JP7313127B2 - 撮像装置、レーザ加工装置、及び、撮像方法 - Google Patents
撮像装置、レーザ加工装置、及び、撮像方法 Download PDFInfo
- Publication number
- JP7313127B2 JP7313127B2 JP2018189026A JP2018189026A JP7313127B2 JP 7313127 B2 JP7313127 B2 JP 7313127B2 JP 2018189026 A JP2018189026 A JP 2018189026A JP 2018189026 A JP2018189026 A JP 2018189026A JP 7313127 B2 JP7313127 B2 JP 7313127B2
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- JP
- Japan
- Prior art keywords
- imaging
- unit
- laser
- line
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018189026A JP7313127B2 (ja) | 2018-10-04 | 2018-10-04 | 撮像装置、レーザ加工装置、及び、撮像方法 |
CN201980065099.4A CN112770866B (zh) | 2018-10-04 | 2019-10-02 | 摄像装置、激光加工装置和摄像方法 |
KR1020217011484A KR102697247B1 (ko) | 2018-10-04 | 2019-10-02 | 촬상 장치, 레이저 가공 장치, 및 촬상 방법 |
PCT/JP2019/038993 WO2020071449A1 (ja) | 2018-10-04 | 2019-10-02 | 撮像装置、レーザ加工装置、及び、撮像方法 |
TW108135830A TW202024715A (zh) | 2018-10-04 | 2019-10-03 | 攝像裝置,雷射加工裝置,以及攝像方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018189026A JP7313127B2 (ja) | 2018-10-04 | 2018-10-04 | 撮像装置、レーザ加工装置、及び、撮像方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020055028A JP2020055028A (ja) | 2020-04-09 |
JP7313127B2 true JP7313127B2 (ja) | 2023-07-24 |
Family
ID=70055224
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018189026A Active JP7313127B2 (ja) | 2018-10-04 | 2018-10-04 | 撮像装置、レーザ加工装置、及び、撮像方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7313127B2 (zh) |
CN (1) | CN112770866B (zh) |
TW (1) | TW202024715A (zh) |
WO (1) | WO2020071449A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2023074588A1 (zh) * | 2021-10-29 | 2023-05-04 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070155131A1 (en) | 2005-12-21 | 2007-07-05 | Intel Corporation | Method of singulating a microelectronic wafer |
JP2008100258A (ja) | 2006-10-19 | 2008-05-01 | Disco Abrasive Syst Ltd | レーザー加工装置 |
JP2011233641A (ja) | 2010-04-26 | 2011-11-17 | Disco Abrasive Syst Ltd | 板状物のレーザー加工方法 |
JP2012084746A (ja) | 2010-10-13 | 2012-04-26 | Disco Abrasive Syst Ltd | 多層セラミックス基板の分割方法 |
JP2015050226A (ja) | 2013-08-30 | 2015-03-16 | 株式会社ディスコ | ウェーハの加工方法 |
JP2015085347A (ja) | 2013-10-29 | 2015-05-07 | 株式会社ディスコ | レーザー加工装置 |
WO2017030039A1 (ja) | 2015-08-18 | 2017-02-23 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5641835B2 (ja) * | 2010-09-10 | 2014-12-17 | 株式会社ディスコ | 分割方法 |
-
2018
- 2018-10-04 JP JP2018189026A patent/JP7313127B2/ja active Active
-
2019
- 2019-10-02 CN CN201980065099.4A patent/CN112770866B/zh active Active
- 2019-10-02 WO PCT/JP2019/038993 patent/WO2020071449A1/ja active Application Filing
- 2019-10-03 TW TW108135830A patent/TW202024715A/zh unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070155131A1 (en) | 2005-12-21 | 2007-07-05 | Intel Corporation | Method of singulating a microelectronic wafer |
JP2008100258A (ja) | 2006-10-19 | 2008-05-01 | Disco Abrasive Syst Ltd | レーザー加工装置 |
JP2011233641A (ja) | 2010-04-26 | 2011-11-17 | Disco Abrasive Syst Ltd | 板状物のレーザー加工方法 |
JP2012084746A (ja) | 2010-10-13 | 2012-04-26 | Disco Abrasive Syst Ltd | 多層セラミックス基板の分割方法 |
JP2015050226A (ja) | 2013-08-30 | 2015-03-16 | 株式会社ディスコ | ウェーハの加工方法 |
JP2015085347A (ja) | 2013-10-29 | 2015-05-07 | 株式会社ディスコ | レーザー加工装置 |
WO2017030039A1 (ja) | 2015-08-18 | 2017-02-23 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
Also Published As
Publication number | Publication date |
---|---|
TW202024715A (zh) | 2020-07-01 |
CN112770866A (zh) | 2021-05-07 |
WO2020071449A1 (ja) | 2020-04-09 |
JP2020055028A (ja) | 2020-04-09 |
KR20210066846A (ko) | 2021-06-07 |
CN112770866B (zh) | 2023-08-08 |
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