JP7365408B2 - 前面ダクト式機器フロントエンドモジュール、側面ストレージポッド、及びそれらの操作方法 - Google Patents

前面ダクト式機器フロントエンドモジュール、側面ストレージポッド、及びそれらの操作方法 Download PDF

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Publication number
JP7365408B2
JP7365408B2 JP2021521518A JP2021521518A JP7365408B2 JP 7365408 B2 JP7365408 B2 JP 7365408B2 JP 2021521518 A JP2021521518 A JP 2021521518A JP 2021521518 A JP2021521518 A JP 2021521518A JP 7365408 B2 JP7365408 B2 JP 7365408B2
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end module
side storage
equipment front
chamber
upper plenum
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Japanese (ja)
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JP2022505473A (ja
JP2022505473A5 (https=
JPWO2020086709A5 (https=
Inventor
ポール ビー． ロイター，
ロビン シー． アームストロング，
ジョン シー． メンク，
ニール メリー，
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Applied Materials Inc
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Applied Materials Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Ventilation (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Absorbent Articles And Supports Therefor (AREA)
JP2021521518A 2018-10-26 2019-10-23 前面ダクト式機器フロントエンドモジュール、側面ストレージポッド、及びそれらの操作方法 Active JP7365408B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201862751514P 2018-10-26 2018-10-26
US62/751,514 2018-10-26
US16/660,057 US11373891B2 (en) 2018-10-26 2019-10-22 Front-ducted equipment front end modules, side storage pods, and methods of operating the same
US16/660,057 2019-10-22
PCT/US2019/057650 WO2020086709A1 (en) 2018-10-26 2019-10-23 Front-ducted equipment front end modules, side storage pods, and methods of operating the same

Publications (4)

Publication Number Publication Date
JP2022505473A JP2022505473A (ja) 2022-01-14
JP2022505473A5 JP2022505473A5 (https=) 2022-08-19
JPWO2020086709A5 JPWO2020086709A5 (https=) 2022-08-19
JP7365408B2 true JP7365408B2 (ja) 2023-10-19

Family

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JP2021521518A Active JP7365408B2 (ja) 2018-10-26 2019-10-23 前面ダクト式機器フロントエンドモジュール、側面ストレージポッド、及びそれらの操作方法

Country Status (6)

Country Link
US (2) US11373891B2 (https=)
JP (1) JP7365408B2 (https=)
KR (1) KR102577683B1 (https=)
CN (1) CN112970099A (https=)
TW (2) TW202314930A (https=)
WO (1) WO2020086709A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11610794B2 (en) * 2018-10-26 2023-03-21 Applied Materials, Inc. Side storage pods, equipment front end modules, and methods for operating the same
US11244844B2 (en) * 2018-10-26 2022-02-08 Applied Materials, Inc. High flow velocity, gas-purged, side storage pod apparatus, assemblies, and methods
US11189511B2 (en) * 2018-10-26 2021-11-30 Applied Materials, Inc. Side storage pods, equipment front end modules, and methods for operating EFEMs
US11373891B2 (en) 2018-10-26 2022-06-28 Applied Materials, Inc. Front-ducted equipment front end modules, side storage pods, and methods of operating the same
KR102202463B1 (ko) * 2019-03-13 2021-01-14 세메스 주식회사 기판 처리 장치 및 방법
KR102208017B1 (ko) * 2019-08-14 2021-01-27 로체 시스템즈(주) 기판 반송 장치
US12076854B2 (en) * 2021-03-18 2024-09-03 Applied Materials, Inc. Increased number of load ports on factory interface with robot that moves on track
US12370573B2 (en) * 2021-10-06 2025-07-29 Applied Materials, Inc. Equipment front end modules with induced gas mixing, and methods of use thereof
KR102780011B1 (ko) * 2022-02-09 2025-03-12 주식회사 저스템 Efem의 버퍼 챔버 장치 및 이를 구비한 반도체 공정장치
KR102780012B1 (ko) * 2022-02-09 2025-03-12 주식회사 저스템 Efem의 버퍼 챔버 장치 및 이를 구비한 반도체 공정장치
KR102729958B1 (ko) * 2022-06-15 2024-11-13 세메스 주식회사 장비 전단부 모듈 및 이의 동작 방법, 이를 포함하는 기판 처리 장치
US20260096386A1 (en) * 2024-09-30 2026-04-02 Applied Materials, Inc. Load lock chamber improvement

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179519A (ja) 2002-11-28 2004-06-24 Tokyo Ohka Kogyo Co Ltd 基板処理装置
JP2008258188A (ja) 2007-03-30 2008-10-23 Tokyo Electron Ltd 基板処理装置、基板処理方法及び記憶媒体
JP2013118229A (ja) 2011-12-01 2013-06-13 Tokyo Electron Ltd 搬送装置及び基板処理システム
US20150107770A1 (en) 2013-10-18 2015-04-23 Samsung Electronics Co., Ltd. Side storage unit for removing fumes and manufacturing apparatus for semionductor devices having the same
JP2015531546A (ja) 2012-09-24 2015-11-02 ユ−ジーン テクノロジー カンパニー．リミテッド ヒューム除去装置及び基板処理装置
JP2016527732A (ja) 2013-08-12 2016-09-08 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ファクトリインターフェースの環境制御を伴う基板処理のシステム、装置、及び方法
WO2017022366A1 (ja) 2015-08-04 2017-02-09 株式会社日立国際電気 基板処理装置、半導体装置の製造方法および記録媒体
JP2017108112A (ja) 2015-10-12 2017-06-15 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 水平スロットの実装および／または移動シャワーヘッドを含む、ウエハー搬送マイクロクライメイト技法および装置
JP2018174259A (ja) 2017-03-31 2018-11-08 シンフォニアテクノロジー株式会社 ロボット搬送装置
JP2019161116A (ja) 2018-03-15 2019-09-19 シンフォニアテクノロジー株式会社 Ｅｆｅｍ

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9105673B2 (en) 2007-05-09 2015-08-11 Brooks Automation, Inc. Side opening unified pod
TW200948688A (en) 2007-12-18 2009-12-01 Entegris Inc Methods and apparatuses for controlling contamination of substrates
KR101951911B1 (ko) 2011-06-28 2019-02-25 다이나믹 마이크로시스템즈 세미컨덕터 이큅먼트 게엠베하 반도체 스토커 시스템들 및 방법들
KR101215962B1 (ko) 2012-07-30 2012-12-27 이프로링크텍(주) Ｅｆｅｍ의 버퍼 스토리지 박스
US9272315B2 (en) 2013-10-11 2016-03-01 Taiwan Semiconductor Manufacturing Co., Ltd Mechanisms for controlling gas flow in enclosure
TWI784799B (zh) 2013-12-13 2022-11-21 日商昕芙旎雅股份有限公司 設備前端模組（ｅｆｅｍ）系統
JP6349750B2 (ja) 2014-01-31 2018-07-04 シンフォニアテクノロジー株式会社 Ｅｆｅｍ
KR102162366B1 (ko) 2014-01-21 2020-10-06 우범제 퓸 제거 장치
US9847240B2 (en) 2014-02-12 2017-12-19 Axcelis Technologies, Inc. Constant mass flow multi-level coolant path electrostatic chuck
KR102418431B1 (ko) * 2014-10-24 2022-07-07 어플라이드 머티어리얼스, 인코포레이티드 팩토리 인터페이스에서 기판 캐리어를 퍼징하기 위한 시스템들, 장치, 및 방법들
US9881826B2 (en) 2014-10-24 2018-01-30 Lam Research Corporation Buffer station with single exit-flow direction
KR20210080633A (ko) 2014-11-25 2021-06-30 어플라이드 머티어리얼스, 인코포레이티드 기판 캐리어 및 퍼지 챔버 환경 제어들을 이용하는 기판 프로세싱 시스템들, 장치, 및 방법들
KR101637498B1 (ko) 2015-03-24 2016-07-07 피코앤테라(주) 웨이퍼 수납용기
JP6450653B2 (ja) * 2015-06-24 2019-01-09 東京エレクトロン株式会社 格納ユニット、搬送装置、及び、基板処理システム
TWI780030B (zh) 2015-10-05 2022-10-11 德商布魯克斯Ｃｃｓ有限公司 形成用於一半導體基板並具有低溼度值的一乾淨的環境的方法及系統
JP6555091B2 (ja) * 2015-11-10 2019-08-07 シンフォニアテクノロジー株式会社 ロボット搬送装置
JP6679906B2 (ja) 2015-12-11 2020-04-15 Tdk株式会社 Ｅｆｅｍ
JP6613864B2 (ja) * 2015-12-14 2019-12-04 Ｔｄｋ株式会社 ミニエンバイロメント装置
JP6851075B2 (ja) * 2016-09-15 2021-03-31 ユニチカ株式会社 成型用メッシュ織物の製造方法
KR20180045316A (ko) 2016-10-25 2018-05-04 삼성전자주식회사 설비 전방 단부 모듈 및 이를 포함하는 반도체 제조 장치
US10159169B2 (en) 2016-10-27 2018-12-18 Applied Materials, Inc. Flexible equipment front end module interfaces, environmentally-controlled equipment front end modules, and assembly methods
KR102618491B1 (ko) 2016-10-31 2023-12-28 삼성전자주식회사 기판 이송 장치
US10453727B2 (en) * 2016-11-10 2019-10-22 Applied Materials, Inc. Electronic device manufacturing load port apparatus, systems, and methods
KR102729711B1 (ko) 2016-12-23 2024-11-13 피코앤테라(주) 이에프이엠
US10446428B2 (en) * 2017-03-14 2019-10-15 Applied Materials, Inc. Load port operation in electronic device manufacturing apparatus, systems, and methods
US10566216B2 (en) 2017-06-09 2020-02-18 Lam Research Corporation Equipment front end module gas recirculation
US10388547B2 (en) 2017-06-23 2019-08-20 Applied Materials, Inc. Side storage pods, equipment front end modules, and methods for processing substrates
CN110770890B (zh) 2017-06-23 2023-09-08 应用材料公司 可索引侧储存仓设备、加热的侧储存仓设备、系统和方法
CN111316417B (zh) 2017-11-27 2023-12-22 阿斯莫Ip控股公司 与批式炉偕同使用的用于储存晶圆匣的储存装置
US10763134B2 (en) 2018-02-27 2020-09-01 Applied Materials, Inc. Substrate processing apparatus and methods with factory interface chamber filter purge
KR102100775B1 (ko) * 2018-03-14 2020-04-14 우범제 이에프이엠
JP7100243B2 (ja) * 2018-04-19 2022-07-13 シンフォニアテクノロジー株式会社 排気ノズルユニット、ロードポート、及びｅｆｅｍ
JP6583482B2 (ja) * 2018-05-24 2019-10-02 シンフォニアテクノロジー株式会社 Ｅｆｅｍ
KR102592920B1 (ko) * 2018-07-16 2023-10-23 삼성전자주식회사 로드락 모듈 및 이를 포함하는 반도체 제조 장치
US11189511B2 (en) 2018-10-26 2021-11-30 Applied Materials, Inc. Side storage pods, equipment front end modules, and methods for operating EFEMs
US11244844B2 (en) 2018-10-26 2022-02-08 Applied Materials, Inc. High flow velocity, gas-purged, side storage pod apparatus, assemblies, and methods
US11610794B2 (en) 2018-10-26 2023-03-21 Applied Materials, Inc. Side storage pods, equipment front end modules, and methods for operating the same
US11373891B2 (en) 2018-10-26 2022-06-28 Applied Materials, Inc. Front-ducted equipment front end modules, side storage pods, and methods of operating the same
US11749537B2 (en) 2018-10-26 2023-09-05 Applied Materials, Inc. Side storage pods, equipment front end modules, and methods for operating equipment front end modules
US11508593B2 (en) * 2018-10-26 2022-11-22 Applied Materials, Inc. Side storage pods, electronic device processing systems, and methods for operating the same

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179519A (ja) 2002-11-28 2004-06-24 Tokyo Ohka Kogyo Co Ltd 基板処理装置
JP2008258188A (ja) 2007-03-30 2008-10-23 Tokyo Electron Ltd 基板処理装置、基板処理方法及び記憶媒体
JP2013118229A (ja) 2011-12-01 2013-06-13 Tokyo Electron Ltd 搬送装置及び基板処理システム
JP2015531546A (ja) 2012-09-24 2015-11-02 ユ−ジーン テクノロジー カンパニー．リミテッド ヒューム除去装置及び基板処理装置
JP2016527732A (ja) 2013-08-12 2016-09-08 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ファクトリインターフェースの環境制御を伴う基板処理のシステム、装置、及び方法
US20150107770A1 (en) 2013-10-18 2015-04-23 Samsung Electronics Co., Ltd. Side storage unit for removing fumes and manufacturing apparatus for semionductor devices having the same
KR101682473B1 (ko) 2013-10-18 2016-12-05 삼성전자주식회사 사이드 스토리지 및 이를 구비하는 반도체 소자 제조 설비
WO2017022366A1 (ja) 2015-08-04 2017-02-09 株式会社日立国際電気 基板処理装置、半導体装置の製造方法および記録媒体
JP2017108112A (ja) 2015-10-12 2017-06-15 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 水平スロットの実装および／または移動シャワーヘッドを含む、ウエハー搬送マイクロクライメイト技法および装置
JP2018174259A (ja) 2017-03-31 2018-11-08 シンフォニアテクノロジー株式会社 ロボット搬送装置
JP2019161116A (ja) 2018-03-15 2019-09-19 シンフォニアテクノロジー株式会社 Ｅｆｅｍ

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Publication number Publication date
JP2022505473A (ja) 2022-01-14
CN112970099A (zh) 2021-06-15
US11373891B2 (en) 2022-06-28
WO2020086709A1 (en) 2020-04-30
WO2020086709A8 (en) 2021-06-03
TW202107600A (zh) 2021-02-16
US20220293444A1 (en) 2022-09-15
US20200135523A1 (en) 2020-04-30
KR102577683B1 (ko) 2023-09-11
TWI785279B (zh) 2022-12-01
TW202314930A (zh) 2023-04-01
KR20210068576A (ko) 2021-06-09

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