JP7342956B2 - 純銅板 - Google Patents

純銅板 Download PDF

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Publication number
JP7342956B2
JP7342956B2 JP2021540094A JP2021540094A JP7342956B2 JP 7342956 B2 JP7342956 B2 JP 7342956B2 JP 2021540094 A JP2021540094 A JP 2021540094A JP 2021540094 A JP2021540094 A JP 2021540094A JP 7342956 B2 JP7342956 B2 JP 7342956B2
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JP
Japan
Prior art keywords
less
mass ppm
copper plate
pure copper
heat treatment
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JP2021540094A
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English (en)
Japanese (ja)
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JPWO2021177469A5 (https=
JPWO2021177469A1 (https=
Inventor
裕隆 松永
優樹 伊藤
広行 森
典久 飯田
基裕 日高
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
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Mitsubishi Materials Corp
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Publication date
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Publication of JPWO2021177469A1 publication Critical patent/JPWO2021177469A1/ja
Publication of JPWO2021177469A5 publication Critical patent/JPWO2021177469A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
JP2021540094A 2020-03-06 2021-03-08 純銅板 Active JP7342956B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020038770 2020-03-06
JP2020038770 2020-03-06
PCT/JP2021/008945 WO2021177469A1 (ja) 2020-03-06 2021-03-08 純銅板

Publications (3)

Publication Number Publication Date
JPWO2021177469A1 JPWO2021177469A1 (https=) 2021-09-10
JPWO2021177469A5 JPWO2021177469A5 (https=) 2023-03-20
JP7342956B2 true JP7342956B2 (ja) 2023-09-12

Family

ID=77614079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021540094A Active JP7342956B2 (ja) 2020-03-06 2021-03-08 純銅板

Country Status (7)

Country Link
US (1) US12331386B2 (https=)
EP (1) EP4116448A4 (https=)
JP (1) JP7342956B2 (https=)
KR (1) KR102927901B1 (https=)
CN (1) CN115210394B (https=)
TW (1) TWI870562B (https=)
WO (1) WO2021177469A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7342957B2 (ja) * 2020-03-06 2023-09-12 三菱マテリアル株式会社 純銅板、銅／セラミックス接合体、絶縁回路基板
JP2023134291A (ja) * 2022-03-14 2023-09-27 Ｄｏｗａメタルテック株式会社 銅－セラミックス接合基板およびその製造方法
WO2024024909A1 (ja) * 2022-07-29 2024-02-01 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
WO2024024899A1 (ja) * 2022-07-29 2024-02-01 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
JP7473066B2 (ja) * 2022-07-29 2024-04-23 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
JP7444323B2 (ja) * 2022-07-29 2024-03-06 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
WO2024024898A1 (ja) * 2022-07-29 2024-02-01 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
JP7444324B2 (ja) * 2022-07-29 2024-03-06 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
PL449757A1 (pl) * 2024-09-09 2026-03-16 Sieć Badawcza Łukasiewicz - Instytut Metali Nieżelaznych Stop Cu-Mg-Te do zastosowań zwłaszcza w przemyśle elektrycznym i elektrotechnicznym
CN120519734A (zh) * 2025-06-30 2025-08-22 宁波金田电材有限公司 一种高耐热高导电铜合金及其制备方法与应用

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000212660A (ja) 1999-01-18 2000-08-02 Nippon Mining & Metals Co Ltd フレキシブルプリント回路基板用圧延銅箔およびその製造方法
WO2010038642A1 (ja) 2008-09-30 2010-04-08 日鉱金属株式会社 高純度銅又は高純度銅合金スパッタリングターゲット、同スパッタリングターゲットの製造方法及び高純度銅又は高純度銅合金スパッタ膜
JP2016020516A (ja) 2012-09-27 2016-02-04 株式会社日立製作所 回転電機
JP2017071832A (ja) 2015-10-08 2017-04-13 三菱マテリアル株式会社 高純度銅スパッタリングターゲット材
JP2019183256A (ja) 2018-04-09 2019-10-24 三菱マテリアル株式会社 スパッタリングターゲット材

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JPS62282797A (ja) * 1986-05-29 1987-12-08 Dowa Mining Co Ltd セラミツクス−銅直接接合用銅材
JPH062058A (ja) 1992-06-23 1994-01-11 Furukawa Electric Co Ltd:The 結晶粒成長抑制無酸素銅
CN201139707Y (zh) * 2007-12-29 2008-10-29 张爱华 婴幼儿监护治疗床
CN102165080B (zh) * 2009-01-09 2013-08-21 三菱伸铜株式会社 高强度高导电铜合金轧制板及其制造方法
JP2010282797A (ja) 2009-06-03 2010-12-16 Honda Motor Co Ltd 燃料電池システムの制御方法
JP4516154B1 (ja) * 2009-12-23 2010-08-04 三菱伸銅株式会社 Ｃｕ−Ｍｇ−Ｐ系銅合金条材及びその製造方法
JP4792116B2 (ja) 2010-02-09 2011-10-12 三菱伸銅株式会社 純銅板の製造方法及び純銅板
JP4869415B2 (ja) 2010-02-09 2012-02-08 三菱伸銅株式会社 純銅板の製造方法及び純銅板
JP6464742B2 (ja) * 2014-12-26 2019-02-06 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用部品、端子及びバスバー
WO2017033694A1 (ja) 2015-08-24 2017-03-02 三菱マテリアル株式会社 高純度銅スパッタリングターゲット材
JP6680041B2 (ja) 2016-03-30 2020-04-15 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品、端子、及び、バスバー
JP6744174B2 (ja) 2016-08-12 2020-08-19 株式会社Ｓｈカッパープロダクツ 無酸素銅板、無酸素銅板の製造方法およびセラミック配線基板
KR102326618B1 (ko) * 2017-03-31 2021-11-16 후루카와 덴키 고교 가부시키가이샤 구리판 부착 절연 기판용 구리판재 및 그 제조 방법
JP7182251B2 (ja) 2018-09-03 2022-12-02 国立大学法人東京工業大学 二次電池及びそれを用いた充放電方法
CN110284025B (zh) * 2019-07-29 2020-12-25 江西省鹰潭铜产业工程技术研究中心 一种铝青铜材料及其制备方法
EP4067517A4 (en) 2019-11-29 2023-11-22 Mitsubishi Materials Corporation Copper alloy, copper alloy plastic-processed material, component for electronic and electric devices, terminal, bus bar, and heat dissipation substrate
KR102927900B1 (ko) * 2020-03-06 2026-02-13 미쓰비시 마테리알 가부시키가이샤 순구리판
JP7342957B2 (ja) * 2020-03-06 2023-09-12 三菱マテリアル株式会社 純銅板、銅／セラミックス接合体、絶縁回路基板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000212660A (ja) 1999-01-18 2000-08-02 Nippon Mining & Metals Co Ltd フレキシブルプリント回路基板用圧延銅箔およびその製造方法
WO2010038642A1 (ja) 2008-09-30 2010-04-08 日鉱金属株式会社 高純度銅又は高純度銅合金スパッタリングターゲット、同スパッタリングターゲットの製造方法及び高純度銅又は高純度銅合金スパッタ膜
JP2016020516A (ja) 2012-09-27 2016-02-04 株式会社日立製作所 回転電機
JP2017071832A (ja) 2015-10-08 2017-04-13 三菱マテリアル株式会社 高純度銅スパッタリングターゲット材
JP2019183256A (ja) 2018-04-09 2019-10-24 三菱マテリアル株式会社 スパッタリングターゲット材

Also Published As

Publication number Publication date
CN115210394A (zh) 2022-10-18
CN115210394B (zh) 2023-12-22
US12331386B2 (en) 2025-06-17
US20230112081A1 (en) 2023-04-13
TW202138575A (zh) 2021-10-16
KR20220149682A (ko) 2022-11-08
JPWO2021177469A1 (https=) 2021-09-10
WO2021177469A1 (ja) 2021-09-10
TWI870562B (zh) 2025-01-21
EP4116448A4 (en) 2024-03-27
EP4116448A1 (en) 2023-01-11
KR102927901B1 (ko) 2026-02-13

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