JP7351434B2 - 熱硬化性樹脂組成物、誘電体基板、およびマイクロストリップアンテナ - Google Patents

熱硬化性樹脂組成物、誘電体基板、およびマイクロストリップアンテナ Download PDF

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JP7351434B2
JP7351434B2 JP2023509190A JP2023509190A JP7351434B2 JP 7351434 B2 JP7351434 B2 JP 7351434B2 JP 2023509190 A JP2023509190 A JP 2023509190A JP 2023509190 A JP2023509190 A JP 2023509190A JP 7351434 B2 JP7351434 B2 JP 7351434B2
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resin composition
thermosetting resin
curing agent
titanate
mass
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JPWO2022202804A1 (https=
JPWO2022202804A5 (https=
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俊次 木村
剛志 田中
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C08L67/03—Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the carboxyl- and the hydroxy groups directly linked to aromatic rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/16—Dielectric waveguides, i.e. without a longitudinal conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/08—Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Waveguide Aerials (AREA)
  • Waveguides (AREA)
  • Inorganic Insulating Materials (AREA)
JP2023509190A 2021-03-25 2022-03-22 熱硬化性樹脂組成物、誘電体基板、およびマイクロストリップアンテナ Active JP7351434B2 (ja)

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JP2021051748 2021-03-25
JP2021051748 2021-03-25
JP2021172197 2021-10-21
JP2021172197 2021-10-21
JP2021197720 2021-12-06
JP2021197731 2021-12-06
JP2021197731 2021-12-06
JP2021197667 2021-12-06
JP2021197667 2021-12-06
JP2021197669 2021-12-06
JP2021197679 2021-12-06
JP2021197720 2021-12-06
JP2021197679 2021-12-06
JP2021197669 2021-12-06
PCT/JP2022/013123 WO2022202804A1 (ja) 2021-03-25 2022-03-22 熱硬化性樹脂組成物、誘電体基板、およびマイクロストリップアンテナ

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JPWO2022202804A1 JPWO2022202804A1 (https=) 2022-09-29
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JP2023509190A Active JP7351434B2 (ja) 2021-03-25 2022-03-22 熱硬化性樹脂組成物、誘電体基板、およびマイクロストリップアンテナ
JP2023509181A Active JP7396534B2 (ja) 2021-03-25 2022-03-22 熱硬化性樹脂組成物、高周波デバイス、誘電体基板、およびマイクロストリップアンテナ
JP2023509187A Active JP7347713B2 (ja) 2021-03-25 2022-03-22 熱硬化性樹脂組成物、高周波デバイス、誘電体基板、およびマイクロストリップアンテナ
JP2023135283A Pending JP2023179419A (ja) 2021-03-25 2023-08-23 熱硬化性樹脂組成物、高周波デバイス、誘電体基板、およびマイクロストリップアンテナ
JP2023142704A Pending JP2023164926A (ja) 2021-03-25 2023-09-04 熱硬化性樹脂組成物、誘電体基板、およびマイクロストリップアンテナ
JP2023192059A Pending JP2024014929A (ja) 2021-03-25 2023-11-10 熱硬化性樹脂組成物、高周波デバイス、誘電体基板、およびマイクロストリップアンテナ

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JP2023509187A Active JP7347713B2 (ja) 2021-03-25 2022-03-22 熱硬化性樹脂組成物、高周波デバイス、誘電体基板、およびマイクロストリップアンテナ
JP2023135283A Pending JP2023179419A (ja) 2021-03-25 2023-08-23 熱硬化性樹脂組成物、高周波デバイス、誘電体基板、およびマイクロストリップアンテナ
JP2023142704A Pending JP2023164926A (ja) 2021-03-25 2023-09-04 熱硬化性樹脂組成物、誘電体基板、およびマイクロストリップアンテナ
JP2023192059A Pending JP2024014929A (ja) 2021-03-25 2023-11-10 熱硬化性樹脂組成物、高周波デバイス、誘電体基板、およびマイクロストリップアンテナ

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JP (6) JP7351434B2 (https=)
KR (3) KR20230160342A (https=)
TW (3) TW202248274A (https=)
WO (3) WO2022202792A1 (https=)

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WO2023145327A1 (ja) * 2022-01-26 2023-08-03 株式会社レゾナック 熱硬化性樹脂組成物、プリプレグ、樹脂フィルム、積層板、プリント配線板、アンテナ装置、アンテナモジュール及び通信装置
KR20260017499A (ko) * 2023-07-21 2026-02-05 가부시끼가이샤 레조낙 수지 조성물 및 전자 부품 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005038821A (ja) 2003-04-04 2005-02-10 Toray Ind Inc ペースト組成物およびこれを用いた誘電体組成物
CN103351578A (zh) 2013-07-19 2013-10-16 广东生益科技股份有限公司 一种用于形成天线用的介质基板的介质层的树脂组合物及其用途
US20150183987A1 (en) 2013-12-31 2015-07-02 Taiwan Union Technology Corporation Resin composition and uses of the same
JP6870778B1 (ja) 2020-12-11 2021-05-12 昭和電工マテリアルズ株式会社 成形用樹脂組成物及び電子部品装置

Family Cites Families (7)

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Publication number Priority date Publication date Assignee Title
JPH07241853A (ja) * 1994-03-08 1995-09-19 Kinugawa Rubber Ind Co Ltd 誘電加熱成形型
JP2004124066A (ja) * 2002-08-07 2004-04-22 Toray Ind Inc 高誘電体組成物
JP2004315653A (ja) 2003-04-16 2004-11-11 Hitachi Chem Co Ltd 樹脂組成物とその利用
JP2008106106A (ja) 2006-10-24 2008-05-08 Hitachi Chem Co Ltd 高誘電率樹脂組成物，プリプレグ及びプリント配線板用積層板
JP6066865B2 (ja) * 2013-08-15 2017-01-25 信越化学工業株式会社 高誘電率エポキシ樹脂組成物および半導体装置
JP2018041998A (ja) 2015-01-28 2018-03-15 日本化薬株式会社 アンテナ、およびアンテナを有する電子装置
JP7067576B2 (ja) 2020-02-21 2022-05-16 味の素株式会社 樹脂組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005038821A (ja) 2003-04-04 2005-02-10 Toray Ind Inc ペースト組成物およびこれを用いた誘電体組成物
CN103351578A (zh) 2013-07-19 2013-10-16 广东生益科技股份有限公司 一种用于形成天线用的介质基板的介质层的树脂组合物及其用途
US20150183987A1 (en) 2013-12-31 2015-07-02 Taiwan Union Technology Corporation Resin composition and uses of the same
JP6870778B1 (ja) 2020-12-11 2021-05-12 昭和電工マテリアルズ株式会社 成形用樹脂組成物及び電子部品装置

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JP2024014929A (ja) 2024-02-01
JP7347713B2 (ja) 2023-09-20
WO2022202792A1 (ja) 2022-09-29
WO2022202781A1 (ja) 2022-09-29
KR20230161473A (ko) 2023-11-27
JP7396534B2 (ja) 2023-12-12
JP2023164926A (ja) 2023-11-14
KR20230160869A (ko) 2023-11-24
TW202248340A (zh) 2022-12-16
WO2022202804A1 (ja) 2022-09-29
JPWO2022202792A1 (https=) 2022-09-29
KR20230160342A (ko) 2023-11-23
JPWO2022202781A1 (https=) 2022-09-29
TW202248273A (zh) 2022-12-16
JP2023179419A (ja) 2023-12-19
JPWO2022202804A1 (https=) 2022-09-29
TW202248274A (zh) 2022-12-16

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