JP7341345B2 - 端子部材、集合体、半導体装置およびこれらの製造方法 - Google Patents

端子部材、集合体、半導体装置およびこれらの製造方法 Download PDF

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Publication number
JP7341345B2
JP7341345B2 JP2022533954A JP2022533954A JP7341345B2 JP 7341345 B2 JP7341345 B2 JP 7341345B2 JP 2022533954 A JP2022533954 A JP 2022533954A JP 2022533954 A JP2022533954 A JP 2022533954A JP 7341345 B2 JP7341345 B2 JP 7341345B2
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Japan
Prior art keywords
terminal member
main surface
annular protrusion
protrusion
terminal
Prior art date
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Active
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JP2022533954A
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English (en)
Japanese (ja)
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JPWO2022004589A5 (https=
JPWO2022004589A1 (https=
Inventor
崇▲発▼ ▲謝▼
隆一 石井
貴夫 三井
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/631—Shapes of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/631—Shapes of strap connectors
    • H10W72/634—Cross-sectional shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
JP2022533954A 2020-06-30 2021-06-25 端子部材、集合体、半導体装置およびこれらの製造方法 Active JP7341345B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020112651 2020-06-30
JP2020112651 2020-06-30
PCT/JP2021/024120 WO2022004589A1 (ja) 2020-06-30 2021-06-25 端子部材、集合体、半導体装置およびこれらの製造方法

Publications (3)

Publication Number Publication Date
JPWO2022004589A1 JPWO2022004589A1 (https=) 2022-01-06
JPWO2022004589A5 JPWO2022004589A5 (https=) 2023-02-14
JP7341345B2 true JP7341345B2 (ja) 2023-09-08

Family

ID=79316067

Family Applications (1)

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JP2022533954A Active JP7341345B2 (ja) 2020-06-30 2021-06-25 端子部材、集合体、半導体装置およびこれらの製造方法

Country Status (4)

Country Link
US (1) US12555968B2 (https=)
JP (1) JP7341345B2 (https=)
CN (1) CN115769370A (https=)
WO (1) WO2022004589A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004303869A (ja) 2003-03-31 2004-10-28 Denso Corp 半導体装置およびその製造方法
JP2010010173A (ja) 2008-06-24 2010-01-14 Denso Corp 電子装置およびその製造方法
JP2013131735A (ja) 2011-11-25 2013-07-04 Mitsubishi Electric Corp 接合方法および半導体装置の製造方法
CN204144243U (zh) 2014-10-17 2015-02-04 常州银河世纪微电子有限公司 一种贴片式二极管的结构
KR101631232B1 (ko) 2014-12-15 2016-06-27 제엠제코(주) 클립을 이용한 적층 패키지
JP2017191857A (ja) 2016-04-13 2017-10-19 株式会社デンソー 電子装置及びその製造方法
WO2017203650A1 (ja) 2016-05-26 2017-11-30 三菱電機株式会社 電力用半導体装置
WO2018207856A1 (ja) 2017-05-10 2018-11-15 ローム株式会社 パワー半導体装置およびその製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0812891B2 (ja) 1992-03-17 1996-02-07 東洋産業株式会社 半田片付きダイオード用リードピンおよびその製造方法
US5508561A (en) 1993-11-15 1996-04-16 Nec Corporation Apparatus for forming a double-bump structure used for flip-chip mounting
JPH07142488A (ja) 1993-11-15 1995-06-02 Nec Corp バンプ構造及びその製造方法並びにフリップチップ実装 構造
JP2004507111A (ja) * 2000-08-18 2004-03-04 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 半導体デバイス及び支持基板の製造方法並びに前記方法によって得られる半導体デバイス
JP2006286977A (ja) * 2005-03-31 2006-10-19 Eudyna Devices Inc 半導体装置およびその製造方法並びに金属部材および金属部材の製造方法。
US8513784B2 (en) * 2010-03-18 2013-08-20 Alpha & Omega Semiconductor Incorporated Multi-layer lead frame package and method of fabrication
US8987879B2 (en) * 2011-07-06 2015-03-24 Infineon Technologies Ag Semiconductor device including a contact clip having protrusions and manufacturing thereof
CN103534796B (zh) * 2011-08-10 2016-06-01 富士电机株式会社 半导体装置和半导体装置的制造方法
JP2016099127A (ja) * 2014-11-18 2016-05-30 富士電機株式会社 パワー半導体モジュールの製造方法及びその中間組立ユニット
CN109478521B (zh) * 2016-07-26 2022-10-11 三菱电机株式会社 半导体装置
WO2019167102A1 (ja) 2018-02-27 2019-09-06 新電元工業株式会社 半導体装置及び半導体装置の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004303869A (ja) 2003-03-31 2004-10-28 Denso Corp 半導体装置およびその製造方法
JP2010010173A (ja) 2008-06-24 2010-01-14 Denso Corp 電子装置およびその製造方法
JP2013131735A (ja) 2011-11-25 2013-07-04 Mitsubishi Electric Corp 接合方法および半導体装置の製造方法
CN204144243U (zh) 2014-10-17 2015-02-04 常州银河世纪微电子有限公司 一种贴片式二极管的结构
KR101631232B1 (ko) 2014-12-15 2016-06-27 제엠제코(주) 클립을 이용한 적층 패키지
JP2017191857A (ja) 2016-04-13 2017-10-19 株式会社デンソー 電子装置及びその製造方法
WO2017203650A1 (ja) 2016-05-26 2017-11-30 三菱電機株式会社 電力用半導体装置
WO2018207856A1 (ja) 2017-05-10 2018-11-15 ローム株式会社 パワー半導体装置およびその製造方法

Also Published As

Publication number Publication date
WO2022004589A1 (ja) 2022-01-06
US12555968B2 (en) 2026-02-17
CN115769370A (zh) 2023-03-07
JPWO2022004589A1 (https=) 2022-01-06
US20230187339A1 (en) 2023-06-15

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