JP7279158B2 - 側部収納ポッド、電子デバイス処理システムおよびその操作方法 - Google Patents

側部収納ポッド、電子デバイス処理システムおよびその操作方法 Download PDF

Info

Publication number
JP7279158B2
JP7279158B2 JP2021521401A JP2021521401A JP7279158B2 JP 7279158 B2 JP7279158 B2 JP 7279158B2 JP 2021521401 A JP2021521401 A JP 2021521401A JP 2021521401 A JP2021521401 A JP 2021521401A JP 7279158 B2 JP7279158 B2 JP 7279158B2
Authority
JP
Japan
Prior art keywords
chamber
opening
exhaust
substrate holder
efem
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021521401A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022505397A5 (https=
JP2022505397A (ja
JPWO2020086710A5 (https=
Inventor
ポール ビー． ロイター，
ディーン シー． フルゼク，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2022505397A publication Critical patent/JP2022505397A/ja
Publication of JP2022505397A5 publication Critical patent/JP2022505397A5/ja
Publication of JPWO2020086710A5 publication Critical patent/JPWO2020086710A5/ja
Application granted granted Critical
Publication of JP7279158B2 publication Critical patent/JP7279158B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/14—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/02—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/18—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] characterised by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1921—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2253/00—Adsorbents used in seperation treatment of gases and vapours
    • B01D2253/10—Inorganic adsorbents
    • B01D2253/102—Carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2257/00—Components to be removed
    • B01D2257/20—Halogens or halogen compounds
    • B01D2257/202—Single element halogens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2257/00—Components to be removed
    • B01D2257/20—Halogens or halogen compounds
    • B01D2257/204—Inorganic halogen compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2257/00—Components to be removed
    • B01D2257/40—Nitrogen compounds
    • B01D2257/404—Nitrogen oxides other than dinitrogen oxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2257/00—Components to be removed
    • B01D2257/40—Nitrogen compounds
    • B01D2257/406—Ammonia
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2021521401A 2018-10-26 2019-10-23 側部収納ポッド、電子デバイス処理システムおよびその操作方法 Active JP7279158B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201862751526P 2018-10-26 2018-10-26
US62/751,526 2018-10-26
US16/657,787 2019-10-18
US16/657,787 US11508593B2 (en) 2018-10-26 2019-10-18 Side storage pods, electronic device processing systems, and methods for operating the same
PCT/US2019/057651 WO2020086710A1 (en) 2018-10-26 2019-10-23 Side storage pods, electronic device processing systems, and methods for operating the same

Publications (4)

Publication Number Publication Date
JP2022505397A JP2022505397A (ja) 2022-01-14
JP2022505397A5 JP2022505397A5 (https=) 2023-02-02
JPWO2020086710A5 JPWO2020086710A5 (https=) 2023-02-02
JP7279158B2 true JP7279158B2 (ja) 2023-05-22

Family

ID=70327366

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021521401A Active JP7279158B2 (ja) 2018-10-26 2019-10-23 側部収納ポッド、電子デバイス処理システムおよびその操作方法

Country Status (6)

Country Link
US (2) US11508593B2 (https=)
JP (1) JP7279158B2 (https=)
KR (1) KR102531097B1 (https=)
CN (1) CN112970098B (https=)
TW (1) TWI799658B (https=)
WO (1) WO2020086710A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11508593B2 (en) * 2018-10-26 2022-11-22 Applied Materials, Inc. Side storage pods, electronic device processing systems, and methods for operating the same
US11244844B2 (en) 2018-10-26 2022-02-08 Applied Materials, Inc. High flow velocity, gas-purged, side storage pod apparatus, assemblies, and methods
US11373891B2 (en) * 2018-10-26 2022-06-28 Applied Materials, Inc. Front-ducted equipment front end modules, side storage pods, and methods of operating the same
KR102202463B1 (ko) * 2019-03-13 2021-01-14 세메스 주식회사 기판 처리 장치 및 방법
US20220310412A1 (en) * 2021-03-23 2022-09-29 Rorze Technology Incorporated Gas circulation structure of equipment front end module (efem)
US20230062038A1 (en) * 2021-08-30 2023-03-02 Taiwan Semiconductor Manufacturing Company Limited Vent port diffuser
TWI823271B (zh) * 2022-02-24 2023-11-21 天虹科技股份有限公司 基板傳送方法
KR102729958B1 (ko) * 2022-06-15 2024-11-13 세메스 주식회사 장비 전단부 모듈 및 이의 동작 방법, 이를 포함하는 기판 처리 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015531546A (ja) 2012-09-24 2015-11-02 ユ−ジーン テクノロジー カンパニー．リミテッド ヒューム除去装置及び基板処理装置
JP2017504218A (ja) 2014-01-21 2017-02-02 ボムジェ ウ ヒューム除去装置
EP3291289A1 (en) 2016-08-30 2018-03-07 Brooks Automation (Germany) GmbH Reticle compartment and diffusor plate

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2016356C1 (ru) * 1991-09-24 1994-07-15 Инженерный центр "Плазмодинамика" Способ защиты сверхчистых поверхностей и устройство для создания потока защитной среды
US6415736B1 (en) * 1999-06-30 2002-07-09 Lam Research Corporation Gas distribution apparatus for semiconductor processing
US6318945B1 (en) * 1999-07-28 2001-11-20 Brooks Automation, Inc. Substrate processing apparatus with vertically stacked load lock and substrate transport robot
JP4763922B2 (ja) * 2001-06-25 2011-08-31 株式会社神戸製鋼所 成膜装置及び成膜装置での汚染防止方法
JP2005079250A (ja) * 2003-08-29 2005-03-24 Hitachi Kokusai Electric Inc 基板処理装置
JP2006245365A (ja) * 2005-03-04 2006-09-14 Hitachi High-Technologies Corp 真空処理装置
JP2009087972A (ja) 2007-09-27 2009-04-23 Tokyo Electron Ltd 基板収容機構及び半導体製造装置
JP2010087169A (ja) * 2008-09-30 2010-04-15 Tokyo Electron Ltd 気化器およびそれを用いた成膜装置
JP2011061155A (ja) * 2009-09-14 2011-03-24 Hitachi Kokusai Electric Inc 基板処理装置及び基板の搬送方法、並びに半導体装置の製造方法
KR101090350B1 (ko) * 2011-02-07 2011-12-07 우범제 퓸 제거장치 및 이를 이용한 반도체 제조장치
KR101215962B1 (ko) 2012-07-30 2012-12-27 이프로링크텍(주) Ｅｆｅｍ의 버퍼 스토리지 박스
US20140261803A1 (en) * 2013-03-15 2014-09-18 Lam Research Corporation High strip rate downstream chamber
KR101682473B1 (ko) 2013-10-18 2016-12-05 삼성전자주식회사 사이드 스토리지 및 이를 구비하는 반도체 소자 제조 설비
TWI784799B (zh) * 2013-12-13 2022-11-21 日商昕芙旎雅股份有限公司 設備前端模組（ｅｆｅｍ）系統
US9881826B2 (en) * 2014-10-24 2018-01-30 Lam Research Corporation Buffer station with single exit-flow direction
US9711353B2 (en) * 2015-02-13 2017-07-18 Panasonic Corporation Method for manufacturing compound semiconductor epitaxial substrates including heating of carrier gas
KR101637498B1 (ko) * 2015-03-24 2016-07-07 피코앤테라(주) 웨이퍼 수납용기
JP6431440B2 (ja) 2015-05-27 2018-11-28 信越ポリマー株式会社 基板収納容器
JP6450653B2 (ja) * 2015-06-24 2019-01-09 東京エレクトロン株式会社 格納ユニット、搬送装置、及び、基板処理システム
KR20180045316A (ko) * 2016-10-25 2018-05-04 삼성전자주식회사 설비 전방 단부 모듈 및 이를 포함하는 반도체 제조 장치
US10159169B2 (en) * 2016-10-27 2018-12-18 Applied Materials, Inc. Flexible equipment front end module interfaces, environmentally-controlled equipment front end modules, and assembly methods
KR102729711B1 (ko) 2016-12-23 2024-11-13 피코앤테라(주) 이에프이엠
CN110770890B (zh) * 2017-06-23 2023-09-08 应用材料公司 可索引侧储存仓设备、加热的侧储存仓设备、系统和方法
US10388547B2 (en) * 2017-06-23 2019-08-20 Applied Materials, Inc. Side storage pods, equipment front end modules, and methods for processing substrates
US11508593B2 (en) * 2018-10-26 2022-11-22 Applied Materials, Inc. Side storage pods, electronic device processing systems, and methods for operating the same
JP2020161544A (ja) * 2019-03-25 2020-10-01 住友金属鉱山株式会社 成膜装置および成膜方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015531546A (ja) 2012-09-24 2015-11-02 ユ−ジーン テクノロジー カンパニー．リミテッド ヒューム除去装置及び基板処理装置
JP2017504218A (ja) 2014-01-21 2017-02-02 ボムジェ ウ ヒューム除去装置
EP3291289A1 (en) 2016-08-30 2018-03-07 Brooks Automation (Germany) GmbH Reticle compartment and diffusor plate

Also Published As

Publication number Publication date
CN112970098B (zh) 2024-04-19
JP2022505397A (ja) 2022-01-14
TW202034433A (zh) 2020-09-16
CN112970098A (zh) 2021-06-15
WO2020086710A1 (en) 2020-04-30
US20200135522A1 (en) 2020-04-30
US11791185B2 (en) 2023-10-17
TWI799658B (zh) 2023-04-21
KR102531097B1 (ko) 2023-05-09
US11508593B2 (en) 2022-11-22
KR20210066938A (ko) 2021-06-07
US20230073921A1 (en) 2023-03-09

Similar Documents

Publication Publication Date Title
JP7279158B2 (ja) 側部収納ポッド、電子デバイス処理システムおよびその操作方法
US20220293444A1 (en) Front-ducted equipment front end modules, side storage pods, and methods of operating the same
US11610794B2 (en) Side storage pods, equipment front end modules, and methods for operating the same
US11640915B2 (en) Side storage pods, equipment front end modules, and methods for operating EFEMs
TWI778299B (zh) 高流速的、氣體吹掃的側儲存盒裝置、組件、及方法
US11749537B2 (en) Side storage pods, equipment front end modules, and methods for operating equipment front end modules

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20221024

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20221024

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230125

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20230125

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230411

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230510

R150 Certificate of patent or registration of utility model

Ref document number: 7279158

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150