JP7359534B2 - electric compressor - Google Patents

Description

The present invention relates to an electric compressor.

Patent Document 1 proposes fixing a power board to a plurality of fixed seating surfaces with screws in an inverter accommodating portion of an electric compressor.

JP2009-114961A

In order to improve the vibration resistance of the board, it is possible to use a thick copper board to ensure bending rigidity. However, thick copper substrates are expensive, leading to increased costs.
An object of the present invention is to improve vibration resistance at low cost.

An electric compressor according to one aspect of the present invention includes:
Equipped with a board provided to drive and control the electric motor built into the compressor,
A plurality of capacitors each having a pedestal are surface-mounted on both sides of the board.

According to the present invention, since lands for surface mounting a plurality of capacitors are formed on both sides of the substrate, bending rigidity can be ensured by increasing the section modulus. Therefore, vibration resistance can be improved at a lower cost than when using a thick copper substrate.

It is an external view of a compressor. It is a figure showing a board. FIG. 3 is a cross-sectional view showing a state in which the substrate is accommodated.

Embodiments of the present invention will be described below based on the drawings. Note that each drawing is schematic and may differ from the actual drawing. Furthermore, the following embodiments are intended to exemplify devices and methods for embodying the technical idea of the present invention, and the configuration is not limited to the following. That is, the technical idea of the present invention can be modified in various ways within the technical scope described in the claims.

《One embodiment》
"composition"
FIG. 1 is an external view of the compressor.
The compressor 11 (electric compressor) is an electric scroll compressor used, for example, in a refrigerant circuit of a car air conditioner. That is, when mounted on a vehicle and driven by a built-in electric motor, it sucks in refrigerant, compresses it, and then discharges it.
An inverter housing portion 12 (housing) is integrally formed on the front side in the axial direction, and is sealed by a front cover 13 . A low voltage circuit connector 14 and a high voltage circuit connector 15 are provided on the outer wall of the inverter accommodating portion 12.

FIG. 2 is a diagram showing the substrate.
A board 21 on which an inverter for driving and controlling the electric motor is formed is housed inside the inverter accommodating portion 12 . The thickness of the substrate 21 is, for example, about 1.6 to 1.8 mm.
In the figure, (a) shows one surface of the substrate 21, (b) shows a side surface of the substrate 21, and (c) shows the other surface of the substrate 21. A plurality of capacitors 22 are surface mounted on one surface of the substrate 21. Here, an example is shown in which seven devices are mounted, and they are arranged closely. A plurality of capacitors 22 are surface mounted on the other surface of the substrate 21. Here, an example is shown in which 11 pieces are mounted, and they are densely arranged. The capacitor 22 constitutes a smoothing/filter circuit connected in parallel to the power supply line, and is, for example, an aluminum solid electrolytic capacitor. The capacitor 22 is arranged so that the mounting area on one side and the mounting area on the other side overlap in plan view.

FIG. 3 is a cross-sectional view showing a state in which the substrate is accommodated.
The board 21 is accommodated in the inverter accommodating portion 12 and fixed with screws. Lands 23 for surface mounting the capacitor 22 are formed on both sides of the substrate 21. Two lands 23 are provided for each capacitor 22. The capacitor 22 has a pedestal 24, and two terminals formed on the back surface of the pedestal 24 are soldered to corresponding lands 23. Since the capacitor 22 is arranged so that the mounting area on one side and the mounting area on the other side overlap, the lands 23 on one side and the lands 23 on the other side overlap. Therefore, at the position where the capacitor 22 is mounted, the thickness tb of the substrate 21 increases by the amount of two lands.

There is a partition wall 16 between the inverter accommodating portion 12 and the compressor 11, and the partition wall 16 on the compressor 11 side is a section into which the refrigerant flows. A buffer material 31 (first buffer material) is sandwiched in a compressed state between the capacitor 22 mounted on the surface of the substrate 21 closer to the compressor 11 and the partition wall 16 (casing). . A cushioning material 32 (second cushioning material) is sandwiched in a compressed state between the capacitor 22 mounted on the surface of the substrate 21 that is far from the compressor 11 and the front cover 13 (casing). There is. The cushioning materials 31 and 32 are made of gel having high thermal conductivity. The thickness t1 of the buffer material 31 is set to be thicker than the thickness t2 of the buffer material 32. The cushioning materials 31 and 32 also function as heat dissipation sheets. Since the capacitor 22 has an allowable load that can be pressed, the reaction force of the cushioning materials 31 and 32 is set to be less than the allowable load of the capacitor 22.

《Effect》
Next, the main effects of one embodiment will be explained.
In order to improve the vibration resistance of the board, it is possible to use a thick copper board to ensure bending rigidity. However, thick copper substrates are expensive, leading to increased costs.
Therefore, instead of using a thick copper substrate, a plurality of capacitors 22 each having a pedestal are surface-mounted on both sides of the substrate 21. Specifically, the capacitor 22 is arranged so that the mounting area on one surface overlaps the mounting area on the other surface in plan view. As a result, lands 23 for surface mounting a plurality of capacitors 22 are formed on both sides of the substrate 21, so that bending rigidity can be ensured by increasing the section modulus. Therefore, vibration resistance can be improved at a lower cost than when using a thick copper substrate.

Conventionally, there have been devices in which a capacitor is housed and a filter case cast with resin is provided on the board to provide anti-vibration measures.
In this embodiment, a cushioning material 31 is sandwiched between the capacitor 22 mounted on the surface of the substrate 21 closer to the compressor 11 and the partition wall 16. Further, a cushioning material 32 is sandwiched between the front cover 13 and the capacitor 22 mounted on the surface of the substrate 21 that is far from the compressor 11. Vibration resistance of the capacitor 22 can be ensured by these buffer materials 31 and 32. Further, since the structure is such that the cushioning materials 31 and 32 are simply sandwiched, the step of forming a filter case and casting resin can be omitted.

Further, the thickness t1 of the buffer material 31 is made thicker than the thickness t2 of the buffer material 32. Therefore, dimensional errors and assembly errors in the direction perpendicular to the plane of the substrate 21 can be absorbed mainly by the cushioning material 31. The buffer material 31 is cooled by the refrigerant across the partition wall 16, while the buffer material 32 is cooled by the outside air temperature across the front cover 13. Although the thinner the cushioning material is, the higher its heat dissipation performance is, but since the partition wall 16 has a higher cooling capacity than the front cover 13, the thickness t1 of the cushioning material 31 can be increased. Therefore, the capacitor 22 mounted on the surface of the substrate 21 closer to the compressor 11 and the capacitor 22 mounted on the surface of the substrate 21 farther from the compressor 11 have the same heat dissipation performance.

Although the embodiments have been described above with reference to a limited number of embodiments, the scope of rights is not limited thereto, and modifications of the embodiments based on the above disclosure will be obvious to those skilled in the art.

DESCRIPTION OF SYMBOLS 11... Compressor, 12... Inverter accommodating part, 13... Front cover, 14... Connector, 15... Connector, 16... Partition wall, 21... Board, 22... Capacitor, 23... Land, 24... Pedestal, 31... Cushioning material, 32 ...buffer material

Claims (1)

Equipped with a board provided to drive and control the electric motor built into the compressor,
A plurality of capacitors each having a pedestal are densely surface-mounted on both sides of the substrate, and lands for surface-mounting the capacitors are formed,
The capacitor is arranged so that a mounting area on one surface and a mounting area on the other surface overlap in plan view ,
a casing that is integrally formed with the compressor and in which the board is housed and fixed;
a first buffer material sandwiched between the capacitor mounted on the surface of the substrate closer to the compressor and the casing;
a second cushioning material sandwiched between the capacitor and the casing mounted on the surface of the substrate that is far from the compressor;
The electric compressor , wherein the first cushioning material is thicker than the second cushioning material .

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