element 12 are sealed with a support 11 containing resin 11a etc., and only the -Z side ends of the terminals 15a and 15b in the light emitting element 12 emit light. It is exposed on the back surface 10b of the substrate 10. Therefore, in FIG. 2A, the portions of the light emitting element 12 sealed by the support 11 other than the terminals 15a and 15b are indicated by broken lines.

The material of the support body 11 is not limited to resin, and may be, for example, an inorganic material. However, by using the support body 11 made of resin, the light emitting substrate 10 can be prepared at a lower cost.
As an example, the light-emitting board 10 is made by arranging a plurality of light-emitting elements 12 with terminals 15a and 15b facing down on a temporary substrate (not shown), molding the plurality of light-emitting elements 12 with resin, and then peeling off the temporary substrate (not shown). By doing so, it can be formed.

In this case, the resin used for the mold may be completely translucent, with the part including the +Z side of the light emitting element 12 being made of translucent resin, and the other parts being made of non-transparent resin. It may also be molded with resin.
Furthermore, if the light emitting substrate 10 is on sale, it may be purchased and used.

(Step 2)
The wiring board 20 shown in FIG. 2(b) is prepared. FIG. 2(b) is a top view of the wiring board 20. The wiring board 20 is, for example, a rectangular board having sides parallel to the X direction and the Y direction, and its length in the X direction is approximately equal to the length of the light emitting board 10 in the X direction. On the other hand, the length of the wiring board 20 in the Y direction is longer than the length of the light emitting board 10 in the Y direction.

For example, on the upper surface 20f of the substrate 21 included in the wiring board 20, wirings 22a and 22b are formed which extend in the Y direction and are alternately arranged in the X direction. The arrangement period of each of the plurality of wirings 22a and the plurality of wirings 22b in the X direction is equal to the arrangement period of the light emitting elements 12 arranged on the light emitting substrate 10 in the X direction.

The wiring board 20 can be formed, for example, by forming wirings 22a and 22b made of a conductor such as copper on the board 21 using a lithography technique or a dispenser.
Furthermore, if the wiring board 20 described above is on sale, it may be purchased and used.

(Step 3)
As shown in FIG. 2(c), using a bonding device (not shown), the back surface 10b of the prepared light emitting board 10 and the top surface 20f of the prepared wiring board 20 are bonded together using a thermosetting resin with conductive particles. The anisotropic conductive members 30, which are contained anisotropic conductive films, are placed opposite each other.

FIG. 3(a) shows a portion of the light emitting substrate 10, the anisotropic conductive member 30, and the wiring board 20 arranged facing each other as viewed from the -Y side in the state shown in FIG. 2(c). FIG. 2 is a cross-sectional view showing an XZ cross section of a portion corresponding to line segment A shown in FIGS. 2(a) and 2(c).
Note that the line segment A in FIG. 2(c) corresponds to the line segment A in the finished product light emitting device 1 shown in FIG. 1(b).

As described above, the conductive particles 32 in the anisotropic conductive member 30 are, for example, approximately spherical particles having a gold plating layer formed on the surface of nickel.
In this facing arrangement, the light emitting board 10 and the wiring board 20 are arranged in the X direction and the Y direction so that the terminals 15a and 15b each face the wiring 22a and the wiring 22b with the anisotropic conductive member 30 in between. Set the positional relationship.

Note that the position detection mark 23 may be formed on the upper surface 20f of the wiring board 20. Then, the position detection optical system ALG of the bonding device (not shown) detects the position of the position detection mark 23 via the support 11 of the light emitting board 10, and The positional relationship in the direction may also be set.
Note that the anisotropic conductive member 30 is placed away from the vicinity of the position detection mark 23 so as not to block the detection light beam of the position detection optical system ALG.

The position detection mark 23 is formed at a position that has a predetermined positional relationship with the wiring 22. The position detection mark 23 may be formed simultaneously with the wiring 22 in the process of forming the wiring 22 on the wiring board 20, or may be formed separately from the wiring 22 using a laser marker or the like.
The position detection mark may be formed not on the wiring board 20 but on the back surface 10b of the light emitting board 10. Alternatively, it may be formed on both the upper surface 20f of the wiring board 20 and the back surface 10b of the light emitting substrate 10.

(Step 4)
From the states shown in FIGS. 2(c) and 3(a), the light emitting substrate 10 and the wiring board 20 are brought closer to each other in the Z direction and brought into contact with each other. Then, heat treatment is performed to harden the thermosetting resin 31 and bond the light emitting substrate 10 and the wiring board 20 together.

FIG. 3B shows a state in which the light emitting board 10 and the wiring board 20 are bonded together using a thermosetting resin 31.
At this time, the conductive particles 32a included in the anisotropic conductive member 30 placed between the terminal 15a and the wiring 22a, which are arranged facing each other, come into contact with the terminal 15a and the wiring 22a. Further, the conductive particles 32a included in the anisotropic conductive member 30 placed between the terminal 15b and the wiring 22b that are arranged to face each other come into contact with the terminal 15b and the wiring 22b. Therefore, the conductive particles 32a electrically connect the opposing terminals 15a, 15b and the wirings 22a, 22b.

On the other hand, in the portion where the terminals 15a, 15b and the wirings 22a, 22b do not face each other, the conductive particles 32b inside the anisotropic conductive member 30 are separated from two or more of the terminals 15a, 15b or the wirings 22a, 22b. placed without touching. Therefore, the thermosetting resin 31 electrically insulates between the terminals 15a, 15b and the wirings 22a, 22b that do not face each other, between the plurality of terminals 15a, 15b, and between the plurality of wirings 22a, 22b. It is in a state.

Note that when connecting the wirings 22a and 22b and the terminals 15a and 15b using bumps instead of using the anisotropic conductive member 30 as in the embodiment, the light emitting board 10 and the wiring board 20 are Bonded only by locally placed bumps. Therefore, it is difficult to obtain sufficient bonding force between the light emitting substrate 10 and the wiring board 20, resulting in unreliable bonding.

On the other hand, in the embodiment, the back surface 10b of the light emitting substrate 10 and the upper surface 20f of the wiring board 20 are bonded (bonded) with thermosetting resin 31 over almost the entire surface except for the portion where the terminals 15a and 15b are arranged. ), the light emitting board 10 and the wiring board 20 can be bonded with sufficient adhesive strength.

(Step 5)
After the light emitting board 10 and the wiring board 20 are bonded, the ends of the light emitting board 10 and the wiring board 20 in the +X direction are cut using a dicing saw or the like along the cutting line CL shown by a broken line in FIG. 3(b). . Similarly, the ends of the light emitting board 10 and the wiring board 20 in the -X direction are cut.
Through the above steps, the light emitting device 1 shown in FIGS. 1(a) to 1(c) is completed.

Note that, if necessary, both ends or one end of the light emitting board 10 and the wiring board 20 in the Y direction may be cut.
Note that the above-mentioned position detection mark 23 may be placed outside the position of the cutting line CL, as shown in FIG. 3(b), or may be placed inside the position of the cutting line CL. .

Note that the shapes of the wirings 22a and 22b formed on the wiring board 20 are not limited to the above-mentioned shapes in which each of them extends in the Y direction. The shapes of the wiring 22a and the wiring 22b may be any other shape as long as they face the terminals 15a and 15b, respectively, and can supply power to the respective light emitting elements 12.

(Variation of manufacturing method)
FIG. 4 is a diagram illustrating a modification of the method for manufacturing the light emitting device 1.
As shown in FIG. 4, in the manufacturing method of the modified example, in step 3, an anisotropic conductive paste containing conductive particles 32 in a thermosetting resin 31 is applied to the back surface 10b of the prepared light emitting substrate 10. The manufacturing method differs from the manufacturing method of the above-described embodiment in that the anisotropic conductive member 30 is applied. However, each process other than that is the same as the manufacturing method of the above-mentioned embodiment.

Therefore, in the manufacturing method of the modified example, the positional relationship between the light emitting board 10 coated with the anisotropic conductive member 30 and the wiring board 20 is adjusted to the positional relationship between the terminals 15a and the terminals 15b formed on the back surface 10b of the light emitting board 10. is set to face the wiring 22a and the wiring 22b. Then, the light emitting substrate 10 and the wiring board 20 are bonded.
As a further modification, the anisotropic conductive member 30, which is an anisotropic conductive paste, may be applied to the upper surface 20f of the wiring board 20 instead of the back surface 10b of the light emitting substrate 10.

In the manufacturing methods of the embodiments and modified examples described above, in step 1, the characteristics of the prepared light emitting substrate 10 may be checked. That is, in the prepared light emitting board 10, since the terminals 15a and 15b of each light emitting element 12 are exposed on the back surface 10b, a tester is brought into contact with the terminals 15a and 15b to check whether each light emitting element 12 satisfies the predetermined specifications. You can check whether there is one or not. The predetermined specifications are, for example, specifications regarding the amount of light emitted with respect to the supplied power, the emission spectrum, or the radiation angle characteristics.

Similarly, in step 2, the characteristics of the prepared wiring board 20 may be checked. That is, a tester may be brought into contact with each part of the wiring 22 on the prepared wiring board 20 to check whether the conduction state, electrical resistance, etc. of each part of the wiring 22 satisfy predetermined specifications.
By confirming the characteristics of at least one of the light emitting substrate 10 and the wiring board 20 before step 4, it is possible to select and join the light emitting substrate 10 and the wiring board 20 that meet the specifications, thereby increasing the yield. (productivity) can be improved.

In the manufacturing method of the embodiment and modification described above, one light emitting device 1 is manufactured by bonding one light emitting substrate 10 and one wiring board 20. However, a board having a plurality of light emitting boards 10 in parallel (a composite light emitting board) and a board having a plurality of wiring boards 20 in parallel (a composite wiring board) are prepared, and these are connected via an anisotropic conductive member 30. By joining, an intermediate body in which a plurality of light emitting devices 1 are connected may be formed. Then, by separating each light emitting device 1 from this intermediate, a plurality of light emitting devices 1 may be manufactured.

(Effects of the manufacturing method of the light emitting device of one embodiment and modification)
(1) The manufacturing method of the light emitting device 1 of one embodiment and each modification includes a plurality of light emitting elements 12 arranged with the light emitting side (LED 13, fluorescent member 14) facing the front surface 10f. However, preparing a light emitting substrate 10 in which terminals 15a and 15b of a plurality of light emitting elements 12 are exposed on the back surface 10b, preparing a wiring board 20 having wiring 22 formed on the upper surface 20f, and 10b and the upper surface 20f of the wiring board 20 are arranged to face each other with an anisotropic conductive member 30 in which conductive particles 32 are contained in a thermosetting resin 31 interposed therebetween. The back surface 10b of the wiring board 20 is joined to the upper surface 20f of the wiring board 20, and the terminals 15a, 15b of the plurality of light emitting elements 12 and the wirings 22a, 22b of the wiring board 20 are connected by the conductive particles 32 contained in the anisotropic conductive member 30. electrically connecting.
With this configuration, the light emitting board 10 having a plurality of light emitting elements 12 and the wiring board 20 can be joined at low cost while electrically connecting the terminals 15a, 15b of the light emitting elements 12 and the wirings 22a, 22b. Can be done. Therefore, the light emitting device 1 having a large area light emitting surface (front surface 10f) can be manufactured at low cost.

(2) Furthermore, as the light-emitting substrate 10, a substrate in which a plurality of light-emitting elements 12 are sealed with resin, at least a portion of which is transparent, may be prepared. Thereby, the light emitting device 1 can be manufactured at even lower cost.
(3) Furthermore, a position detection mark 23 may be provided on a part of the back surface 10b of the light emitting board 10 or a part of the upper surface 20f of the wiring board 20, and the anisotropic conductive member 30 may be provided as the position detection mark 23. They may be placed in positions that do not face each other. Thereby, using the position detection mark 23, it is possible to accurately align the terminals 15a, 15b of the light emitting element 12 and the wirings 22a, 22b.

(4) Furthermore, before joining the light emitting board 10 and the wiring board 20, the characteristics of at least one of the light emitting board 10 and the wiring board 20 may be checked, so that the light emitting board has characteristics that meet the specifications. 10 and the wiring board 20 can be selected and joined, and the yield (productivity) can be further improved.

(Effects of the light emitting device of one embodiment)
(5) The light emitting device 1 of one embodiment includes a light emitting substrate 10 on which a plurality of light emitting elements 12 are arranged, a wiring board 20 on which wiring 22 is formed, and a plurality of light emitting elements 12 arranged on the light emitting substrate 10. It includes an anisotropic conductive member 30 made of resin 31 containing conductive particles 32 and electrically connected to the wiring 22 on the wiring board 20.
With this configuration, the light emitting device 1 having a large area light emitting surface (front surface 10f) can be realized at low cost.

(6) Furthermore, by using the light-emitting substrate 10 as a substrate in which a plurality of light-emitting elements 12 are sealed with a resin (supporting body 11) at least partially transparent, the light-emitting device 1 can be realized at a lower cost. can do.

Although various embodiments and modifications have been described above, the present invention is not limited to these. Other embodiments considered within the technical spirit of the present invention are also included within the scope of the present invention.

1: Light emitting device, 10: Light emitting board, 10f: Front surface, 10b: Back surface, 11: Support body, 12: Light emitting element, 13: LED, 14: Fluorescent member, 15a, 15b: Terminal, 20: Wiring board , 20f: Top surface, 21: Substrate, 22a, 22b: Wiring, 23: Position detection mark, 30: Anisotropic conductive member, 31: Resin, 32, 32a, 32b: Conductive particles

Claims (8)

A plurality of light emitting elements are arranged with the light emitting side facing the front surface , and the plurality of light emitting elements are sealed so that a pair of terminals of the plurality of light emitting elements are exposed on the same plane on the back surface. providing a light emitting substrate having a support for stopping and supporting the light emitting substrate;
preparing a wiring board with wiring formed on its front surface;
arranging the back surface of the light emitting substrate and the front surface of the wiring board to face each other with an anisotropic conductive member containing conductive particles in a thermosetting resin sandwiched therebetween;
The back surface of the light emitting substrate and the front surface of the wiring board are joined by the anisotropic conductive member, and the pair of light emitting elements are connected by the conductive particles contained in the anisotropic conductive member. electrically connecting the terminal of the terminal and the wiring of the wiring board;
A method for manufacturing a light emitting device, comprising: The method for manufacturing a light emitting device according to claim 1,
A method for manufacturing a light-emitting device, comprising preparing, as the light-emitting substrate, a substrate in which the light-emitting sides of the plurality of light-emitting elements exposed on the same plane are sealed with a resin that is at least partially transparent. In the method for manufacturing a light emitting device according to claim 1 or 2,
A position detection mark is provided on a part of the back surface of the light emitting board or a part of the front surface of the wiring board,
A method for manufacturing a light emitting device, wherein the anisotropic conductive member is arranged at a position not facing the position detection mark. In the method for manufacturing a light emitting device according to any one of claims 1 to 3,
A method for manufacturing a light emitting device, comprising confirming characteristics of at least one of the light emitting substrate and the wiring board before joining the light emitting substrate and the wiring board. A plurality of light emitting elements are arranged with the light emitting side facing the front surface , and the plurality of light emitting elements are sealed so that a pair of terminals of the plurality of light emitting elements are exposed on the same plane on the back surface. a light emitting substrate having a support for stopping and supporting the light emitting substrate;
a wiring board on which wiring is formed;
an anisotropic conductive member made of resin containing conductive particles that electrically connects the pair of terminals of the plurality of light emitting elements arranged on the light emitting substrate and the wiring on the wiring board;
A light emitting device comprising: The light emitting device according to claim 5,
The light emitting device is a light emitting device, wherein the light emitting substrate is a substrate in which the light emitting sides of the plurality of light emitting elements exposed on the same plane are sealed with a resin that is at least partially transparent. The light emitting device according to claim 5 or 6,
A light emitting device, wherein the light emitting substrate has a diagonal length of 100 mm or more. The light emitting device according to any one of claims 5 to 7,
A light emitting device including 1000 or more of the light emitting elements.

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