JP7300069B2 - 接合体、保持装置、および、静電チャック - Google Patents

接合体、保持装置、および、静電チャック Download PDF

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Publication number
JP7300069B2
JP7300069B2 JP2022543306A JP2022543306A JP7300069B2 JP 7300069 B2 JP7300069 B2 JP 7300069B2 JP 2022543306 A JP2022543306 A JP 2022543306A JP 2022543306 A JP2022543306 A JP 2022543306A JP 7300069 B2 JP7300069 B2 JP 7300069B2
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Japan
Prior art keywords
metal layer
hole
metal
electrostatic chuck
holes
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JP2022543306A
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English (en)
Japanese (ja)
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JPWO2022038898A1 (https=
Inventor
修 吉本
竜一 荒川
智雄 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/366—Aluminium nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/403—Refractory metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/59—Aspects relating to the structure of the interlayer
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/59—Aspects relating to the structure of the interlayer
    • C04B2237/597—Aspects relating to the structure of the interlayer whereby the interlayer is continuous but porous, e.g. containing hollow or porous particles, macro- or micropores or cracks
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/62—Forming laminates or joined articles comprising holes, channels or other types of openings
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/76—Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc
    • C04B2237/765—Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc at least one member being a tube

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Ceramic Products (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
JP2022543306A 2020-08-21 2021-06-25 接合体、保持装置、および、静電チャック Active JP7300069B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020139760 2020-08-21
JP2020139760 2020-08-21
PCT/JP2021/024111 WO2022038898A1 (ja) 2020-08-21 2021-06-25 接合体、保持装置、および、静電チャック

Publications (2)

Publication Number Publication Date
JPWO2022038898A1 JPWO2022038898A1 (https=) 2022-02-24
JP7300069B2 true JP7300069B2 (ja) 2023-06-28

Family

ID=80350311

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022543306A Active JP7300069B2 (ja) 2020-08-21 2021-06-25 接合体、保持装置、および、静電チャック

Country Status (6)

Country Link
US (1) US20230303457A1 (https=)
JP (1) JP7300069B2 (https=)
KR (1) KR102814220B1 (https=)
CN (1) CN115066408B (https=)
TW (1) TWI798730B (https=)
WO (1) WO2022038898A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2025220065A1 (https=) * 2024-04-15 2025-10-23

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021261284A1 (ja) * 2020-06-26 2021-12-30 日本特殊陶業株式会社 接合体、および静電チャック

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004050267A (ja) 2002-07-23 2004-02-19 Ngk Insulators Ltd 接合体の製造方法および接合体
JP2007331026A (ja) 2006-06-19 2007-12-27 Nhk Spring Co Ltd 接合体及び接合用ろう材
JP2017033983A (ja) 2015-07-29 2017-02-09 京セラ株式会社 試料保持具
JP2018006737A (ja) 2016-06-28 2018-01-11 日本特殊陶業株式会社 保持装置および保持装置の製造方法
WO2018230446A1 (ja) 2017-06-13 2018-12-20 日本碍子株式会社 半導体製造装置用部材
JP2020109806A (ja) 2019-01-07 2020-07-16 京セラ株式会社 試料保持具

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59156976A (ja) * 1983-02-25 1984-09-06 臼井国際産業株式会社 金属部材とセラミツク部材との結合体及びその結合方法
JP3485390B2 (ja) 1995-07-28 2004-01-13 京セラ株式会社 静電チャック
US6490146B2 (en) * 1999-05-07 2002-12-03 Applied Materials Inc. Electrostatic chuck bonded to base with a bond layer and method
DE60326599D1 (de) * 2002-09-06 2009-04-23 Ork Corp Metallbalgrohr, verfahren zur herstellung desselben und flexibles rohr für hochdruckfluid
US8956459B2 (en) * 2005-02-23 2015-02-17 Kyocera Corporation Joined assembly, wafer holding assembly, attaching structure thereof and method for processing wafer
US7709099B2 (en) * 2005-07-04 2010-05-04 Kyocera Corporation Bonded body, wafer support member using the same, and wafer treatment method
US11715652B2 (en) * 2018-09-28 2023-08-01 Ngk Insulators, Ltd. Member for semiconductor manufacturing apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004050267A (ja) 2002-07-23 2004-02-19 Ngk Insulators Ltd 接合体の製造方法および接合体
JP2007331026A (ja) 2006-06-19 2007-12-27 Nhk Spring Co Ltd 接合体及び接合用ろう材
JP2017033983A (ja) 2015-07-29 2017-02-09 京セラ株式会社 試料保持具
JP2018006737A (ja) 2016-06-28 2018-01-11 日本特殊陶業株式会社 保持装置および保持装置の製造方法
WO2018230446A1 (ja) 2017-06-13 2018-12-20 日本碍子株式会社 半導体製造装置用部材
JP2020109806A (ja) 2019-01-07 2020-07-16 京セラ株式会社 試料保持具

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2025220065A1 (https=) * 2024-04-15 2025-10-23

Also Published As

Publication number Publication date
KR20220124252A (ko) 2022-09-13
WO2022038898A1 (ja) 2022-02-24
KR102814220B1 (ko) 2025-05-28
CN115066408A (zh) 2022-09-16
TWI798730B (zh) 2023-04-11
US20230303457A1 (en) 2023-09-28
JPWO2022038898A1 (https=) 2022-02-24
CN115066408B (zh) 2023-12-05
TW202226438A (zh) 2022-07-01

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