JP7404354B2 - 熱交換システム - Google Patents

熱交換システム Download PDF

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Publication number
JP7404354B2
JP7404354B2 JP2021515878A JP2021515878A JP7404354B2 JP 7404354 B2 JP7404354 B2 JP 7404354B2 JP 2021515878 A JP2021515878 A JP 2021515878A JP 2021515878 A JP2021515878 A JP 2021515878A JP 7404354 B2 JP7404354 B2 JP 7404354B2
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JP
Japan
Prior art keywords
circuit
temperature
heat
heat exchange
chiller device
Prior art date
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JP2021515878A
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English (en)
Japanese (ja)
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JPWO2020217800A1 (https=
JPWO2020217800A5 (https=
Inventor
彰浩 伊藤
隆弘 南谷
慎一 新田
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CKD Corp
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CKD Corp
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Publication date
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Publication of JPWO2020217800A1 publication Critical patent/JPWO2020217800A1/ja
Publication of JPWO2020217800A5 publication Critical patent/JPWO2020217800A5/ja
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • F28D20/021—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat the latent heat storage material and the heat-exchanging means being enclosed in one container
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/02—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
    • F28D1/053—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
    • F28D1/0535—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight the conduits having a non-circular cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B1/00—Compression machines, plants or systems with non-reversible cycle
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
    • F28F27/02—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus for controlling the distribution of heat-exchange media between different channels
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Control Of Temperature (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Heat-Pump Type And Storage Water Heaters (AREA)
JP2021515878A 2019-04-23 2020-03-19 熱交換システム Active JP7404354B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019081863 2019-04-23
JP2019081863 2019-04-23
PCT/JP2020/012293 WO2020217800A1 (ja) 2019-04-23 2020-03-19 熱交換システム

Publications (3)

Publication Number Publication Date
JPWO2020217800A1 JPWO2020217800A1 (https=) 2020-10-29
JPWO2020217800A5 JPWO2020217800A5 (https=) 2022-01-26
JP7404354B2 true JP7404354B2 (ja) 2023-12-25

Family

ID=72942477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021515878A Active JP7404354B2 (ja) 2019-04-23 2020-03-19 熱交換システム

Country Status (6)

Country Link
US (1) US12196500B2 (https=)
JP (1) JP7404354B2 (https=)
KR (1) KR102547057B1 (https=)
CN (1) CN113811833B (https=)
TW (1) TWI742579B (https=)
WO (1) WO2020217800A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7596912B2 (ja) * 2021-04-27 2024-12-10 住友電気工業株式会社 熱交換器及びウエハ保持部材
TWI786621B (zh) * 2021-05-04 2022-12-11 緯創資通股份有限公司 熱循環裝置、檢測裝置及溫度控制方法
JP7493895B2 (ja) * 2021-08-20 2024-06-03 Ckd株式会社 温度制御システム
JP7725328B2 (ja) * 2021-10-14 2025-08-19 東京エレクトロン株式会社 支持装置、検査システム及び支持装置の制御方法
TW202346780A (zh) * 2022-03-30 2023-12-01 日商巴川製紙所股份有限公司 溫度均等化單元
JP2025043006A (ja) * 2023-09-15 2025-03-28 Ckd株式会社 蓄熱ユニット状態監視システム
WO2025074905A1 (ja) * 2023-10-03 2025-04-10 東京エレクトロン株式会社 基板支持アセンブリ、基板処理装置、及び基板処理方法
JP2025081992A (ja) * 2023-11-16 2025-05-28 株式会社荏原製作所 熱媒体供給装置
WO2026004602A1 (ja) * 2024-06-25 2026-01-02 東京エレクトロン株式会社 熱媒体制御装置および熱媒体の制御方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006038266A (ja) 2004-07-22 2006-02-09 Univ Of Tokushima 蓄熱装置
JP2011501429A (ja) 2007-10-18 2011-01-06 グローバル スタンダード テクノロジー カンパニー リミテッド 半導体製造装置の温度調節システム
JP2014063972A (ja) 2012-08-29 2014-04-10 Tokyo Electron Ltd プラズマエッチング装置及び制御方法
KR101936425B1 (ko) 2018-04-23 2019-01-08 주식회사 셀빛 급가열 및 급냉각을 위한 칠러 시스템
JP2019009433A (ja) 2017-06-26 2019-01-17 株式会社巴川製紙所 冷却部材

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Publication number Priority date Publication date Assignee Title
JPS5912439U (ja) 1982-07-13 1984-01-25 株式会社戸上電機製作所 開閉器の消弧装置
JPS61128043A (ja) * 1984-11-28 1986-06-16 Shinryo Air Conditioning Co Ltd 蓄熱回路を有する空気調和装置
JPH0331666A (ja) * 1989-06-28 1991-02-12 Matsushita Electric Ind Co Ltd ヒートポンプ式空気調和機
JPH1038401A (ja) * 1996-07-24 1998-02-13 Daikin Ind Ltd 蓄熱式冷凍装置
CN101558270B (zh) * 2006-12-27 2011-07-20 奥利安机械股份有限公司 对温度进行精密调整的装置
WO2009049096A1 (en) * 2007-10-09 2009-04-16 Advanced Thermal Sciences Corp. Thermal control system and method
JP2009250810A (ja) * 2008-04-07 2009-10-29 Seiko Epson Corp 電子部品の温度制御装置およびハンドラ装置
US20100263842A1 (en) * 2009-04-17 2010-10-21 General Electric Company Heat exchanger with surface-treated substrate
GB0919934D0 (en) * 2009-11-16 2009-12-30 Sunamp Ltd Energy storage systems
JP5912439B2 (ja) 2011-11-15 2016-04-27 東京エレクトロン株式会社 温度制御システム、半導体製造装置及び温度制御方法
JP5983187B2 (ja) * 2012-08-28 2016-08-31 株式会社デンソー 車両用熱管理システム
JP6437113B2 (ja) * 2015-05-26 2018-12-12 三菱電機株式会社 ヒートポンプ給湯システム
JP6520802B2 (ja) * 2016-04-19 2019-05-29 三菱電機株式会社 蓄熱システム
US11837479B2 (en) * 2016-05-05 2023-12-05 Applied Materials, Inc. Advanced temperature control for wafer carrier in plasma processing chamber
KR101750410B1 (ko) * 2016-11-30 2017-06-23 주식회사 티이애플리케이션 빙축열 시스템
CN108375248A (zh) * 2017-12-29 2018-08-07 青岛海尔空调器有限总公司 空调器系统
KR101940287B1 (ko) * 2018-02-08 2019-01-18 (주)테키스트 반도체 제조용 온도 조절 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006038266A (ja) 2004-07-22 2006-02-09 Univ Of Tokushima 蓄熱装置
JP2011501429A (ja) 2007-10-18 2011-01-06 グローバル スタンダード テクノロジー カンパニー リミテッド 半導体製造装置の温度調節システム
JP2014063972A (ja) 2012-08-29 2014-04-10 Tokyo Electron Ltd プラズマエッチング装置及び制御方法
JP2019009433A (ja) 2017-06-26 2019-01-17 株式会社巴川製紙所 冷却部材
KR101936425B1 (ko) 2018-04-23 2019-01-08 주식회사 셀빛 급가열 및 급냉각을 위한 칠러 시스템

Also Published As

Publication number Publication date
US20220187027A1 (en) 2022-06-16
CN113811833A (zh) 2021-12-17
KR20210143834A (ko) 2021-11-29
JPWO2020217800A1 (https=) 2020-10-29
WO2020217800A1 (ja) 2020-10-29
KR102547057B1 (ko) 2023-06-26
TWI742579B (zh) 2021-10-11
CN113811833B (zh) 2022-10-04
US12196500B2 (en) 2025-01-14
TW202043694A (zh) 2020-12-01

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