JP7371321B2 - 硬化性樹脂組成物、硬化物、およびプリント配線板 - Google Patents

硬化性樹脂組成物、硬化物、およびプリント配線板 Download PDF

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Publication number
JP7371321B2
JP7371321B2 JP2022511766A JP2022511766A JP7371321B2 JP 7371321 B2 JP7371321 B2 JP 7371321B2 JP 2022511766 A JP2022511766 A JP 2022511766A JP 2022511766 A JP2022511766 A JP 2022511766A JP 7371321 B2 JP7371321 B2 JP 7371321B2
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JP
Japan
Prior art keywords
resin composition
curable resin
cured product
epoxy resin
bisphenol
Prior art date
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JP2022511766A
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English (en)
Japanese (ja)
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JPWO2021200032A1 (https=
Inventor
康代 金沢
昇平 槇田
智崇 野口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
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Taiyo Holdings Co Ltd
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Publication date
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Publication of JPWO2021200032A1 publication Critical patent/JPWO2021200032A1/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/08—Epoxidised polymerised polyenes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
JP2022511766A 2020-03-31 2021-03-12 硬化性樹脂組成物、硬化物、およびプリント配線板 Active JP7371321B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020062179 2020-03-31
JP2020062179 2020-03-31
PCT/JP2021/010035 WO2021200032A1 (ja) 2020-03-31 2021-03-12 硬化性樹脂組成物、硬化物、およびプリント配線板

Publications (2)

Publication Number Publication Date
JPWO2021200032A1 JPWO2021200032A1 (https=) 2021-10-07
JP7371321B2 true JP7371321B2 (ja) 2023-10-31

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ID=77929226

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JP2022511766A Active JP7371321B2 (ja) 2020-03-31 2021-03-12 硬化性樹脂組成物、硬化物、およびプリント配線板

Country Status (5)

Country Link
JP (1) JP7371321B2 (https=)
KR (1) KR102832902B1 (https=)
CN (1) CN115380074B (https=)
TW (1) TWI872226B (https=)
WO (1) WO2021200032A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118139929A (zh) * 2021-10-22 2024-06-04 东洋纺株式会社 导电性组合物
JP2023174097A (ja) * 2022-05-27 2023-12-07 住友ベークライト株式会社 基板材料用樹脂組成物、および半導体装置

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001172822A (ja) 1999-12-17 2001-06-26 Asahi Kasei Corp 耐熱性に優れたポリウレタンウレア弾性繊維
JP2002517533A (ja) 1998-06-02 2002-06-18 バイエル アクチェンゲゼルシャフト ポリウレタン尿素、ポリウレタン尿素繊維、及びその製法
JP2002293882A (ja) 2001-03-30 2002-10-09 Taiyo Ink Mfg Ltd 光硬化性・熱硬化性樹脂組成物及びプリント配線板
JP2003261642A (ja) 2002-02-23 2003-09-19 Bayer Ag 容易に型から離すことができる軟質かつ低収縮の熱可塑性ポリウレタンエラストマーの製造方法
JP2008214413A (ja) 2007-03-01 2008-09-18 Toray Ind Inc 熱硬化性樹脂組成物
JP2013144861A (ja) 2011-12-16 2013-07-25 Toray Opelontex Co Ltd ポリウレタン弾性繊維およびその製造方法
JP2015121775A (ja) 2013-11-20 2015-07-02 四国化成工業株式会社 光硬化性・熱硬化性樹脂組成物およびプリント配線板
WO2016117237A1 (ja) 2015-01-21 2016-07-28 太陽インキ製造株式会社 熱硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP2018062606A (ja) 2016-10-14 2018-04-19 日立化成株式会社 アンダーフィル材、電子部品装置及び電子部品装置の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3189988B2 (ja) * 1992-07-07 2001-07-16 住友ベークライト株式会社 絶縁樹脂ペースト
JP5209888B2 (ja) * 2006-03-09 2013-06-12 昭和電工株式会社 熱硬化性樹脂組成物及びその用途
TW200908839A (en) 2007-08-09 2009-02-16 Nichigo Morton Co Ltd Solder mask, photoresist pattern forming method and the light-emitting device thereof
TWI466882B (zh) * 2009-09-29 2015-01-01 Fujifilm Corp 著色劑多聚體、著色硬化組成物、彩色濾光片及其製備方法
KR102305379B1 (ko) * 2013-11-25 2021-09-24 시코쿠가세이고교가부시키가이샤 작용기를 갖는 글리콜우릴류와 그의 이용

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002517533A (ja) 1998-06-02 2002-06-18 バイエル アクチェンゲゼルシャフト ポリウレタン尿素、ポリウレタン尿素繊維、及びその製法
JP2001172822A (ja) 1999-12-17 2001-06-26 Asahi Kasei Corp 耐熱性に優れたポリウレタンウレア弾性繊維
JP2002293882A (ja) 2001-03-30 2002-10-09 Taiyo Ink Mfg Ltd 光硬化性・熱硬化性樹脂組成物及びプリント配線板
JP2003261642A (ja) 2002-02-23 2003-09-19 Bayer Ag 容易に型から離すことができる軟質かつ低収縮の熱可塑性ポリウレタンエラストマーの製造方法
JP2008214413A (ja) 2007-03-01 2008-09-18 Toray Ind Inc 熱硬化性樹脂組成物
JP2013144861A (ja) 2011-12-16 2013-07-25 Toray Opelontex Co Ltd ポリウレタン弾性繊維およびその製造方法
JP2015121775A (ja) 2013-11-20 2015-07-02 四国化成工業株式会社 光硬化性・熱硬化性樹脂組成物およびプリント配線板
WO2016117237A1 (ja) 2015-01-21 2016-07-28 太陽インキ製造株式会社 熱硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP2018062606A (ja) 2016-10-14 2018-04-19 日立化成株式会社 アンダーフィル材、電子部品装置及び電子部品装置の製造方法

Also Published As

Publication number Publication date
WO2021200032A1 (ja) 2021-10-07
CN115380074A (zh) 2022-11-22
TW202202940A (zh) 2022-01-16
JPWO2021200032A1 (https=) 2021-10-07
KR20220140810A (ko) 2022-10-18
KR102832902B1 (ko) 2025-07-11
TWI872226B (zh) 2025-02-11
CN115380074B (zh) 2024-03-08

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